国泰海通证券股份有限公司 经公司董事会于2025年8月28日作出决议，同意委任陈一敏女士担任公司的执行 副总裁；同时，公司认定陈广龙先生为公司的核心技术人员。陈一敏女士与陈广龙 先生的简历如下： 聘任高级管理人员及核心技术人员调整的核查意见 国泰海通证券股份有限公司（以下简称"保荐机构"）作为华虹半导体有限公 司（以下简称"华虹公司"或"公司"）首次公开发行人民币普通股（A股）股票并 在科创板上市的保荐机构，根据《证券发行上市保荐业务管理办法》《上海证券交 易所科创板股票上市规则》《上海证券交易所上市公司自律监管指引第11号——持 续督导》《上海证券交易所科创板上市公司自律监管指引第1号——规范运作》等有 关规定，对华虹公司高级管理人员暨核心技术人员调整的事项进行了审慎核查，具 体情况如下： 一、委任高级管理人员及核心技术人员的情况 陈一敏女士，43岁，现任公司、上海华虹宏力半导体制造有限公司（以下简称 "上海华虹宏力"）、华虹半导体（无锡）有限公司（以下简称"华虹无锡"）及 华虹半导体制造（无锡）有限公司（以下简称"华虹制造"）执行副总裁、上海华 虹宏力党委副书记，协管人力资源工作。陈一敏女士于二零二二年一 ...

华虹半导体有限公司 信息披露管理制度 HUA HONG SEMICONDUCTOR LIMITED （华虹半导体有限公司） 信息披露管理制度 第一章 总则 第一条 为规范HUA HONG SEMICONDUCTOR LIMITED（华虹半导体有限公司） （以下简称"公司"）信息披露，促进公司依法规范运作，维护公司和投资者的 合法权益，依据《上市公司信息披露管理办法》（以下简称"《管理办法》"）、 《上海证券交易所科创板股票上市规则》（以下简称"《上市规则》"）等法律、 法规和规范性文件以及《HUA HONG SEMICONDUCTOR LIMITED（华虹半导体有限公 司）组织章程细则》（以下简称"《公司章程》"）的相关规定，制定本制度。 第二条 本制度所称信息披露是指达到中国境内（仅为本制度之目的，不包 括香港特别行政区、澳门特别行政区及台湾地区，下同）证券监管部门关于上市 公司信息披露的标准要求，根据相关法律、法规、部门规章及证券监管部门的规 范性文件，将可能对公司股票及衍生品种交易价格产生较大影响或者对投资决策 有较大影响而投资者尚未得知的重大信息（以下简称"重大信息"），在规定时 间内，通过规定的媒体 ...

华虹半导体有限公司 关连（联）交易管理制度 HUA HONG SEMICONDUCTOR LIMITED （华虹半导体有限公司） 关连（联）交易管理制度 第一章 总则 第一条 为 HUA HONG SEMICONDUCTOR LIMITED（华虹半导体有限公司）（以下 简称"公司"）的关连/关联交易决策事宜，提高公司规范运作水平，保护广大投 资者特别是中小投资者的合法权益，根据《中华人民共和国证券法》《上海证券 交易所科创板股票上市规则》（以下简称"《科创板上市规则》"）、《香港联合交易 所有限公司证券上市规则》（以下简称"《香港上市规则》"）等法律、法规、规范 性文件和《HUA HONG SEMICONDUCTOR LIMITED（华虹半导体有限公司）组织章程 细则》（以下简称"《公司章程》"）的有关规定，特制订本制度。 第二条 公司对关连/关联交易实行分类管理，按照《香港上市规则》和《科 创板上市规则》确认关连/关联人范围，并按照相应规定履行关连/关联交易审批、 信息披露等程序。 公司与关联方之间的关连/关联交易行为除遵守有关法律、法规、规范性文 件和《公司章程》的规定外，还需遵守本制度的相关规定。 第三 ...

