Core Viewpoint - Applied Materials has launched new deposition, etching, and material modification systems to enhance AI computing capabilities through atomic-scale improvements in transistors as the semiconductor industry transitions to 2nm and advanced nodes [1] Group 1: New Technologies and Innovations - The introduction of GAA (Gate-All-Around) transistors is a significant shift in the semiconductor industry, enabling higher energy efficiency and supporting more powerful AI chip computations [1] - The Producer™ Viva™ radical treatment system allows for atomic-level engineering of the surfaces of GAA transistor nanosheets, which is crucial for improving electron mobility and overall chip performance [2] - The Centris™ Sym3™ Z Magnum™ etching system enhances the uniformity and performance of silicon nanosheets by achieving precise 3D trench profiles, essential for advanced transistor manufacturing [4][5] Group 2: Performance Enhancements - The Viva system, when combined with the Producer Pyra™ thermal annealing process, can reduce copper wire resistance, extending the application of copper in low-layer metal interconnects at advanced nodes [3] - The Sym3 Z Magnum system utilizes second-generation pulsed voltage technology (PVT2) to achieve cleaner and more precise trench etching, which improves transistor switching speed and overall chip efficiency [5] - The Centris™ Spectral™ molybdenum atomic layer deposition system selectively deposits single-crystal molybdenum to reduce contact resistance by up to 15%, addressing the challenges of traditional tungsten contacts at the nanoscale [6]