Vera Rubin系列
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英伟达新平台拉动机柜需求 机壳厂商订单爆满
Jing Ji Ri Bao· 2026-03-22 22:59
机柜业者分析,下半年将问世的Vera Rubin系列NVL 576单柜功耗则直冲600kW,传统Sidecar无法应付 如此高的热密度,因此需要增加柜数,并且从选配变成标配,Sidecar数量也直接倍增,进而推升市场需 求火热。 业界人士说明,Vera Rubin系列大幅增加Sidecar数量,主因包括新平台在电力与散热等方面设计出现大 幅更动;其中,电力部分因舍弃传统交流电,改用直流电供电系统,带动电源层与高效率汇流排的需求 增加,必须独立搭载一个Sidecar。 英伟达最新Vera Rubin平台将从下半年开始出货,机柜需求暴增三倍,引爆AI界「抢机柜大战」。 「机 壳三雄」勤诚(8210)、jpp-KY(5284)、晟铭电(3013)订单随终端需求呈现「倍数式爆发增 长」,订单直达明年。 Vera Rubin平台电源负载量更大,必须新增二至三个机柜置放电源与散热交换器并列为标配,较既有AI 伺服器仅需搭载一个机柜暴增二至三倍。 这是AI市场继抢AI芯片、抢存储、抢电力之后,再掀一波新抢料/资源大战,且机柜需求增加量呈现 数倍增幅,也让相关供应商成为市场新宠儿。 业界人士指出,搭载Vera Rubin平台 ...
AMD(AMD.US)发布两代旗舰AI芯片欲叫板英伟达 大摩:MI400或成关键拐点
智通财经网· 2025-06-13 12:52
Core Viewpoint - AMD has unveiled its strongest AI product lineup to date, including flagship data center AI chips and infrastructure, aiming to compete with Nvidia in the AI market [1] Group 1: Product Launch - Key products announced include the AMD Instinct MI350 series and the upcoming MI400 series, along with a new AI software stack, ROCm 7.0, and next-generation Helios infrastructure [1] - The MI400 series is designed for large-scale training and distributed inference, featuring peak performance of 40 PFLOPS at FP4 precision and 20 PFLOPS at FP8, with 432GB HBM4 memory and 19.6TB/s memory bandwidth [2] Group 2: Market Impact - Morgan Stanley analysts view the MI400 series as a potential long-term turning point for AMD, with the MI400/450 products expected to have a significant impact if delivered on time [1][2] - The performance improvement of the MI400 series is noted to be up to 10 times compared to the MI355X, indicating a strong competitive edge [2] Group 3: Strategic Partnerships - Sam Altman, CEO of OpenAI, highlighted the collaboration with AMD on the MI300X and MI450, which adds credibility to AMD's projected "billions of dollars in AI annual revenue" [3] - AMD emphasized its resource integration capabilities through 25 acquisitions and investments over the past year, which are crucial for competing against larger rivals [3]