华虹半导体有限公司 对外担保管理制度 HUA HONG SEMICONDUCTOR LIMITED （华虹半导体有限公司） 对外担保管理制度 第一章 总则 第一条 为规范HUA HONG SEMICONDUCTOR LIMITED（华虹半导体有限公司） （以下简称"公司"）的担保行为，控制公司经营与财务风险，根据香港法例第 622章《公司条例》（以下简称"《公司条例》"）、《上海证券交易所科创板 股票上市规则》（以下简称"《上交所上市规则》"）、《香港联合交易所有限 公司证券上市规则》（以下简称"《港交所上市规则》"，与《上交所上市规则》 合称"公司上市地规则"）、《上市公司监管指引第8号——上市公司资金往来、 对外担保的监管要求》等法律、法规、规范性文件及《华虹半导体有限公司组织 章程细则》（以下简称"《公司章程》"）的有关规定，结合公司实际情况，制 定本制度。 第二条 本制度所述的对外担保系指公司为他人提供的担保，包括公司对控 股子公司的担保。担保形式包括保证、抵押、质押或法律法规允许的其他形式。 第三条 公司股东大会和董事会是对外担保的决策机构，公司对外担保须按 程序经公司股东大会或董事会审议批准。未经 ...

华虹半导体有限公司 募集资金管理制度 HUA HONG SEMICONDUCTOR LIMITED （华虹半导体有限公司） 募集资金管理制度 第一章 总则 第一条 为规范HUA HONG SEMICONDUCTOR LIMITED（华虹半导体有限公司） （以下简称"公司"）募集资金管理，提高募集资金使用效率，根据《上海证券 交易所科创板股票上市规则》（以下简称"《上交所上市规则》"）、《上市公 司募集资金监管规则》《上海证券交易所科创板上市公司自律监管指引第1号— —规范运作》《香港联合交易所有限公司证券上市规则》（以下简称"《港交所 上市规则》"，与《上交所上市规则》合称"《上市规则》"）等有关法律、法 规和规范性文件的规定及《HUA HONG SEMICONDUCTOR LIMITED（华虹半导体有限 公司）组织章程细则》（以下简称"《公司章程》"）的有关规定，结合公司实 际情况，特制定本制度。 第二条 本制度所称募集资金是指公司在中国境内（仅为本制度之目的， 不包括香港特别行政区、澳门特别行政区及台湾地区，下同）通过向不特定对象 发行证券（包括首次公开发行股票、配股、增发、发行可转换公司债券、发行分 离 ...

（华虹半导体有限公司） 信息披露暂缓与豁免业务管理制度 第一章 总则 第一条 为了规范 HUA HONG SEMICONDUCTOR LIMITED（华虹半导体 有限公司）（以下简称"公司"）境内信息披露暂缓与豁免行为，依法合规履行信 息披露义务，保护投资者的合法权益，根据《中华人民共和国证券法》《上海证 券交易所科创板股票上市规则》（以下简称"《上市规则》"）、《上海证券交易所科 创板上市公司自律监管指引第 1 号——规范运作》《上市公司信息披露暂缓与豁 免管理规定》等相关法律、法规、规范性文件及《HUA HONG SEMICONDUCTOR LIMITED（华虹半导体有限公司）组织章程细则》（以下简称"《公司章程》"）等 的相关规定，特制定本制度。 华虹半导体有限公司 信息披露暂缓与豁免业务管理制度 HUA HONG SEMICONDUCTOR LIMITED 第二条 公司按照《上市规则》及上海证券交易所（以下简称"上交所"）其 他相关规则的规定，实施境内信息披露暂缓、豁免的，适用本制度。 第四条 出现下列情形之一的，公司和相关信息披露义务人应当及时披露重 大事项： （一）董事会已就该重大事项形成决议； ...

