Core Insights - The article emphasizes the emergence of 3D IC technology as a crucial development direction in the integrated circuit industry, addressing the limitations of traditional 2D IC technology due to the approaching physical limits of Moore's Law [2][11]. Group 1: Design Complexity and Solutions - 3D IC design complexity surpasses that of traditional planar ICs, requiring integration of chips with different functions and processes, which complicates cross-system connection planning and coordination [4][5]. - Siemens EDA's Innovator3D IC™ solution, launched in 2024, aids IC designers in efficiently creating, simulating, and managing heterogeneous integrated 2.5D/3D IC designs, allowing for effective data management and problem avoidance [5][6]. - The Innovator3D IC suite, released in June 2025, supports designs with over 5 million pins, featuring multi-threading and multi-core processing capabilities, enhancing performance for complex designs [5][7]. Group 2: Verification and Reliability - The verification of 3D IC systems is critical, particularly in ensuring correct connections between stacked chips, which involves design rule checks (DRC) and layout versus schematic (LVS) validations [8][9]. - Siemens EDA has expanded its Calibre® platform to address verification challenges, with tools like Calibre 3DStack automating checks for die alignment and LVS, ensuring correct inter-chip connections [9][10]. - The Calibre 3DPERC and mPower tools validate reliability issues post-die stacking, addressing concerns such as electrostatic discharge (ESD) and electromagnetic interference (EMI) [9][10]. Group 3: Thermal and Stress Analysis - Effective heat dissipation in 3D stacked structures is a significant challenge, as accumulated heat can adversely affect chip performance [10][11]. - Siemens EDA's Calibre 3DThermal software analyzes thermal effects in 3D ICs, enabling designers to model and visualize heat distribution, thus optimizing layout and packaging designs [10][11]. - The Calibre 3DStress tool addresses thermal-mechanical stress and warpage, allowing for transistor-level analysis to evaluate the impact of packaging interactions on design functionality [11]. Group 4: Future Prospects - 3D IC technology is positioned as a vital future direction for the integrated circuit industry, with significant application potential across various fields [11]. - Siemens EDA aims to lead technological innovation in 3D IC design, providing comprehensive solutions for design collaboration, verification, thermal management, and stress analysis, thereby facilitating breakthroughs in the industry [11].

Core Insights - Siemens Digital Industries Software has launched two new solutions in its Electronic Design Automation (EDA) portfolio aimed at addressing the complexities in the design and manufacture of 2.5D and 3D Integrated Circuit (IC) designs [1][2][4] Group 1: New Solutions Overview - The Innovator3D IC™ solution suite allows IC designers to efficiently author, simulate, and manage heterogeneous integrated 2.5D/3D IC designs, enhancing design yield and reliability [4][5] - Calibre 3DStress software utilizes advanced thermo-mechanical analysis to assess the electrical impact of stress at the transistor level, significantly reducing risks associated with complex IC designs [4][9] Group 2: Features and Capabilities - Innovator3D IC solution suite includes several components: Innovator3D IC Integrator for digital twin construction, Innovator3D IC Layout for substrate implementation, Innovator3D IC Protocol Analyzer for interface compliance, and Innovator3D IC Data Management for design data management [6][7] - Calibre 3DStress provides accurate, transistor-level analysis of thermo-mechanical stresses, enabling early evaluation of chip-package interactions to prevent future failures and optimize design performance [9][10][12] Group 3: Customer Experiences - Chipletz, a fabless AI platform provider, reported that Siemens' technology is crucial for overcoming design challenges in their advanced platform solutions [13] - STMicroelectronics highlighted that Calibre 3DStress has improved reliability and quality while reducing time to market through early design planning and accurate modeling of potential electrical failures [14]