Core Viewpoint - ASML emphasizes the importance of collaboration and innovation in the semiconductor industry, particularly in the context of AI development and advanced packaging technologies [2][3][5]. Group 1: ASML's Participation in the Expo - ASML is participating in the China International Import Expo for the seventh time, showcasing its advanced lithography solutions, including the TWINSCAN NXT:870B and TWINSCAN XT:260 systems [2]. - The company aims to promote the spirit of open cooperation and share insights on industry developments rather than pursuing commercial objectives [2]. Group 2: AI and Semiconductor Demand - AI is projected to contribute approximately $13 trillion to global GDP by 2030, indicating a significant increase in demand for various semiconductor chips beyond just high-end GPUs and HBM [3]. - The demand for semiconductors will encompass a wide range of chips, including mature process logic chips and sensors, as AI applications expand into consumer and industrial sectors [3]. Group 3: Technological Innovations in Chip Development - The semiconductor industry is expected to focus on two core innovation routes: 2D scaling through transistor size reduction and 3D integration for stacking and packaging [6]. - ASML's XT:260 lithography system supports advanced packaging applications, which are crucial in the post-Moore's Law era [5][6]. Group 4: Advanced Packaging and 3D Integration - The XT:260 system utilizes a unique dual-stage technology and is designed for large field exposure, which enhances efficiency and yield in advanced packaging processes [6][7]. - ASML's solutions also support core bonding processes for 3D integration, reducing wafer deformation and alignment errors, thus meeting the growing demands in emerging application areas [7].