Core Viewpoint - FOPLP (Fan-Out Panel Level Packaging) is gaining attention as an advanced packaging technology, with major competitors like TSMC, Powertech, and ASE adopting distinct names for their versions to differentiate in the market [1][2]. Group 1: FOPLP Technology Overview - FOPLP technology has been promoted by domestic packaging and testing companies for about 9 years, but significant end-user applications have been limited due to initial yield issues and a cautious client attitude [1]. - The technology's initial applications were primarily in RF IC and PMIC sectors, but there is a recent shift towards consumer electronics and AI applications, spurred by TSMC's leadership [1]. Group 2: Company Developments - Powertech has officially named its FOPLP technology PiFO, having achieved mass production as early as 2019, and claims to be the only company with large-scale FOPLP production capabilities [2]. - TSMC plans to establish its first CoPoS (Chip-on-Panel-on-Substrate) experimental line by 2026, with large-scale production expected between late 2028 and 2029, targeting NVIDIA as its first customer [2]. - ASE is utilizing the previously announced FoCoS name for its panel-level packaging technology, with a current production line for 300x300 panel-level packaging aimed at power management and automotive applications [2]. Group 3: Market Outlook - Industry experts believe that the focus of TSMC, Powertech, and ASE on high-end product applications in panel-level packaging will be crucial for the success of FOPLP technology [3]. - The future success of FOPLP as a next-generation advanced packaging solution will depend on resolving yield issues related to chip manufacturers' product positioning and warpage, as well as ensuring overall performance and cost-effectiveness for clients [3].