公众号记得加星标⭐️，第一时间看推送不会错过。 来 源： 内容 编译自XDA 。 CPU设计的下一个重大飞跃并非来自增加核心数量、追求更小的制程节点，或是将更多芯片堆叠到单 个CPU上。这并非否认AMD的3D V-Cache等技术是优秀且意义重大的创新，但它们并没有真正改变 我们对CPU的固有认知。 简单来说，背面供电是指将供电网络 (PDN) 从硅芯片的正面移至背面。该供电网络本质上是由金属 层和过孔组成的，用于向晶体管供电。传统上，它与数据 I/O 位于同一侧，这迫使工程师在性能和效 率之间做出权衡。电源路由会与逻辑信号竞争，任何拥塞都可能导致电阻和电压下降，最终限制芯片 密度。 通过将电源传输转移到芯片的另一侧，这些权衡取舍的重要性大大降低。正面可以完全用于信号输出 和晶体管，而背面则可以供电。IMEC 和台积电等公司已经在实验室芯片上对此进行了一段时间的实 验，但英特尔的 PowerVia PDN 是首个面向商用芯片的背面供电实现方案。虽然它最初计划与英特 尔 20A 制程节点一同推出，但由于该节点并非面向消费级平台，因此并未发布。但这并不意味着我 们 近 期 内 不 会 看 到 PowerVia 的 ...

Group 1: Core Insights - The flagship smartphones of 2025 will not feature 2nm chips, with major companies like Apple and Qualcomm opting for 3nm technology instead [1][6] - MediaTek has announced the completion of the design for its 2nm chip, the Dimensity 9600, which is expected to enter mass production by the end of next year [1][3] - By the end of 2026, several major companies, including Apple, Qualcomm, and Samsung, are expected to adopt 2nm technology [1][3] Group 2: Demand and Market Dynamics - TSMC's President, C.C. Wei, indicated that the demand for 2nm chips is unexpectedly high, surpassing that of 3nm chips [2][5] - Major clients such as Apple, AMD, and NVIDIA have already reserved TSMC's 2nm capacity, with Apple being the largest customer contributing 25.18% of TSMC's revenue in 2024 [3][5] - The performance improvements associated with the transition from 3nm to 2nm are driving significant interest from fabless companies [5][22] Group 3: Production Challenges - TSMC's production schedule for 2nm chips has faced delays, impacting the ability of smartphone manufacturers to incorporate these chips into their 2025 models [6][7] - The yield rates for 2nm chips are expected to start at around 70% and gradually improve, which may influence the timing of mass production for sensitive clients [10][11] - The complexity of transitioning to new technology nodes has led to longer timelines for product development, with the average time between nodes extending [19][21] Group 4: Competitive Landscape - The competition in the semiconductor foundry market is intensifying, with TSMC and Samsung both advancing their 2nm production plans [12][16] - TSMC is expected to have a monthly production capacity of 60,000 wafers by next year, while Samsung's capacity is reported to be significantly lower at 7,000 wafers [16][18] - The race for advanced manufacturing equipment, particularly high-NA EUV lithography machines, is critical for maintaining competitive advantage in the 2nm space [18][22] Group 5: Future Outlook - The transition from 2nm to 1nm technology is projected to take at least five years, with multiple iterations planned for the 2nm node [20][21] - Despite challenges, the semiconductor industry continues to innovate, with advancements in materials and packaging technologies expected to drive future transistor density improvements [22]

Core Insights - AMD's revenue share in the X86 server CPU market exceeded 40% and shipment share surpassed 27% in the first half of 2025, indicating stronger sales compared to Intel [2] - Despite Intel's challenges, AMD is projected to capture nearly 60% of the X86 server CPU revenue and over 72% of the shipment share in 2025 [2] - Intel's upcoming "Clearwater Rapids" and "Clearwater Forest" processors will rely on advanced manufacturing technologies, including the 18A process and 3D chip stacking techniques [2][3] AMD's Competitive Position - AMD's Epyc server CPUs are frequently released and dominate the market due to superior manufacturing processes from TSMC [3] - The competition in the data center market is intensifying as cloud builders increase their use of custom Arm server CPUs, with AMD being a strong competitor [3] Intel's Strategic Developments - Intel has the opportunity to regain some market balance with the launch of the 18A process and the new Xeon 7 processors, despite delays in product launches [3][4] - The introduction of the Clearwater Forest E-core processor is expected to enhance Intel's competitive edge [5] Technological Advancements - The 18A process technology offers a 15% performance improvement at the same power level and a 30% increase in chip density compared to previous processes [7] - The Clearwater Forest CPU features a 3D architecture that improves power efficiency and allows for higher transistor density [9] Performance Metrics - The Darkmont core in the Clearwater Forest architecture is designed to execute 17% more instructions per clock cycle compared to its predecessor [16] - The new architecture supports a total of 576 cores and 1,152 MB of L3 cache, significantly enhancing computational capabilities [26] Memory and I/O Capabilities - The Clearwater Forest platform boasts a memory bandwidth of 1300 GB/s and 96 PCI-Express 5.0 I/O channels, facilitating high data throughput [26] - The architecture allows for shared memory clusters between processors, enhancing performance in multi-processor configurations [26]