Core Viewpoint - The article highlights the return of entrepreneur Cheng Shengpeng to his hometown of Tianmen, where he established Hubei Zhongsi Micro Optoelectronics Co., Ltd., focusing on semiconductor packaging, particularly in the MiniLED sector, leveraging his extensive experience and technological expertise gained over the years [3][4]. Company Development - Cheng Shengpeng, born in Tianmen, transitioned from a government job to entrepreneurship, founding Zhongshan Liti Optoelectronics Technology Co., Ltd. in 2013, which became one of the first companies in China to achieve large-scale production of Chip Scale Package (CSP) [3][5]. - After the acquisition of his previous company by a listed firm in 2019, he founded Guangdong Zhongsi Micro Optoelectronics in 2021, achieving significant technological advancements in the MiniLED field [3][4]. Investment and Production Capacity - In 2023, the company invested 5 billion yuan to establish a new facility in Tianmen, aiming to create a world-class semiconductor packaging base [3][5]. - The first production line was operational within 90 days, showcasing the efficiency of local government support and infrastructure readiness [5][6]. - The facility is projected to have a monthly production capacity of 200 million CSP chips and 2 million meters of MiniLED flexible light strips by the end of 2024, with an annual production capacity of 50 billion chips and a projected output value of 1 billion yuan [6]. Industry Context - The semiconductor packaging sector is identified as a critical component of the "light-chip-screen-end-network" industrial cluster being developed in Hubei, with Tianmen positioned strategically within the Wuhan "one-hour economic circle" [4][5]. - The local electronic industry foundation and complete supply chain are highlighted as significant advantages for the company's operations [5].