Core Viewpoint - AMD is planning to adopt multi-chip module (MCM) architecture for consumer-grade GPUs, leveraging its experience from the Instinct MI200 AI accelerator series, which was the first to implement MCM design [3][5]. Summary by Sections Multi-Chip Module (MCM) Concept - The MCM concept is gaining traction in the graphics processing industry due to limitations of single-chip designs, with AMD being a key player in this transition [3]. - AMD's Instinct MI200 series integrated multiple chiplets, including graphics processing cores, HBM stacked memory, and I/O chips [3]. Technical Innovations - AMD's new patent reveals a "smart switch data structure circuit" that connects compute chiplets with memory controllers, optimizing memory access and reducing latency to nanoseconds [4]. - Each Graphics Compute Die (GCD) will feature L1 and L2 caches, similar to AI accelerators, and will have access to a shared L3 cache through the switch, minimizing global memory access [4]. Ecosystem and Competitive Advantage - AMD has a complete ecosystem in place, utilizing TSMC's InFO-RDL bridging technology and a specific version of Infinity Fabric for chip interconnects [5]. - The integration of gaming and AI architectures into a unified UDNA architecture positions AMD favorably against competitors, despite the complexities associated with chiplet designs [5]. Future Outlook - AMD aims to address latency issues experienced in previous architectures, such as RDNA 3, through innovative solutions like the shared L3 cache [5]. - The market may not see the full impact of these innovations until the release of UDNA 5 [5].