Core Insights - The release of Xpeedic EDA 2025 software suite by Xinheng Semiconductor includes three core platforms: Chiplet advanced packaging design platform, packaging/PCB full-process design platform, and integrated system simulation platform [1] - The founder and president of Xinheng Semiconductor, Dr. Dai Wenliang, emphasized that the software aims not only for domestic use but also to compete in the international market [1] - The semiconductor industry is undergoing a comprehensive transformation driven by the implementation of the State Council's "Artificial Intelligence +" initiative, with a surge in demand for AI large model training and the need for advanced packaging solutions due to the slowdown of Moore's Law [1] Industry Trends - The integration of EDA and AI is highlighted as a significant industry trend, with the company leveraging 15 years of experience to enhance cross-scale simulation efficiency and support large-scale system-level optimization [2] - The domestic semiconductor industry's development is characterized by using mathematical models to compensate for physical limitations, reducing the need for physical prototype validation through numerical simulations [2] - Advanced packaging techniques, such as heterogeneous integration and Chiplet, are being utilized to address cost and yield issues associated with advanced processes, while innovative computing architectures are being developed to overcome performance ceilings of process nodes [2]

Core Viewpoint - The 2025 Chip and Semiconductor User Conference in Shanghai focuses on the integration of AI and EDA, exploring new paradigms for hardware design innovation and ecosystem development in the AI era [1][3]. Group 1: Industry Trends - The semiconductor industry is undergoing comprehensive transformation driven by the demand for AI large model training and the slowdown of Moore's Law, necessitating a shift from single-chip design to packaging-level collaborative optimization [3][5]. - The design of AI data centers has evolved into a complex system engineering challenge, requiring EDA to upgrade from DTCO to a full-link STCO approach, enabling capabilities from chip to system [3][5]. Group 2: Strategic Positioning - Chip and Semiconductor aims to advance its "Born for AI" strategy, focusing on both EDA FOR AI and AI+EDA, leveraging partnerships across the AI hardware ecosystem [5][6]. - The company has established a first-mover advantage in the "full-stack EDA from chip to system" domain, supporting vertical and horizontal expansions of AI computing power [6][9]. Group 3: Product Launch - The Xpeedic EDA 2025 software suite was launched, featuring three core platforms: Chiplet advanced packaging design, packaging/PCB full-process design, and integrated system simulation, addressing challenges in AI hardware design [5][6]. - Six industry solutions were introduced, including advanced packaging, RF, storage, power, data center, and smart terminal solutions, to facilitate comprehensive deployment [5][6]. Group 4: Ecosystem Collaboration - The conference included technical forums on AI HPC and high-frequency interconnects, showcasing collaborative efforts among various industry players to tackle key technology challenges in the semiconductor sector [8][9]. - The EDA ecosystem display area featured partnerships with multiple companies, emphasizing the collaborative advantages in advancing China's integrated circuit industry [8][9].