公众号记得加星标⭐️，第一时间看推送不会错过。 来源：内容来自 Digitimes 。 台积电研究发展副总经理暨卓越科技院士余振华，于2025年7月8日正式退休。 而台积「研发六骑士」的美谈并未熄灭，这位真正尚在近期，仍于台积电任职的「最终骑士」余振华，也被半导体业界高 度评价，十足地推动台积电站上晶圆代工产业顶峰。 业界人称道格（英文名）的余振华，自1994年加入台积电，从铜制程的重大突破，到领军开发CoWoS、InFO等划时代先 进封装技术，为台湾半导体技术创下无数里程碑，对台积电登上全球晶圆代工龙头地位贡献深远。 业界认为，余振华对台积电先进封装与异质系统整合制程居功厥伟，尤其是目前AI最夯的CoWoS封装技术更由他一手推 动，余振华退休后，他的工作交由另一位副总徐国晋负责。 半导体业界近期传出余振华将从台积电退休。 台积证实，余振华退休，台积电感谢余振华多年来对公司的贡献，并预祝他退休生活愉快。 余振华成就台积电先进封装 1955年出生于基隆的余振华，1977年自清大物理系毕业，1979年取得材料工程硕士学位，并于1987年获美国乔治亚理工 学院材料工程博士学位，毕业后进入当时全球最先进的美国AT&T ...

We met with over 35 investors during our marketing trip in Singapore over the past week. Overall, we continued to observe a resurgence in sentiment particularly around AI while sentiment towards non-AI segments remains subdued. However, we feel that investors' positioning remains on the cautious side despite the recent recovery in sentiment. From a positioning perspective, many investors did not fully participate in the rally over the past few months and are still largely underexposed or waiting on the side ...

June 30, 2025 09:00 PM GMT Global Technology AI Supply Chain: Semis Field Trip – Key Takeaways TSMC's 2026 CoWoS capacity is growing > 30% Y/Y, psoitive for both the Nvidia and AI ASIC supply chains. On the other hand, B30 GPU shipments to China will be a wild card for China's AI capex. Over the past week, our global semis team met with ~20 corporate and AI industry experts in the AI supply chain in Taiwan and Beijing. We also met investors there to get a sense of market sentiment. In general, investors are ...

华尔街金融巨头摩根士丹利近日发布研报称，"芯片代工之王"台积电(TSM.US)已经启动建设310mm Panel-Level chiplet先进封装试产线(即CoPoS先进封装体系)，并带动ASE等半导体设备与先进封装设备 巨头们将FOPLP尺寸同步收缩至300/310mm，意味着"圆片级CoWoS向面板级CoPoS先进封装"的封装超 级更新迭代正式进入投资与初步试制造期。 台积电启动的CoPoS试产线意味着，这家芯片制造巨头正式掀起覆盖芯片上游到下游产业链的"先进封 装大变革"。CoPoS未来主要用于大规模解决CoWoS先进封装产能瓶颈以及初步流片与整个制造到封装 环节的成本问题，面向下一代AI训练/推理AI GPU/AI ASIC，追求一次封装更大规模chiplet芯粒、更高 HBM堆叠数，以实现指数级性能提升并且相比于CoWoS有望缩减扩张产能的成本。 大摩的全球芯片产业链调研数据显示，台积电已经投资建设CoPoS310mm试产线，ASE几乎同期发布采 用300mm面板的2.3D封装技术(FOCoS-Bridge)，显示先进封装产业正加速向310mm过渡。2025年6月， 日本电子封装学会(JIEP)研 ...

China's AI application/inference demand is strong, but hardware supply is the bottleneck: Chinese AI developers (covered by our Internet analyst for China, Gary Yu) in Beijing are aware of NVIDIA's B30 (RTX 6000 Pro) chips, though no official purchase orders with NVIDIA have been confirmed. However, our checks with Taiwan's supply chain indicate foundry wafer orders for this chip totaling 2mn units in 2H25, and annual run-rate is around 5mn units. If B30 cannot be shipped to China, some Chinese AI developer ...

芯片超人组织的日本商务考察活动 正在招募！12月出发，为期 6天，重点参加 SEMICON Japan 2025，并 实地走访日本当地知名半导体企业与高校，挖掘日本半导体产业芯机会！ 点击上图查看活动详情，或联系客服咨询：ICSuperman88。 作者简介： 汤之上隆先生为日本精密加工研究所所长，曾长期在日本制造业的生产第一线从事半导体研发工作，2000年获 得京都大学工学博士学位，之后一直从事和半导体行业有关的教学、研究、顾问及新闻工作者等工作，曾撰写 《日本"半导体"的失败》 、 《"电机、半导体"溃败的教训》 、 《失去的制造业：日本制造业的败北》 等著 作。 0 1 Rapidus不仅涉足前道工艺 还进军后道工艺 国际半导体封装及后道工艺技术会议"ICEP-IAAC2025"于2025年4月在日本长野县举办，据报 道，Rapidus在该会议的主旨演讲中进行发言： "半导体代工厂Rapidus正在加速开发最先进的封装技术。为 了 在高速成长的生成式人工智能 （AI） 市场中，赢得GAFAM （ Google ， Apple ， Facebook 现已更名为Meta ， Amazon和 Microsof ...

ANCHOR REPORT Global Markets Research 19 February 2025 Global Advanced Packaging The evolution of CoWoS, SoIC and InFO Given the growing importance of advanced packaging (AP) in enabling the integration of multiple heterogeneous chips with improved performance, we believe AP is likely to evolve in the following ways from 2025F onwards: (1) CoWoS technology will shift from CoWoS-S to CoWoS-L/R; (2) SoIC adoption could increase further driven by HBM5 and potential adoption in Apple products beyond 2026F; and ...

更多资料加入知识星球：水木调研纪要 关注公众号：水木Alpha J P M O R G A N Asia Pacific Equity Research 26 June 2025 TSMC See page 10 for analyst certification and important disclosures, including non-US analyst disclosures. Advanced Packaging update – Adjusting CoWoS and raising WMCM estimates In this update, we separate out CoWoS and WMCM forecasts, as WMCM expectations are starting to rise materially for 2026 and 2027. Please see our wafer- level forecast, chip-level shipments by XPU and capacity assumptions in Tables 1-2, Table 3 ...

25 June 2025 | 8:38PM CST TSMC (2330.TW) Growth outlook further reinforced by easing concern on AI order cuts and growing CoWoS adoption; reiterate Buy (on CL); TP to NT$1,210 | 2330.TW | 12m Price Target: NT$1,210.00 | Price: NT$1,070.00 | Upside: 13.1% | | --- | --- | --- | --- | | TSM | 12m Price Target: $242.00 | Price: $220.09 | Upside: 10.0% | We are raising our earnings forecast for TSMC by 2-6% for 2025-2027E as we raise our 1) wafer revenue forecast for 3nm/5nm, partially to factor in our easing co ...

Key Takeaways TSM beat Q1 2025 earnings and revenue estimates, with $2.12 EPS and $25.5B in revenue. AI chip demand is set to double in 2025, with TSM projecting $20B in AI-specific annual revenue. TSM is hedging $18B against FX swings as U.S.-China tensions and global expansion introduce new risks.Taiwan Semiconductor Manufacturing Company Limited (TSM) has had a solid 2025, with a current share price of around $228. Its robust performance has been closely tied to the booming demand for artificial intell ...