Financial Performance - Semiconductor Manufacturing International Corporation (SMIC) reported a revenue of $4.456 billion for the first half of the year, a year-on-year increase of 22%, with a net profit of $320 million, up 35.6% [2] - SF Holding announced a revenue of 146.858 billion yuan for the first half of 2025, a 9.26% increase year-on-year, with a net profit of 5.738 billion yuan, growing 19.37% [3] - CITIC Securities reported a net profit of 13.719 billion yuan for the first half of 2025, a 29.80% increase, with revenues of 33.039 billion yuan, up 20.44% [5] - China Galaxy Securities achieved a net profit of 6.488 billion yuan, a 47.86% increase, with revenues of 13.747 billion yuan, up 37.71% [9] - Zhongke Shuguang reported a net profit of 729 million yuan, a 29.39% increase, with revenues of 5.85 billion yuan, up 2.41% [6] - Lingzhi Software achieved a net profit of 112 million yuan, a significant increase of 1002.2%, despite a revenue decline of 3.04% to 516 million yuan [7] - XGIMI Technology reported a net profit of 88.662 million yuan, a 2062.34% increase, with revenues of 1.626 billion yuan, up 1.63% [12] - Zhongjin Gold reported a net profit of 2.695 billion yuan, a 54.64% increase, with revenues of 35.067 billion yuan, up 22.90% [13] - Zhongwei Company reported a net profit of 706 million yuan, a 36.62% increase, with revenues of 4.961 billion yuan, up 43.88% [14] - Huanhong Company reported a net profit of 74.3154 million yuan, a decline of 71.95%, with revenues of 8.018 billion yuan, up 19.09% [10] - Tianpu Company reported a net profit of 11.298 million yuan, a decline of 16.08%, with revenues of 151 million yuan, down 3.44% [15] Shareholding Changes - Hengsheng Energy announced that its actual controller, Du Shunxian, plans to reduce his stake by up to 2% through block trading, with a reduction period from September 22, 2025, to December 21, 2025 [16] - Jinghua New Materials announced that its controlling shareholder and actual controller, Zhou Xiaodong, along with others, plan to reduce their holdings by up to 3.01% through centralized bidding or block trading within three months from the announcement date [17]

Financial Performance - Hua Hong Semiconductor reported a revenue of RMB 1.2 billion for the first half of 2025, representing a year-on-year increase of 15% compared to RMB 1.04 billion in the same period of 2024[12]. - The company achieved a gross margin of 30% in the first half of 2025, up from 28% in the previous year, indicating improved operational efficiency[12]. - The company has set a revenue guidance of RMB 2.5 billion for the full year of 2025, reflecting a growth target of 20% compared to 2024[12]. - The company's operating revenue for the first half of the year reached ¥8,017,656,907.53, representing a 19.09% increase compared to ¥6,732,158,761.10 in the same period last year[17]. - The net profit attributable to shareholders decreased by 71.95% to ¥74,315,361.59 from ¥264,916,278.85 year-on-year[17]. - Basic earnings per share dropped by 73.33% to ¥0.04 from ¥0.15 in the same period last year[18]. - The total comprehensive loss for the first half of 2025 was ¥634,653,242.78, compared to a loss of ¥458,563,512.82 in the first half of 2024[129]. - The company reported a net profit distribution to owners of approximately ¥71.41 million during the period[135]. Research and Development - Hua Hong Semiconductor is investing RMB 500 million in R&D for new technologies and products, focusing on advanced semiconductor manufacturing processes[12]. - The company's R&D expenditure accounted for 11.99% of operating revenue, an increase of 0.49 percentage points from 11.50%[18]. - R&D expenditures totaled approximately ¥961.71 million in the current period, reflecting a year-on-year increase of 24.18%, with R&D expenses accounting for 11.99% of total revenue[40]. - R&D personnel increased to 1,408, representing 19.02% of total employees, up from 18.56% year-on-year[43]. - The company achieved 90% reliability assessment completion for 40nm embedded flash memory, with plans to meet automotive-grade requirements[41]. - The new generation of power devices has completed platform development, with 13 products entering risk production phase[42]. - The company has introduced 11 products for the new 40V BCD technology platform, enhancing key performance metrics by 30%[41]. Market and Industry Trends - User data showed a 20% increase in the number of active clients, reaching 150 clients in the semiconductor sector[12]. - In the first half of 2025, the global semiconductor market reached a sales figure of $366.7 billion, representing a year-on-year growth of approximately 16%[30]. - Revenue from the analog and power management platforms experienced double-digit growth year-on-year and quarter-on-quarter, driven by the demand for AI servers and related applications[32]. - The semiconductor industry is experiencing structural demand fluctuations, impacting revenue and profitability[48]. - The company is focusing on expanding applications in automotive electronics, industrial control, and consumer electronics[41]. Operational Capacity and Investments - The company plans to expand its production capacity by 25% by the end of 2025, aiming to meet the growing demand in the semiconductor market[12]. - The company reported a significant increase in long-term equity investments to ¥568,424,425.49 from ¥539,500,990.07, reflecting an increase of about 5.4%[124]. - The total cash outflow for the purchase of fixed assets and other long-term assets was RMB 6.593 billion, an increase of 85.19% year-on-year[60]. - The company received ¥7,170,320,000.00 in borrowings, a significant increase from ¥1,439,080,883.44 in the first half of 2024, indicating a shift towards leveraging debt for growth[133]. Risks and Challenges - The company has identified key risks including supply chain disruptions and competition in the semiconductor industry, which may impact future performance[12]. - The company faces risks related to supply chain disruptions and reliance on specific suppliers[49]. - The company is at risk of performance volatility due to market changes and increased competition[50]. - The gross margin of the main business may decline due to rising raw material costs and increased competition[51]. - The company’s tax expenses may be adversely affected if tax incentive policies change or if subsidiaries no longer meet qualification criteria[55]. Governance and Compliance - Hua Hong Semiconductor's board of directors confirmed that there are no significant governance issues affecting the integrity of the financial report[12]. - The company has not reported any significant litigation or arbitration matters during the reporting period[95]. - The company has not encountered any non-compliance issues with its controlling shareholders or actual controllers[95]. - The company has committed to reducing or avoiding related party transactions unless absolutely necessary, ensuring protection of shareholder interests[94]. Shareholder Information - The total number of ordinary shareholders was 37,424, with 37,356 holding A shares and 68 holding Hong Kong shares[110]. - The top ten shareholders hold a total of 1,719,999,598 shares, representing approximately 99.99% of the company's total share capital[111]. - HKSCC NOMINEES LIMITED is the largest shareholder with 738,355,823 shares, accounting for 42.75% of the total shares[111]. - The company plans to release 16,310,000 shares for trading on August 7, 2025, following the lifting of restrictions on certain shares[115]. Financial Position - The total assets decreased by 1.88% to ¥86,285,164,062.48 from ¥87,935,231,475.57 at the end of the previous year[17]. - The company's total liabilities decreased to ¥23,943,870,645.13 from ¥24,459,839,586.95, representing a decline of approximately 2.1%[125]. - The company's cash and cash equivalents were reported at ¥27,943,928,847.58, down from ¥32,494,785,434.49, indicating a decrease of about 14.1%[124]. - The total equity attributable to shareholders increased to ¥43,784,775,744.34 from ¥43,602,332,245.07 in the previous year[126].

