Group 1 - Nearfield Instruments has launched a strategic development project to accelerate innovation in semiconductor metrology through a collaboration with Imec [1] - The partnership aims to address key challenges in the semiconductor manufacturing value chain, including 3D morphology measurement and hybrid bonding characterization [1] - The QUADRA system is designed to meet the demands for precision, speed, and scalability in metrology, which are critical for chip performance, energy efficiency, and yield in the AI chip era [1] Group 2 - Nearfield Instruments specializes in advanced metrology and inspection solutions for the semiconductor industry, focusing on next-generation scanning probe microscopy systems [2] - The QUADRA platform enables non-destructive, high-throughput atomic force microscopy (AFM) 3D imaging, allowing for precise measurement of complex structures critical in advanced process nodes and 3D integrated circuit packaging [2] - The company's solutions are designed for seamless integration into high-volume manufacturing environments, featuring strong automation capabilities and rapid measurement cycles [2] Group 3 - The high numerical aperture EUV lithography metrology technology is being developed to enhance the production efficiency of lithography machines [3] - QUADRA's unique sidewall imaging mode allows for precise characterization of high aspect ratio structures such as complementary field-effect transistors (CFET) [3] - The metrology and inspection capabilities for 3D integration and hybrid bonding are enhanced, focusing on applications like copper pad and dielectric roughness, erosion, and full-chip imaging [3]