Core Viewpoint - The article emphasizes the importance of interconnect architecture in AI infrastructure, highlighting that while GPUs are crucial, the ability to train and run large models relies heavily on effective interconnect systems [1]. Group 1: Interconnect Architecture - Interconnect architecture encompasses various levels, including chip-to-chip communication within packages and system-level networks that support thousands of accelerators [1]. - Nvidia's dominance in the industry is attributed to its expertise in developing and integrating these interconnect architectures [1]. - Broadcom has been quietly advancing various technologies related to interconnect architecture, including Ethernet architectures for large-scale expansion and internal chip interconnect technologies [1][3]. Group 2: Ethernet Switch Technology - Broadcom has introduced high-capacity switches, such as the 51.2Tbps Tomahawk 5 and the recently launched 102.4Tbps Tomahawk 6, which can significantly reduce the number of switches needed for large GPU clusters [3]. - The number of switches required decreases as the switch's port count increases, allowing for more efficient connections among GPUs [3]. - Nvidia has also announced its own 102.4Tbps Ethernet switch, indicating a competitive landscape in high-capacity switch technology [4]. Group 3: Scalable Ethernet Solutions - Broadcom's Tomahawk 6 switches are positioned as a shortcut for rack-level architectures, supporting between 8 to 72 GPUs, with future designs expected to support up to 576 GPUs by 2027 [6]. - Ethernet technology is being utilized for both scalable and large-scale networks, with Intel and AMD also planning to implement Ethernet for their systems [7]. Group 4: Co-Packaged Optics (CPO) Technology - Broadcom has invested in co-packaged optics (CPO) technology, which integrates components typically found in pluggable transceivers into the same package as the switch ASIC, significantly reducing power consumption [9][10]. - The efficiency of Broadcom's CPO technology is reported to be over 3.5 times that of traditional pluggable devices [10]. - The third generation of CPO technology is expected to support up to 512 200Gbps optical ports, with future developments aiming for 400Gbps channels by 2028 [11]. Group 5: Multi-Chip Architecture - As Moore's Law slows, the industry is shifting towards multi-chip architectures, allowing for higher yields and optimized costs by using smaller chips [14]. - Broadcom has developed a 3.5D eXtreme Dimension System in Package (3.5D XDSiP) technology to facilitate the design of multi-chip processors, which is open for licensing to other companies [15]. - The first products based on this design are expected to enter production by 2026, although the specific applications of Broadcom's technology in AI chips may remain undisclosed [15].

Core Insights - The article discusses the competitive landscape of AI networking, highlighting the advantages of InfiniBand over Ethernet in large data centers, particularly in the context of NVIDIA's dominance in the GPU market [1][6][13]. Broadcom Tomahawk 6 - Broadcom announced the shipment of the Tomahawk 6 (TH6) switch chip, which utilizes 3nm technology and supports up to 102.4Tbps switching capacity, doubling the capacity of current mainstream Ethernet switch chips [2][4]. - The TH6 chip is priced at under $20,000, nearly double that of its predecessor, but offers significant performance improvements that justify the cost [2][4]. AI Network Optimization - TH6 excels in both scale-out and scale-up architectures, allowing connections to up to 100,000 XPUs and supporting 512 XPU single-hop connections, significantly reducing latency and power consumption [3][9]. - The chip features Cognitive Routing 2.0 technology, optimized for modern AI workloads, enhancing global load balancing and dynamic congestion control [3][9]. Market Trends - The introduction of TH6 is expected to drive rapid growth in the demand for 1.6T optical modules and data center interconnects, marking a new technology upgrade cycle in the global AI infrastructure market [4][10]. - The global optical circuit switch hardware sales are projected to grow at a CAGR of 32% from 2023 to 2028, outpacing Ethernet and InfiniBand switches [10]. Ethernet vs InfiniBand - Approximately 78% of top supercomputers use Ethernet solutions based on RoCE, while 65% utilize InfiniBand, indicating a competitive dynamic between the two technologies [13][16]. - InfiniBand has gained traction in the early stages of generative AI infrastructure deployment due to NVIDIA's market position, although Ethernet is expected to regain momentum as cloud service providers invest in self-developed ASIC projects [16]

截至2025年6月16日 11:27，上证科创板芯片指数下跌0.13%。成分股方面涨跌互现，源杰科技领涨 6.68%，睿创微纳上涨3.07%，甬矽电子上涨2.74%；思瑞浦领跌，安集科技、乐鑫科技跟跌。科创芯片 ETF(588200)多空胶着。拉长时间看，截至2025年6月13日，科创芯片ETF近1年累计上涨51.49%。 数据显示，杠杆资金持续布局中。科创芯片ETF最新融资买入额达7748.95万元，最新融资余额达13.94 亿元。 截至6月13日，科创芯片ETF近1年净值上涨50.68%，指数股票型基金排名70/2854，居于前2.45%。从收 益能力看，截至2025年6月13日，科创芯片ETF自成立以来，最高单月回报为25.18%，最长连涨月数为4 个月，最长连涨涨幅为36.01%，上涨月份平均收益率为8.58%。 流动性方面，科创芯片ETF盘中换手1.6%，成交4.07亿元。拉长时间看，截至6月13日，科创芯片ETF近 1年日均成交22.76亿元，排名可比基金第一。 规模方面，科创芯片ETF近1月规模增长6.84亿元，实现显著增长，新增规模位居可比基金第一。份额 方面，科创芯片ETF近2周份额增长3. ...

