S. Y. Hou, TSMC TSMC Property CHIPLETS AND ADVANCED PACKAGING/PHOTONICS Advanced CPO Integrated by CoWoS® and COUPE Advanced CPO Integrated by CoWoS® and COUPE Dr. Shang Y. Hou Director, High Performance Packaging Integration TSMC TSMC Property Outline TSMC Property • Heterogeneous chiplet integration • CoWoS® • COUPE • CPO based on CoWoS® and COUPE • Forward-looking of CPO packaging Technology Advancement for Performance Boost 200 MOS Transistors Cu/Low-K SiGe Immersion HKMG >2000 cores 7B >3000 Cores (16F ...