Core Insights - The next significant leap in CPU design is expected to come from backside power delivery technology, which can transform performance, thermal management, and energy efficiency, particularly for enterprise markets and PC enthusiasts [2][3]. Group 1: Backside Power Delivery Technology - Backside power delivery (BSPD) involves relocating the power delivery network (PDN) from the front to the back of the silicon chip, allowing the front to be fully utilized for signal output and transistors [2][3]. - Intel's PowerVia PDN is the first commercial implementation of backside power delivery, initially planned for the 20A process node but now expected to debut with the Panther Lake architecture based on the 18A node in early 2026 [3][4]. Group 2: Performance and Efficiency Improvements - Power delivery is a critical yet often overlooked bottleneck that affects CPU performance limits, as every watt of power must be transmitted without interfering with logic signals [4]. - Intel's tests indicate that moving the power circuit to the chip's bottom can increase clock frequency by 6% and reduce voltage drop by 30% under the same process node and voltage [4]. Group 3: Thermal Management and Future Innovations - The relocation of power circuits to the back enhances thermal contact with integrated heat spreaders, potentially simplifying CPU cooling and reducing voltage spikes during load [4][5]. - Backside power delivery aligns well with future stacking technologies, enabling true logic stacking rather than just additional cache, which could lead to more efficient designs as manufacturing costs rise and silicon capabilities approach their limits [5].