Core Viewpoint - The emergence of Tuojing Technology marks a significant step towards domestic production in the high-end semiconductor manufacturing sector, particularly in the film deposition equipment market, which has been dominated by international giants [2]. Group 1: Market Overview - The film deposition equipment sector accounts for over 20% of the wafer manufacturing equipment market, with Tuojing Technology capturing approximately 12% of the market share, translating to a revenue of 4.1 billion yuan in a market projected to reach 9.7 billion USD in 2024 [2]. - Tuojing Technology focuses on PECVD, ALD, and Gap Fill technologies, supporting over 100 types of medium film materials required for logic and memory chips [2]. Group 2: Technological Advancements - Chinese companies, represented by Tuojing Technology, are rapidly catching up in terms of process coverage and production equipment performance, achieving levels comparable to international counterparts [3]. - Tuojing Technology has undertaken 11 national major projects and has filed 1,640 patents, with 507 granted, showcasing its commitment to innovation and technology breakthroughs in the semiconductor film deposition field [3]. Group 3: Future Prospects - The company is preparing for future product generations, with 70% of its products being new or advanced process technologies, indicating a strong focus on innovation [4]. - The demand for semiconductor equipment in the three-dimensional integration field is expected to drive Tuojing Technology's growth, with existing orders for wafer-to-wafer hybrid bonding equipment and successful industrial applications of developed detection equipment [3].

Core Viewpoint - The emergence of Tuojing Technology represents a significant step towards domestic production in the monopolized thin film deposition equipment market, which is crucial for high-end semiconductor manufacturing [2][3]. Market Overview - The thin film deposition equipment accounts for over 20% of the wafer manufacturing equipment market, with the Chinese market for this equipment projected to reach approximately $9.7 billion in 2024 [2]. - Tuojing Technology's product market size is estimated at $4.85 billion, with the company generating revenue of 4.1 billion yuan, capturing about 12% market share [2]. Technological Advancements - Tuojing Technology focuses on the research and industrial application of PECVD, ALD, and Gap Fill technologies, supporting over 100 types of medium film materials required for logic and memory chips [2]. - The company has made significant technological breakthroughs, evidenced by its 1,640 patent applications (including PCT) and 507 authorized patents [3]. Future Prospects - The demand for semiconductor equipment in the three-dimensional integration field is expected to drive Tuojing Technology's future growth, with existing orders for wafer-to-wafer hybrid bonding equipment and successful industrial applications of developed detection equipment [3]. - The company is proactively developing technologies for the next two to three generations of products, with 70% of its products being required for new and advanced processes [4].