| | 特定对象调研 □分析师会议 ☑ | | | --- | --- | --- | | 投资者关系活动 | □媒体采访 □业绩说明会 | | | 类别 | □新闻发布会 □路演活动 | | | | □现场参观 | | | | □其他 （电话会议） | | | | 睿扬投资 张 凯 长江资产 严艺鸣 | | | | Hill House 苏雅馨 徐嘉辰 | 交银基金 | | | 泰康资产 刘 宁 Trumed Capital HENRY LIU | | | 时间 | 2026 年 2 月 27 日 10:00-11:30 | | | 地点 | 公司 A 栋四楼会议室 | | | 上市公司接待人 | 董事长 戴军先生 | | | 员姓名 | 董事会秘书 李良玉女士 | | | | 一、公司近期概况 | | | | 董事长戴军先生向各位参会方就公司收购的 公 ficonTEC | | | | 司的发展历史、光电子业务板块的行业发展状况及业务展望等 | | | | 方面进行了总体介绍。 | | | 投资者关系活动 | 二、问题交流 | | | 主要内容介绍 | 1、戴总，能否展望一下 CPO 技术的市场前景？公司 ...

1）海外客户：Lumentum的2025年订单6000万元（供应光纤打磨、AOI、耦合设备），在2026年确收4000-5000 万，2026年订单预计1+亿元，设备交付周期6-9月，CPO技术路径量产预计2027年开始。 2025年开始与Finisar合作（耦合样机），2026年耦合机订单2000-6000万，与罗博存在竞争，但设备功能有差异。 2）国内客户：给H客户供应光模块和半导体设备，2025年营收1-2亿；给X客户供应超高精度零部件与设备，设备 单机价值量高，2025年有零部件订单2000万、设备订单2000万，2026年预计零部件2亿订单、设备订单4000-6000 万。 【科瑞技术】光模块与半导体设备交流更新： 1）海外客户：Lumentum的2025年订单6000万元（供应光纤打磨、AOI、耦合设备），在2026年确收4000-5000 万，2026年订单预计1+亿元，设备交付周期6-9月，CPO技术路径量产预计2027年开始。 2025年开始与Finisar合作（耦合样机），2026年耦合机订单2000-6000万，与罗博存在竞争，但设备功能有差异。 【科瑞技术】光模块与半导体设备交流更新： ...

（记者 张明双） 锐捷网络（301165.SZ）2月27日在投资者互动平台表示，近年来，公司持续开展CPO技术和解决方案的 研究探索，已有CPO技术储备，在2025年深圳中国国际光电博览会上，首次对外公开了51.2T CPO交换 机商用互联方案，该方案能够满足AI训练及超大规模计算集群对高速互联的持续增长需求，并为未来 800G和1.6T网络升级提供了可行的技术路径。 每经AI快讯，有投资者在投资者互动平台提问：请问贵司在CPO交换机上的产业进展如何？位于数通行 业什么水平？是否量产出货？ ...

| 菲利华 | | | | --- | --- | --- | | 4/3 | 300395.SZ | +5.21% | | 沪电股份 | | --- | 龙虎榜机构热股 龙虎榜显示，今日2家机构净买入3.84亿。 今天机构龙虎榜上榜43只个股，净买入29只，净卖出13只。当日机构买入最多的个股前三位是：润泽科技（6.05亿）、沪电股份（3.84亿）、菲利华（3.32 亿）。 公司国内规模最大、技术实力最强的PCB制造商之一，是英伟达 AI 服务器 PCB 主力供应商。 | 上榜热股 | 实时涨跌幅 ◆ 买/卖家数 ◆ | | --- | --- | | 润泽科技 | | | 300442.SZ | +17.71% 2/2 | | 3日 | | | 沪电股份 | | | 002463.SZ | +10.00% 2/2 | | 3日 | | 龙虎榜知名游资 公司参股子公司熹联光芯的硅光芯片可以用于CPO 杰普特 一、液冷 高澜股份 个股龙虎榜 公司为字节跳动公司提供的12U浸没液冷模组，是业内首款一体式浸没液冷产品 消息面上，2月25日，英伟达AI基础设施负责人Dion Harris在加州总部向媒体展示了下一代 ...

