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红宝丽:2025年第三次临时股东会决议公告
Zheng Quan Ri Bao· 2025-09-09 13:22
(文章来源:证券日报) 证券日报网讯 9月9日晚间,红宝丽发布公告称,公司2025年第三次临时股东会于2025年9月9日召开, 审议通过了《公司关于对子公司泰兴化学增资的议案》等。 ...
红 宝 丽(002165) - 2025年第三次临时股东会决议公告
2025-09-09 10:45
证券代码:002165 证券简称:红宝丽 公告编号:临 2025-053 红宝丽集团股份有限公司 2、本次股东会无否决提案的情况; 3、本次股东会无修改提案的情况; 4、本次股东会以现场投票与网络投票相结合的方式召开。 二、会议召开和出席情况 公司2025年第三次临时股东会以现场投票与网络投票相结合的方式召开,现 场会议于2025年9月9日下午14时在公司综合楼会议厅召开,网络投票时间为2025 年9月9日(通过深圳证券交易所交易系统进行网络投票的时间为2025年9月9日上 午9:15-9:25,9:30-11:30;和下午 13:00-15:00;通过深圳证券交易所 互联网投票的时间为 2025年9月9日 9:15-15:00)。本次会议由公司董事会召 集,董事长芮敬功先生主持。 2025年第三次临时股东会决议公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整,没有虚 假记载、误导性陈述或重大遗漏 一、重要提示 1、红宝丽集团股份有限公司(以下简称"公司")于2025年8月22日在《证 券时报》和巨潮资讯网上刊登了《红宝丽集团股份有限公司关于召开2025年第三 次临时股东会的通知》; 四、律师出 ...
红 宝 丽(002165) - 2025年第三次临时股东会法律意见书
2025-09-09 10:45
国浩律师(南京)事务所 关于红宝丽集团股份有限公司 2025 年第三次临时股东会的 法律意见书 . 中国江苏省南京市汉中门大街 309 号 B 座 5-7-8 层 邮编:210036 5,7,8/F, Block B, 309 Hanzhongmen Street, Nanjing, China, 210036 电话/Tel: +86 25 8966 0900 传真/Fax: +86 25 89660966 网址/Website: http://www.grandall.com.cn 国浩律师(南京)事务所 法律意见书 国浩律师(南京)事务所 关于红宝丽集团股份有限公司 2025 年第三次临时股东会的 法律意见书 一、关于本次股东会的召集和召开程序 (一)本次股东会的召集 公司董事会于 2025 年 8 月 20 日召开公司第十一届董事会第二次会议,决定 于 2025 年 9 月 9 日召开公司 2025 年第三次临时股东会。公司董事会于 2025 年 8 月 22 日在指定媒体及网站上发布了《红宝丽集团股份有限公司关于召开 2025 年第三次临时股东会的通知》。上述通知中就本次股东会召开的时间、现场会议 地 ...
红宝丽涨2.08%,成交额1.23亿元,主力资金净流出539.62万元
Xin Lang Cai Jing· 2025-09-09 02:17
9月9日,红宝丽盘中上涨2.08%,截至09:37,报10.31元/股,成交1.23亿元,换手率1.68%,总市值75.81 亿元。 红宝丽所属申万行业为:基础化工-化学制品-聚氨酯。所属概念板块包括:风能、融资融券、新材料、 一带一路、QFII持股等。 截至6月30日,红宝丽股东户数15.46万,较上期增加13.85%;人均流通股4706股,较上期减少12.17%。 2025年1月-6月,红宝丽实现营业收入12.45亿元,同比减少1.10%;归母净利润2438.93万元,同比减少 35.51%。 分红方面,红宝丽A股上市后累计派现5.64亿元。近三年,累计派现1.32亿元。 责任编辑:小浪快报 资金流向方面,主力资金净流出539.62万元,特大单买入168.19万元,占比1.36%,卖出236.28万元,占 比1.92%;大单买入955.66万元,占比7.76%,卖出1427.19万元,占比11.58%。 红宝丽今年以来股价涨143.16%,近5个交易日涨3.72%,近20日涨11.94%,近60日涨11.22%。 今年以来红宝丽已经41次登上龙虎榜,最近一次登上龙虎榜为8月29日,当日龙虎榜净买入-2.8 ...
