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瑞银全球半导体_云人工智能_2026 年 N3 代工厂和 CoWoS 产能紧张程度如何-UBS Global I_O Semiconductors_ Cloud AI_ how tight could N3 foundry and CoWoS be in 2026_ [ERRATUM]
瑞银· 2025-11-25 01:19
Investment Rating - The report reiterates a Buy rating on TSMC as the leading Cloud/Edge AI foundry [4] - ASE is also rated as a Buy due to its position as a key beneficiary of advanced packaging and testing [4] - GPTC is upgraded to a Buy with a new price target of NT$1,800, implying a 35% upside [4][22] Core Insights - TSMC's N3 capacity is forecasted to reach 170kwpm by the end of 2026, up from 120kwpm at the end of 2025 [1] - Cloud AI is expected to account for 35-40% of N3 demand in 2026, with smartphones and PCs making up 60-65% [1] - CoWoS capacity is anticipated to be tight in 2026, with TSMC likely to accelerate capacity expansion [2] - Demand forecasts for CoWoS have been raised significantly for Nvidia (13% increase), AMD (56% increase), and Broadcom [3] Summary by Sections N3 Foundry Supply-Demand Analysis - TSMC's N3 capacity is projected to increase to 170kwpm by end-2026 from 120kwpm at end-2025 [1] - Cloud AI products are expected to represent 35-40% of N3 demand in 2026, with other devices accounting for 60-65% [1] - N3 utilization is expected to be tight, particularly in Q4 2026 [1] CoWoS Capacity and Demand - CoWoS capacity is forecasted to reach 110kwpm by Q3 2026, with potential upside in late 2026 [2] - Demand for CoWoS from Nvidia is expected to reach 3 million units in 2026, with AMD's demand forecast raised by 56% [3] - Broadcom's CoWoS demand is projected to increase to 260-280k units in 2026, up from 90-100k in 2025 [3] Stock Recommendations - TSMC's capex for 2026/27 is raised to US$50bn/52bn from US$46bn/50bn, with a price target increase to NT$1,800 [4] - ASE is highlighted as a key beneficiary of advanced packaging and testing [4] - GPTC's long-term earnings CAGR is forecasted at 20% over 2027-29, with a significant market share in advanced packaging [22]