据《证券时报网》消息，北京时间2月26日凌晨，英伟达公布了截至2026年1月31日的公司2026财年第四 财季（以下简称"第四财季"）财务数据，以及2027财年第一财季（以下简称"第一财季"）的业绩指引。 财报显示，英伟达第四财季营收681亿美元，同比增长73%，市场预期为656.84亿美元，上年同期为 393.31亿美元。其中，数据中心营收为623亿美元，高于市场预期的606.2亿美元，上年同期为355.8亿美 元；四季度网络营收109.8亿美元，高于分析师预期的90.2亿美元；四季度游戏营收37亿美元，不及分析 师预期的40.1亿美元。市场高度关注的业绩指引方面，英伟达预计第一财季营收764.4亿美元—795.6亿 美元，高于市场预估的727.8亿美元。 英伟达创始人兼CEO黄仁勋在财报中表示，"计算需求正呈指数级增长——AI智能体的转折点已经到 来。企业对智能体的应用正在飞速增长。我们的客户正竞相投资AI计算——这些计算能力是推动AI产 业革命和未来发展的动力源泉。" 2. 光模块与CPO（共封装光学）领域：光通信是AI集群互联的"大动脉"，其技术迭代速度直接决定了算 力网络的性能上限，也是解决"内存墙 ...

智通财经APP获悉，鸿腾精密(06088)盘中涨超7%，截至发稿，涨6.56%，报6.01港元，成交额2.38亿港 元。 国投证券国际此前发布研报称，鸿腾精密当前处于估值体系切换的关键窗口期，市场长期将其视为传统 的"消费电子组装/线缆厂"，然而随着公司在AI服务器互连（背板、铜缆、液冷）及电动车业务的实质 性突破，其营收结构正向高毛利、高壁垒的"连接器与核心组件厂"转型。公司在光模块、CPO（光电共 封装）技术、车用高压连接器等高毛利新产品的客户认证及量产进度，将是优化产品结构、推动整体毛 利率持续改善的关键。2026年高毛利相关业务预计迎来业绩放量。 ...

Group 1 - The core viewpoint of the article is that Tengjing Technology is developing its self-researched CPO (Co-Packaged Optics) optical connector products, which are currently in the validation phase [1] - The company has demonstrated capabilities in high-density connections, low-loss coupling, and high-precision alignment, indicating readiness for the upcoming scale application of CPO technology in 2026-2027 [1]

Summary of Key Points from the Conference Call Industry Overview - The consumer electronics market is expected to shrink, with mobile phone and PC shipments projected to decline by 6.7% and 10% respectively. However, the semiconductor market is forecasted to grow robustly, potentially reaching $1 trillion by 2026, with storage growth nearing 40% and logic chip growth exceeding 30% [2][3][21]. Core Insights and Arguments - The storage supercycle significantly enhances corporate profits, with DRAM prices expected to rise by 105% to 110% quarter-over-quarter in Q1, far exceeding the previous quarter's increase [2][5]. - The supply side of DRAM is projected to grow by approximately 20% this year, primarily driven by technological upgrades due to cleanroom space limitations. Major new capacity releases are not expected until 2027, indicating a continued supply-demand imbalance unless consumer electronics demand drops significantly [2][6][7]. - South Korea's semiconductor industry benefits from a national system and sustained investment, with Samsung expected to regain its lead in HBM4 technology through vertical integration and favorable diplomatic policies [2][8]. Pricing and Market Dynamics - The pricing model in the memory market is heavily influenced by the channel market, with significant price increases expected in Q1, ensuring strong performance for related companies even if shipment volumes remain unchanged [2][9]. - The semiconductor industry's valuation is currently low, but there is potential for expansion during upward cycles. For instance, the P/E ratios for Hynix, Samsung, and Micron are significantly lower than those of semiconductor equipment companies, suggesting that increased investor confidence could drive valuations higher [4][15]. Competitive Landscape - Samsung and Hynix have a competitive edge in HBM4 technology, utilizing logic-based die processes, while Micron continues to use traditional memory-based die, placing it at a disadvantage [4][11]. - Samsung's storage business is characterized by strong cyclicality, with potential operating profit margins exceeding 40% during peak periods. Current projections indicate a positive trend for Q1 profits compared to Q4 of the previous year [12]. Future Outlook - The global smartphone market's supply-demand balance hinges on a significant drop in terminal demand. A hypothetical 20% decrease in global smartphone sales could lead to substantial declines for other brands, particularly Chinese manufacturers [10]. - The development of advanced packaging technologies, such as CPO (Co-Packaged Optics), is gaining traction, with companies like Samsung and ASE emphasizing the integration of front-end design to enhance performance and efficiency [19][20]. Conclusion - The semiconductor industry, particularly in the storage segment, is poised for significant growth despite challenges in the consumer electronics market. The interplay of supply constraints, technological advancements, and competitive dynamics will shape the industry's trajectory in the coming years [2][3][21].