红宝丽:公司主要生产聚氨酯聚醚、异丙醇胺等产品
Zheng Quan Ri Bao Wang· 2025-09-08 08:44
证券日报网讯红宝丽(002165)9月8日在互动平台回答投资者提问时表示,目前公司主要生产聚氨酯聚 醚、异丙醇胺等产品,不涉及光刻机芯片领域。 ...
红宝丽(002165.SZ):不涉及光刻机芯片领域产品
Ge Long Hui· 2025-09-08 06:16
格隆汇9月8日丨红宝丽(002165.SZ)在互动平台表示,目前公司主要生产聚氨酯聚醚、异丙醇胺等产 品,不涉及光刻机芯片领域产品。 ...
红宝丽跌2.00%,成交额3.42亿元,主力资金净流出266.21万元
Xin Lang Cai Jing· 2025-09-05 02:13
9月5日,红宝丽盘中下跌2.00%,截至09:44,报10.28元/股,成交3.42亿元,换手率4.51%,总市值75.59 亿元。 资金流向方面,主力资金净流出266.21万元,特大单买入1887.54万元,占比5.51%,卖出2345.47万元, 占比6.85%;大单买入7353.39万元,占比21.47%,卖出7161.67万元,占比20.91%。 责任编辑:小浪快报 资料显示,红宝丽集团股份有限公司位于江苏省南京市高淳区经济开发区双高路29号,成立日期1994年 6月23日,上市日期2007年9月13日,公司主营业务涉及环氧丙烷衍生品,包括聚氨酯硬泡组合聚醚、异 丙醇胺系列产品,以及环氧丙烷、过氧化二异丙苯、聚氨酯保温板的研发、生产和销售。主营业务收入 构成为:环丙衍生品90.52%,材料贸易及其他9.40%,保温材料0.09%。 红宝丽所属申万行业为:基础化工-化学制品-聚氨酯。所属概念板块包括:融资融券、新材料、风能、 QFII持股、一带一路等。 截至6月30日,红宝丽股东户数15.46万,较上期增加13.85%;人均流通股4706股,较上期减少12.17%。 2025年1月-6月,红宝丽实现营业 ...
红宝丽8月29日龙虎榜数据
Zheng Quan Shi Bao Wang· 2025-08-29 13:04
具体来看,今日上榜的营业部中,共有2家机构专用席位现身,即买一、买三,合计买入金额1.06亿 元,卖出金额5116.46万元,合计净买入5466.88万元。 深交所公开信息显示,当日该股因日换手率达37.85%上榜,机构专用席位净买入5466.88万元。 证券时报·数据宝统计显示,上榜的前五大买卖营业部合计成交6.58亿元,其中,买入成交额为1.88亿 元,卖出成交额为4.70亿元,合计净卖出2.83亿元。 近半年该股累计上榜龙虎榜41次,上榜次日股价平均涨1.36%,上榜后5日平均涨8.03%。 红宝丽今日下跌0.90%,全天换手率37.85%,成交额27.97亿元,振幅6.28%。龙虎榜数据显示,机构净 买入5466.88万元,营业部席位合计净卖出3.37亿元。 红宝丽8月29日交易公开信息 | 买/ | 会员营业部名称 | 买入金额(万 | 卖出金额(万 | | --- | --- | --- | --- | | 卖 | | 元) | 元) | | 买一 | 机构专用 | 7973.93 | 4383.71 | | 买二 | 麦高证券有限责任公司北京分公司 | 3021.87 | 962.45 | | ...
龙虎榜 | T王近3亿元抢华胜天成,曲江池、低位挖掘爆买中国稀土,南京帮出逃!
