Core Viewpoint - Yongxi Electronics (688362.SH) has successfully developed RDL and bump processing capabilities through the implementation of the Bumping project, with plans to complete 2.5D packaging interconnections by Q4 2024 [1] Group 1 - The company is currently validating products with relevant customers [1] - The technology roadmap includes various solutions based on RDL, silicon interposers, and silicon bridges [1]