今日早参 2025 年 6 月 11 日 王兴 通信与军工行业首席研究员 座机：021-38476737 邮箱：wangxing@htsc.com 沈娟 银行与证券行业首席研究员 座机：0755-23952763 邮箱：shenjuan@htsc.com 免责声明和披露以及分析师声明是报告的一部分，请务必一起阅读。 1 沈娟 银行与证券行业首席研究员 座机：0755-23952763 邮箱：shenjuan@htsc.com 今日热点 通信：CPO 观察：博通的进展 近期我们观察到博通的 CPO（光电共封装）取得积极进展：1）5 月博通推 出单通道 200G 的 CPO 产品系列；2）6 月博通宣布交付 Tomahawk 6 （TH6）交换芯片，除支持常规电交换机外，TH6 亦可提供 CPO 版本。我 们认为博通与英伟达均在 CPO 领域加速推进，预计该类科技巨头厂商将共 同推动 CPO 技术的落地，促进产业链生态的成熟。我们看好 CPO 产业发展 前景，相关光无源器件、光芯片、光引擎厂商有望迎接机遇，推荐：太辰 光、天孚通信；建议关注：中际旭创、新易盛、华工科技。 风险提示：CPO 产业进展不及预期；AI ...

华泰研究 2025 年 6 月 10 日│中国内地 动态点评 证券研究报告 科技 CPO 观察：博通的进展 CPO 产业观察：博通的进展 近期我们观察到博通的 CPO（光电共封装）取得积极进展：1）5 月博通推 出单通道 200G 的 CPO 产品系列；2）6 月博通宣布交付 Tomahawk 6（TH6） 交换芯片，除支持常规电交换机外，TH6 亦可提供 CPO 版本。我们认为博 通与英伟达均在 CPO 领域加速推进，预计该类科技巨头厂商将共同推动 CPO 技术的落地，促进产业链生态的成熟。我们看好 CPO 产业发展前景， 相关光无源器件、光芯片、光引擎厂商有望迎接机遇，推荐：太辰光、天孚 通信；建议关注：中际旭创、新易盛、华工科技。 博通是 CPO 产业的先行者之一；产品交付形态与 NV 有所不同 博通是全球率先推动 CPO 技术落地的厂商之一，早在 2022 年举办的 OFC、 OCP 等会议中，博通分享了基于 TH4 芯片 CPO 方案 Humboldt 的进展， 带宽为 25.6T；OFC 2023 中，博通展示了基于 TH5 芯片的 CPO 方案 Bailly 的进展，带宽达 51.2T。从产品交 ...

证 券 研 究 报 告 通信行业周报（20250602-20250608） 博通 TH6 芯片正式交付；看好 A 股科技板块价值 推荐（维持） 证券分析师：欧子兴 邮箱：ouzixing@hcyjs.com 执业编号：S0360523080007 行业基本数据 | | | 占比% | | --- | --- | --- | | 股票家数(只) | 124 | 0.02 | | 总市值(亿元) | 48,971.71 | 4.88 | | 流通市值(亿元) | 21,813.38 | 2.74 | 相对指数表现 | % | 1M | 6M | 12M | | --- | --- | --- | --- | | 绝对表现 | 7.2% | 2.2% | 30.5% | | 相对表现 | 5.5% | 4.7% | 22.7% | 回归 行业研究 通信 2025 年 06 月 08 日 华创证券研究所 -12% 7% 26% 45% 24/06 24/08 24/10 25/01 25/03 25/06 2024-06-07~2025-06-06 通信 沪深300 相关研究报告 《通信行业周报（20250526-2 ...

博通 TH6 芯片正式交付；看好 A 股科技板块价值 推荐（维持） 回归 行业研究 通信 2025 年 06 月 08 日 证 券 研 究 报 告 通信行业周报（20250602-20250608） 华创证券研究所 证券分析师：欧子兴 邮箱：ouzixing@hcyjs.com 执业编号：S0360523080007 行业基本数据 | | | 占比% | | --- | --- | --- | | 股票家数(只) | 124 | 0.02 | | 总市值(亿元) | 48,971.71 | 4.88 | | 流通市值(亿元) | 21,813.38 | 2.74 | 相对指数表现 | % | 1M | 6M | 12M | | --- | --- | --- | --- | | 绝对表现 | 7.2% | 2.2% | 30.5% | | 相对表现 | 5.5% | 4.7% | 22.7% | -12% 7% 26% 45% 24/06 24/08 24/10 25/01 25/03 25/06 2024-06-07~2025-06-06 通信 沪深300 相关研究报告 《通信行业周报（20250526-2 ...