Core Viewpoint - Intel's EMIB advanced packaging technology is gaining attention from Apple and Qualcomm, being considered a viable alternative to TSMC's products [1] Group 1: Company Interest - Apple has recently posted job openings for DRAM packaging engineers, specifically seeking experience in advanced packaging technologies such as CoWoS, EMIB, SoIC, and PoP [1] - Qualcomm is also looking for a product management director for its data center business, with a requirement for familiarity with Intel's EMIB technology [1] Group 2: Technology and Market Position - Intel's CEO and executives have emphasized that their Foveros and EMIB technologies have attracted interest from multiple customers and are capable of large-scale production [1]