Ge Long Hui· 2025-08-29 12:03
Market Overview - On August 29, major A-share indices rose collectively, with a total trading volume of 2.83 trillion yuan, a decrease of 170.7 billion yuan compared to the previous trading day [1] - Key market sectors included lithium batteries and lithium mining, which saw significant gains, while the semiconductor sector experienced a pullback [1] Stock Performance - A total of 64 stocks hit the daily limit up, with 9 stocks achieving consecutive limit ups, and 19 stocks failed to close at the limit, resulting in a limit-up rate of 77% (excluding ST and delisted stocks) [3] - Notable stocks included Tianpu Co., which achieved a limit up for the sixth consecutive day, and Dechuang Environmental, which reached a four-day limit up [4] Top Stocks on the Dragon and Tiger List - The top three net purchases on the Dragon and Tiger list were Tongfu Microelectronics, China Rare Earth, and Shengtun Mining, with net purchases of 747 million yuan, 545 million yuan, and 431 million yuan, respectively [2] - The top three net sales were Huasheng Tiancheng, Wantong Development, and Hongbaoli, with net sales of 479 million yuan, 401 million yuan, and 283 million yuan, respectively [6] Company Highlights - Tongfu Microelectronics reported a revenue of 13.038 billion yuan for the first half of the year, a year-on-year increase of 17.67%, and a net profit of 412 million yuan, up 27.72% year-on-year, exceeding expectations [9] - China Rare Earth expects a net profit of 136 million to 176 million yuan for the first half of 2025, representing a year-on-year increase of 155.75% to 172.12%, driven by rising rare earth prices and improved marketing strategies [12] - Shengtun Mining plans to repurchase shares worth 500 million to 600 million yuan at a price not exceeding 11.82 yuan per share, aimed at employee stock ownership or equity incentives [15] Institutional Activity - Institutional net purchases included Wancheng Group, Longyang Electronics, and Xianda Intelligent, with net purchases of 308 million yuan, 92.27 million yuan, and 71.57 million yuan, respectively [7] - Institutional net sales were led by Zhongcai Technology, Chuanrun Co., and Aerospace Hongtu, with net sales of 194 million yuan, 86.67 million yuan, and 72.50 million yuan, respectively [8]
为何需要先进封装?为何需要面板级封装?为何在高端市场基板如此重要?
材料汇· 2025-08-27 12:52
Market Overview - In 2024, the overall packaging market is expected to grow by 16% year-on-year to reach $105.5 billion, with the advanced packaging market growing by 20.6% to $51.3 billion, accounting for nearly 50% of the total [2][14]. - By 2030, the overall packaging market is projected to reach $160.9 billion, with advanced packaging expected to grow to $91.1 billion, resulting in a compound annual growth rate (CAGR) of 10% from 2024 to 2039 [2][14]. - The high-end market share is anticipated to increase from 8% in 2023 to 33% by 2029, driven by the demand from generative AI, edge computing, and intelligent driving ADAS [2][16]. Need for Advanced Packaging - The end of Moore's Law for advanced processes marks the beginning of the packaging Moore's Law, focusing on achieving higher performance at lower costs through system-level packaging techniques [3][30]. - The increasing demand for diverse functionalities leads to more frequent interactions between functional devices, necessitating efficient high-speed interconnections between chips to enhance overall system performance [3][30]. Need for Panel-Level Packaging (PLP) - PLP technology offers higher cost-effectiveness, greater design flexibility, and superior thermal and electrical performance, with significant potential to replace traditional packaging methods [4][42]. - The traditional packaging market is projected to reach $54.2 billion in 2024 and $69.8 billion by 2030, indicating a broad space for PLP to replace existing solutions [4][42]. - The wafer-level packaging market is expected to be $2.1 billion in 2024, with the FO/2.5D organic interposer market at $1.8 billion, potentially reaching $8.4 billion by 2030 [4][42]. Importance of Substrates in High-End Markets - Packaging substrates play a crucial role in signal transmission, heat dissipation, protection, and functional integration, with low-loss transmission being a key property [5][36]. - The increasing I/O density requirements driven by trends in mobile devices, 5G, data centers, and high-performance computing necessitate advancements in substrate technology to meet higher resolution demands [5][36]. COWOP and Substrate-Less Concepts - The Chip on Wafer on PCB (COWOP) concept blurs the definitions between PCB and substrate, focusing on transferring substrate functions to PCB while maintaining compatibility with existing technologies [6][36]. - Current PCB wiring density and I/O density are insufficient to match interposer requirements, necessitating the development of materials that can achieve high-density I/O [6][36]. Related Companies - Key players in the packaging substrate and materials sector include companies like Unimicron, BOE, and Corning, which are diversifying their businesses to capture opportunities in PLP and glass substrate applications [45].