ab Global Research 12 September 2025 UBS Global I/O Semiconductors SEMICON Taiwan 2025: 3.5D advanced packaging, co-packaged optics and more testing An event at record scale SEMICON Taiwan 2025, held on 8-12 Sept, was one of the largest electronics shows in Taiwan in recent years, reflecting increased attention on the importance of the semiconductor industry and supply chain in Taiwan. According to official estimates, the event attracted 1,200 exhibitors and ~100,000 visitors (vs. 85,000 visitors last year) ...

S. Y. Hou, TSMC TSMC Property CHIPLETS AND ADVANCED PACKAGING/PHOTONICS Advanced CPO Integrated by CoWoS® and COUPE Advanced CPO Integrated by CoWoS® and COUPE Dr. Shang Y. Hou Director, High Performance Packaging Integration TSMC TSMC Property Outline TSMC Property • Heterogeneous chiplet integration • CoWoS® • COUPE • CPO based on CoWoS® and COUPE • Forward-looking of CPO packaging Technology Advancement for Performance Boost 200 MOS Transistors Cu/Low-K SiGe Immersion HKMG >2000 cores 7B >3000 Cores (16F ...

Summary of Key Points from the OCP APAC Summit Industry Overview - The Open Compute Project (OCP) is an industry consortium focused on redesigning hardware technology for data centers, emphasizing efficiency, scalability, and openness. It has over 400 members as of 2025, initiated by Meta in 2011 [3][2]. Core Insights and Arguments AI Data Center Innovations - The OCP APAC Summit highlighted advancements in AI hardware, infrastructure, and networking, with participation from major tech companies like Google, Meta, Microsoft, TSMC, and AMD [2][7]. - Meta is aggressively launching its Hyperion data center, which is expected to significantly benefit server ODMs like Quanta and Wiwynn [4][29]. - AMD's UALink and Ultra Ethernet are set to enhance networking capabilities, enabling larger clusters and improved performance [9][11]. Power and Cooling Solutions - The power consumption of AI servers is projected to double, with NVIDIA's GPUs expected to reach 3,600W by 2027, necessitating a shift to high-voltage direct current (HVDC) systems for efficiency [23][24]. - Liquid cooling is becoming essential for managing the thermal load of high-density AI racks, with designs evolving to accommodate this need [34][23]. Market Dynamics - The AI hardware market is transitioning from proprietary solutions to a more open, collaborative environment, benefiting specialized hardware vendors [10][11]. - The back-end networking market for AI is projected to exceed $30 billion by 2028, driven by the demand for high-bandwidth communication within AI clusters [18]. Important but Overlooked Content - The shift to panel-level processing by ASE is a critical innovation for manufacturing larger AI packages, improving area utilization and cost-effectiveness [13]. - The integration of retimers in cables is essential for maintaining signal integrity in high-density AI racks, addressing challenges posed by traditional passive copper cables [18]. - MediaTek is positioning itself as a leader in on-device AI integration, which is crucial as the demand for edge computing grows [26][30]. Company-Specific Highlights - **Delta**: Target price raised from $460 to $715 due to strong growth momentum driven by AI power needs [21]. - **Google**: Engaging with OCP to upgrade AI infrastructure, including the introduction of the Mt. Diablo power rack for efficient power distribution [24][33]. - **Seagate**: Emphasized the complementary role of HDDs alongside SSDs for high-capacity storage in AI applications [39][41]. - **TSMC**: Focused on co-development of system-level standards to support higher performance compute systems [40]. Conclusion The OCP APAC Summit underscored the rapid evolution of AI infrastructure, highlighting the importance of collaboration among tech giants to address the challenges of power, cooling, and networking in data centers. The insights gained from this event will shape the future landscape of AI technology and its supporting ecosystem.