Core Viewpoint - The company Huaitian New Materials (300041.SZ) has indicated that its semiconductor adhesive products are primarily used in the semiconductor packaging (back-end) sector, including underfill, edgebond, TIM, and LID bonding [1] Group 1 - The company's semiconductor adhesive products include underfill, edgebond, TIM, and LID bonding [1] - These products are mainly applied in the semiconductor packaging (back-end) field [1]