| 股代码：688347 | A | A 股简称：华虹公司 | 公告编号：2025-021 | | --- | --- | --- | --- | | 港股代码：01347 | | 港股简称：华虹半导体 | | 华虹半导体有限公司 关于聘任高级管理人员及核心技术人员调整的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 一、委任高级管理人员及核心技术人员的情况 经公司董事会于 2025 年 8 月 28 日作出决议，同意委任陈一敏女士担任公司 的执行副总裁；同时，公司认定陈广龙先生为公司的核心技术人员。陈一敏女士 与陈广龙先生的简历如下： 陈一敏女士，43 岁，现任公司、上海华虹宏力半导体制造有限公司（以下 简称"上海华虹宏力"）、华虹半导体（无锡）有限公司（以下简称"华虹无 锡"）及华虹半导体制造（无锡）有限公司（以下简称"华虹制造"）执行副总 裁、上海华虹宏力党委副书记，协管人力资源工作。陈一敏女士于二零二二年一 月加入本公司，拥有近 20 年半导体行业工作经验，历任上海华虹宏力党委副书 记、纪委书 ...

华虹半导体有限公司 关于 2025 年度"提质增效重回报"行动方案的 半年度评估报告 华虹半导体有限公司（以下简称"公司"、"本公司"、"华虹公司" 或"华虹半导体"）为贯彻落实科创板上市公司"提质增效重回报"专项 行动，于 2025 年 3 月 27 日发布了《华虹半导体有限公司 2025 年度"提 质增效重回报"行动方案》。公司根据行动方案的内容，积极开展和落 实各项工作，现将 2025 年上半年公司行动方案主要举措的落实及进 展情况报告如下： 一、专注晶圆代工主营业务，优化运营效率，提升核心竞争力 2025 年上半年，在全球贸易及晶圆代工市场呈现一定波动的背 景下，公司聚焦自身产品、工艺、研发、供应链等核心竞争力的提升， 通过优化产品结构、深化成本管控及加速产能释放，实现了收入稳步 增长与盈利能力的显著提升，降本增效初见成果，主要营运指标持续 改善。 1、提升工艺水平，丰富产品组合，开拓新的应用领域 2025 年上半年，公司经营业绩稳中求进，整体销售额与出货量 同比、环比均保持增长趋势。报告期内实现营业收入人民币 80.18 亿 元，比上年同期增长 19.09%。 报告期内，公司加速推进核心技术迭代。受 ...