Core Viewpoint - The company, Huilv Ecology, is actively exploring and laying out CPO technology based on its accumulated expertise in silicon photonics technology [2] Group 1: Core Technologies - The company possesses multiple core technologies including general optical path technology for silicon optical modules, silicon chip and optical engine technology, self-detection closed-loop control solutions for silicon optical coupling, and synchronous automatic coupling technology with dual lenses [2] - These technological advancements position the company favorably within the silicon photonics sector [2]

Summary of Conference Call Notes Industry Overview - The focus is on the AI networking sector, particularly the advancements in CPO (Coherent Passive Optical) technology and its implications for data centers and optical interconnects [1][2][3]. Key Points and Arguments 1. **CPO Technology Developments**: - Coherent has secured a significant order from a leading AI data center client for its CPO system, with initial revenue expected to start in Q4 2026 and become more substantial in 2027 [1]. - Lumentum has also received commitments worth hundreds of millions for Scale-out CPO CWLasers, with mass production contributions anticipated to begin in H1 2027 [1]. 2. **Market Projections**: - It is estimated that laser suppliers like LITE and COHR will have a combined order value of $400 million in 2027, leading to the shipment of approximately 80,000 Scale-out CPO switches that year [1]. - Nvidia is expected to accelerate the rollout of Scale-out CPO switches, with projected shipments of 2,000 units in 2025, 20,000 in 2026, and 80,000 in 2027 [2]. 3. **Nvidia's Product Launches**: - Nvidia plans to launch its Quantum-X Scale-out CPO switch in H2 2025 and Spectrum-X in H2 2026, with the first generation featuring a pluggable architecture [2]. - The new generation CPO switch is anticipated to have significant improvements in thermal performance and bandwidth, with production ramping up in Q2 2026 [2]. 4. **Long-term Opportunities**: - Lumentum highlighted that as copper interconnects approach their limits, optical Scale-up presents a long-term structural opportunity starting from late 2027 [3]. - Nvidia is expected to introduce CPO/NPO technology within its NVL576 architecture for Scale-up interconnects, indicating a competitive landscape between CPO and NPO technologies [3]. 5. **Beneficiary Companies**: - Key beneficiaries identified include FAU, CWLaser, ELSFP modules, and Shuffle components suppliers [4]. - Lumentum is viewed positively due to the upward demand for CWLasers, while the impact on Coherent is considered neutral [4]. - Browave is expected to benefit significantly due to its 50% market share in the CPO Shuttle Box sector, with production ramping up in Q2 2026 [4]. Additional Important Insights - The competition between CPO and NPO technologies is expected to continue, with both solutions sharing the same suppliers, indicating a complex supply chain dynamic [3]. - The overall market for Scale-up CPO is seen as a pure incremental opportunity for the optical interconnect supply chain, aimed at replacing copper interconnects without affecting Scale-out solutions [3].