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台积电市占,首超70%
半导体芯闻· 2025-10-11 10:34
如果您希望可以时常见面,欢迎标星收藏哦~ 今年第二季度,纯晶圆代工市场整体市场销售额较去年同期增长33%,这得益于人工智能(AI) 产业扩张带来的半导体需求增长,以及中国的补贴政策。据解读,台积电吸收了大部分新增的市场 销售额。 Counterpoint Research 解释说:"台积电在 2025 年第二季度的纯晶圆代工市场中占据了 71% 的 市场份额",并补充说,这"得益于 3 纳米(纳米,十亿分之一米)工艺的量产扩展、满足 AI 图形 处理器 (GPU) 需求的 4 纳米和 5 纳米工艺的高利用率,以及 CoWoS 的扩展。"CoWoS 是晶圆上 芯片 (chip-on-wafer-on-substrate) 的缩写,是台积电开发的一种先进封装技术。 三星电子以8%的市场份额位居第二。然而,其市场份额较第一季度下降了1个百分点,较去年同期 下降了2个百分点。Counterpoint Research表示:"由于智能手机和其他消费设备的复苏,三星电 子保持了市场份额第二的位置。" 中芯国际排名第三,市场份额为5%,较上一季度下降1个百分点。中芯国际继续受益于中国政府补 贴政策,预计将向更先进的工艺过渡 ...
全球都在扩产先进封装
半导体芯闻· 2025-10-11 10:34
Core Viewpoint - Advanced packaging has become a critical battleground for foundries and packaging companies amid the slowdown of Moore's Law and the explosive demand for AI/HPC solutions. Major players globally, including TSMC, Samsung, ASE, and domestic firms like JCET, Tongfu Microelectronics, and Huatian Technology, are accelerating capacity expansion to seize this key industry opportunity in the coming years [1]. Group 1: Market Trends and Projections - The global advanced chip packaging market is expected to grow from $50.38 billion in 2025 to $79.85 billion by 2032, with a compound annual growth rate (CAGR) of 6.8% [1]. - The demand for high-performance, low-power packaging solutions is driven by AI large models, autonomous driving, cloud computing, and edge computing [1]. Group 2: TSMC's Strategy and Expansion - TSMC's advanced packaging revenue is projected to exceed 10% in 2024, surpassing ASE to become the largest packaging supplier globally, driven by the surge in CoWoS demand [3]. - TSMC plans to invest an additional $100 billion in the U.S., including two advanced packaging plants in Arizona, expected to start construction in the second half of next year and enter mass production by 2028 [5]. - TSMC is set to launch CoWoS-L in 2026 and SoW-X in 2027, enhancing its capabilities significantly in the AI/HPC era [6]. Group 3: Samsung's Cautious Approach - Samsung has adopted a more cautious stance compared to TSMC, previously shelving a $7 billion advanced packaging facility due to uncertain customer demand [7]. - Recent contracts with Tesla and Apple highlight the necessity for Samsung to reconsider its advanced packaging investments [7][8]. - Samsung's integrated model of "memory + foundry + packaging" positions it well for future demand once customer needs become clearer [8]. Group 4: ASE's Expansion and Technological Advancements - ASE is enhancing its advanced packaging capabilities in Kaohsiung, focusing on CoWoS, SoIC, and FOPLP technologies [9]. - ASE's new K18B factory in Kaohsiung will serve AI and HPC demands, while the K28 factory will expand CoWoS testing capacity [9][10]. - ASE's technology evolution includes advancements in 3D Advanced RDL technology, which is crucial for various applications [10][11]. Group 5: Amkor's U.S. Investment - Amkor is expanding its advanced packaging facility in Peoria, Arizona, with a total investment of $2 billion, expected to create over 2,000 jobs [13]. - The new facility will primarily support TSMC's CoWoS and InFO technologies, establishing a local closed-loop for wafer manufacturing and packaging [14]. - Amkor's expansion aligns with U.S. semiconductor policies, emphasizing the need for a complete backend capability to maintain competitiveness in AI and HPC [14]. Group 6: Domestic Players' Development - JCET, Tongfu Microelectronics, and Huatian Technology are rapidly advancing in the advanced packaging sector, each developing unique strategies [15]. - JCET is focusing on various advanced packaging technologies and plans to invest 8.5 billion yuan in 2025, targeting high-performance applications [16][17]. - Tongfu Microelectronics has deepened its partnership with AMD, becoming its largest packaging supplier, and is making significant progress in large-size FCBGA technology [18][19]. - Huatian Technology is exploring CPO technology and has achieved significant growth in revenue, indicating a shift towards system integration in advanced packaging [20][21].
