Sidecar
Search documents
全球冷却行业:引入 2027 年预期;因人工智能服务器销量增长上调全球服务器冷却总可寻址市场(TAM)-Global Cooling_ 2027E introduced; Global Server cooling TAM raised on higher AI server volumes
2025-10-31 01:53
Summary of Global Server Cooling Market Conference Call Industry Overview - The conference call discusses the **Global Server Cooling** market, particularly focusing on the **AI server** segment and the adoption of **liquid cooling** technologies. Key Points and Arguments 1. **Market Forecasts**: - The **Global Server Cooling Total Addressable Market (TAM)** is projected to grow significantly, with estimates for 2025 and 2026 raised to **US$7.9 billion** and **US$14.0 billion**, respectively, reflecting a **9%** and **16%** increase from previous estimates [1][2][16]. - The TAM for AI training servers is expected to increase from **US$1.5 billion** to **US$12.4 billion** from 2024 to 2027, representing a **101% CAGR** [1]. 2. **Liquid Cooling Penetration**: - Liquid cooling penetration rates for AI training servers are forecasted to reach **15%** in 2024, escalating to **80%** by 2027. For AI inferencing servers, penetration is expected to rise from **1%** to **20%** over the same period [1][2][17]. - The ongoing increase in liquid cooling adoption is attributed to the rising computing power of GPUs and ASICs, denser server designs, and the need for improved power efficiency in data centers [1]. 3. **Growth Drivers**: - The growth in the cooling TAM is driven by the increasing volume of high-power AI servers that require advanced cooling solutions, particularly liquid cooling, which offers higher cooling efficiency compared to air cooling [1][2][16]. - Innovations in cooling technologies, such as double-sided cold plates and microfluidics solutions, are enhancing heat exchange efficiency and thermal performance, further supporting the growth of the liquid cooling market [22]. 4. **Market Dynamics**: - The report indicates a strong year-over-year growth forecast for the server cooling market, with **111%** growth expected in 2025 and **77%** in 2026 [8][23]. - The cooling solutions market is evolving with new designs and technologies to meet the increasing thermal demands of AI servers [22]. 5. **Competitive Landscape**: - Key players in the liquid cooling market include companies like **Wiwynn**, **Lenovo**, **Dell**, and **HP**, with varying ratings and market caps provided [28]. - The report highlights the importance of customization and rapid response capabilities for cooling suppliers to adapt to new technologies and market demands [22]. Additional Important Content - The report includes detailed tables summarizing the projected TAM for various server types, including AI training, general, and HPC servers, along with their respective liquid cooling penetration rates [2][8][23]. - It emphasizes the need for cooling suppliers to enhance their product offerings and capabilities to keep pace with technological advancements in the server industry [22]. This summary encapsulates the critical insights from the conference call regarding the Global Server Cooling market, focusing on growth forecasts, market dynamics, and competitive landscape.
中金 | AI“探电”(十):ODCC大会见闻 ——产业百舸争流,技术百花齐放
中金点睛· 2025-09-18 23:37
Core Insights - The article discusses the evolution of power supply architectures in data centers, highlighting the shift towards more efficient technologies such as 800V HVDC and SST, with expectations for significant adoption by 2028 and 2030 respectively [2][4][11]. Group 1: Power Supply Architecture Evolution - The current power supply in data centers is primarily centralized (Powershelf), but with the rise of AI workloads, a transition to Sidecar power supply mode is anticipated around 2026-2027, with single cabinet power reaching 250-1500 kW [2][4]. - By 2030, the market is expected to gradually adopt SST power supply architecture, which is projected to achieve a full-link efficiency of 91.2%, surpassing the current UPS architecture efficiency of 85.8% [6][11]. Group 2: 800V HVDC Technology - 800V HVDC is gaining attention for its efficiency and space-saving benefits, potentially increasing end-to-end efficiency to 95-98% compared to traditional UPS systems, while reducing copper usage by 45% and floor space by 40% [11][12]. - Despite its advantages, 800V HVDC faces challenges such as higher initial costs (20-30% more than traditional UPS) and unclear market standards, necessitating industry-wide collaboration for its advancement [11][12]. Group 3: New UPS Technologies - A new type of simplified UPS has been introduced, eliminating the traditional AC/DC rectification stage, which allows for 0ms switching and improved IT performance [15][16]. - This new UPS operates in three modes: normal operation, energy storage during power outages, and combined power supply when load exceeds UPS limits [15][16]. Group 4: Power Supply Technology Upgrades - Upgrades in power supply technology focus on new materials, topologies, and functionalities, with significant advancements in power devices such as SiC MOSFETs replacing Si IGBTs [18][22]. - The integration of passive components like capacitors and inductors is seen as a bottleneck for future integrated power solutions, with expectations for higher integration levels in the coming years [22][24]. Group 5: Addressing GPU Load Fluctuations - The article highlights the challenges posed by GPU load fluctuations in data centers, which can cause significant power quality issues [24][26]. - Solutions for mitigating these fluctuations include using supercapacitors on the DC side and enhancing power supply unit (PSU) designs to accommodate larger capacitors for better load smoothing [26][30]. Group 6: FIVR Technology - FIVR (Fully Integrated Voltage Regulator) is emerging as a promising technology for DC-DC terminal power supply, offering significant improvements in size, thickness, and dynamic response compared to traditional power supplies [33][34]. - This technology integrates power supply directly into the chip, reducing component count and achieving faster response times, although it imposes stringent requirements on inductor size and performance [33][34].