中芯国际全球第三!台积电市占首超70%!
国芯网· 2025-10-11 07:27
国芯网[原:中国半导体论坛] 振兴国产半导体产业! 不拘中国、 放眼世界 ! 关注 世界半导体论坛 ↓ ↓ ↓ 10月11日消息,台积电继续保持其在全球晶圆代工市场的压倒性优势,市场份额不断扩大。三星电子保持第二的位置,但市场份额下降了 1 个百分点。 据市场研究公司 Counterpoint Research 10 月 10 日公布的数据,今年第二季度,台积电占据纯晶圆代工市场 71% 的份额,位居第 一。台积电的市场份额较上一季度(68%)上升了 3 个百分点,与去年同期(65%)相比,一年内上升了 6 个百分点。 今年第二季度,纯晶圆代工市场整体市场销售额较去年同期增长 33%,这得益于人工智能(AI)产业扩张带来的半导体需求增长,以及中 国的补贴政策。据解读,台积电吸收了大部分新增的市场销售额。 Counterpoint Research 解释说:" 台积电在 2025 年第二季度的纯晶圆代工市场中占据了 71% 的市场份额 ",并补充说,这 " 得益于 3 纳米(纳米,十亿分之一米)工艺的量产扩展、满足 AI 图形处理器 ( GPU ) 需求的 4 纳米和 5 纳米工艺的高利用率,以及 CoWoS ...
瑞银报告:英伟达 2026 年 CoWoS 晶圆需求同比涨 40% 台积电产能难满足
Huan Qiu Wang Zi Xun· 2025-10-11 04:27
来源:环球网 【环球网科技综合报道】10月11日消息,瑞银集团(UBS)近日发布最新分析师报告,对英伟达未来先 进封装需求及产能格局作出重要预测。报告显示,受当前 Blackwell 系列芯片热销与下一代 Rubin AI 芯 片订单拉动,英伟达 2026 年对 CoWoS(芯片晶圆级系统集成)先进封装的需求将大幅攀升,预计 CoWoS 晶圆需求量达 67.8 万片,较 2025 年同比增长近 40%,同时 GPU 总产量有望突破 740 万颗,凸 显全球 AI 产业发展对高端芯片制造的强劲需求。 据报告分析,英伟达 CoWoS 需求增长主要源于两大核心产品线的驱动。一方面,当前主力产品 Blackwell 及 Blackwell Ultra 系列市场表现强劲,出货量预计实现 30% 的季度环比增长,持续为先进封 装需求提供支撑;另一方面,计划于 2026 年初亮相的下一代 AI 芯片架构 Rubin 已启动量产爬坡,成为 拉动需求的关键新动力。值得关注的是,英伟达新推出的 Rubin CPX 平台进一步加剧了这一需求态势 —— 该平台专注于 AI 推理任务,其独特芯片结构需依赖 CoWoS-L 封装技术,随 ...
台积电市占,首超70%
半导体行业观察· 2025-10-11 01:27
公众号记得加星标⭐️,第一时间看推送不会错过。 来源:内容来自半导体行业观察综合。 台湾台积电继续保持其在全球晶圆代工(半导体代工)市场的压倒性优势,市场份额不断扩大。三星 电子保持第二的位置,但市场份额下降了1个百分点。 据市场研究公司Counterpoint Research 10月10日公布的数据,今年第二季度,台积电占据纯晶圆代 工市场71%的份额,位居第一。台积电的市场份额较上一季度(68%)上升了3个百分点,与去年同 期(65%)相比,一年内上升了6个百分点。 今年第二季度,纯晶圆代工市场整体市场销售额较去年同期增长33%,这得益于人工智能(AI)产业 扩张带来的半导体需求增长,以及中国的补贴政策。据解读,台积电吸收了大部分新增的市场销售 额。 Counterpoint Research 解释说:"台积电在 2025 年第二季度的纯晶圆代工市场中占据了 71% 的市 场份额",并补充说,这"得益于 3 纳米(纳米,十亿分之一米)工艺的量产扩展、满足 AI 图形处理 器 (GPU) 需求的 4 纳米和 5 纳米工艺的高利用率,以及 CoWoS 的扩展。"CoWoS 是晶圆上芯片 (chip-on-w ...
全球半导体-英伟达和博通带来更强劲的 CoWoS(晶圆级芯片封装)需求前景-UBS Global IO Semiconductors Stronger CoWoS demand outlook from Nvidia and Broadcom
UBS· 2025-10-09 02:39
ab 8 October 2025 Global Research UBS Global I/O Semiconductors Stronger CoWoS demand outlook from Nvidia and Broadcom Raising our CoWoS estimates for Nvidia and Broadcom Following the upward revision of our TSMC CoWoS capacity estimate from 100kwpm to 110kwpm by end-2026 in our TSMC preview, we raise our bottom-up demand forecasts for Nvidia and Broadcom. We raise our Nvidia CoWoS demand estimates 5%/26% for 2025/2026 to factor in: 1) higher Blackwell production units, which we believe could be up 30% QoQ ...
人工智能供应链:台积电 CoWoS、Meta ASIC 和中国 GPU-Asia-Pacific Technology-AI Supply Chain TSMC CoWoS, Meta ASIC, and China GPU
2025-10-09 02:39
October 8, 2025 09:56 PM GMT Asia-Pacific Technology | Asia Pacific AI Supply Chain: TSMC CoWoS, Meta ASIC, and China GPU The 2026 CoWoS capacity plan is under supplying, if key customers' demand is real. On the other hand, NVIDIA's RTX Pro 6000 (B40) forecast appears still on track from Chinese customers, suggesting inference demand is strong in China. TSMC's CoWoS demand upside: We sensed even stronger demand from AI semis at TSMC, for example for 3nm wafer demand from NVIDIA's Rubin GPU in 2H26 (see also ...
碳化硅进入先进封装主舞台:观察台积电的碳化硅战略 --- SiC Enters the Advanced Packaging Mainstage_ Observing TSMC’s SiC Strategy
2025-10-09 02:00
Observing TSMC's SiC Strategy :SiC Enters the Advanced Packaging Mainstage 观察台积电的碳化硅战略:碳化硅进入先进封装的 主舞台 Original Articles By SemiVision Research (Nvidia ,TSMC, Globalwafers, Wolfspeed) SemiVision Research 原创文章(英伟达、台积电、环球晶圆、Wolfspeed) SEP 21, 2025 2025 年 9 月 21 日 ∙ PAID ∙ 付费 SEMIVISION 7 Share 分享 20 shorten the power path and reduce PDN impedance, enabling faster voltage response. ASE, through its VIPack and FOCoS-Bridge (with TSV) platforms, is optimizing PDN, signal interconnects, and thermal performance sim ...
大中华区科技硬件:人工智能科技硬件全面升级-Investor Presentation-Greater China Technology Hardware AI Tech Hardware Upgrades Across the Board
2025-10-09 02:00
October 7, 2025 12:33 AM GMT Investor Presentation | Asia Pacific M Foundation Greater China Technology Hardware: AI Tech Hardware Upgrades Across the Board Morgan Stanley Taiwan Limited+ Sharon Shih Equity Analyst Sharon.Shih@morganstanley.com +886 2 2730-2865 Derrick Yang Equity Analyst Derrick.Yang@morganstanley.com +886 2 2730-2862 Howard Kao Equity Analyst Howard.Kao@morganstanley.com +886 2 2730-2989 Greater China Technology Hardware Asia Pacific Industry View In-Line Morgan Stanley does and seeks to ...
X @郭明錤 (Ming-Chi Kuo)
郭明錤 (Ming-Chi Kuo)· 2025-10-06 16:16
從供應鏈角度,快速看一下OpenAI預計要自2H26開始部署1 GW的AMD MI450這件事,以及對Nvidia的影響:1. 過去兩週AMD的2026年的CoWoS訂單無顯著變化。2. 部署1 GW的AMD MI450約等於5萬片CoWoS-L。目前AMD的2026年的CoWoS訂單推估6-8萬片 (約80-90%用於MI400系列),故無論是樂觀或謹慎版本都可滿足佈建1 GW MI450需求。3. 受惠AMD的OpenAI訂單,初步看比較明顯的是HBM與UALink供應鏈。MI450 HBM4主要供應商是Samsung;完整的UALink規格雖要到2027年的MI500系列才能量產,但高訂單能見度會讓相關供應商股價先反應 (如Astera Labs)。4. 從Nvidia做機櫃等級伺服器的痛苦經驗看,部署1 GW的MI450過程應該也不會太輕鬆。Nvidia能做的就是在AMD的機櫃等級伺服器順利出貨前,盡可能把競爭格局提升到另一個層次,確保接下來的優勢,而很明顯的,Nvidia也早就在做了,只要AI算力市場整體是成長的,OpenAI與AMD合作這件事,對Nvidia影響應該有限。 ...