Q&A AOC（有源光缆）的光模块形态与传统光模块相比是否有差异？ AOC 的光模块外形尺寸与传统光模块相同，但其光纤是不可插拔的。AOC 的 LC（多模）光纤与模块固定在一起，传输距离通常在 30 至 50 米之间，具体取 决于速率。尽管传输距离较短，AOC 仍需配备 DSP（数字信号处理器）。 AOC 主要应用于哪些场景？ 光连接专家交流-CPO、NPO、LPO、AOC 技术进展，客 户订单，价值量及拆分，供应商 20260202 摘要 AOC 主要应用于机柜内及 scale-out 第一层网络连接，传输距离可达 30-50 米，适用于跨机柜连接和机柜到交换机的连接。预计 2025 年行 业总发货量约 1,000 万只，其中 800G 产品约 300 万只，400G 产品约 500 万只。800G、30 米 AOC 价格在 1,000 美元以上，400G、10- 30 米 AOC 价格在 500-600 美元之间。 谷歌在长距离传输中使用单模 LC 替代 AEC，而其他客户则普遍采用多 模 LC 进行短距离传输。谷歌计划通过硅光技术实现单模 200G LC，预 计 2027 年开始量产，并配备 DSP 以 ...

Market Overview - The Glass-reinforced Substrate Market was valued at USD 1.18 Billion in 2025E and is projected to reach USD 1.60 Billion by 2033, growing at a CAGR of 3.98% during 2026-2033 [1][7] - The U.S. glass-reinforced substrate market is expected to grow at a CAGR of 4.57% from 2026 to 2033, reaching USD 0.29 Billion [1] Market Drivers - The primary driver for global market growth is the increasing demand for lightweight, strong, and durable materials across various sectors including electronics, automotive, construction, and aerospace [2] - Advanced PCB and semiconductor applications are promoting the adoption of glass-reinforced substrates [2] - The market is also driven by a focus on improving fuel economy and reducing component weight, alongside sustainable initiatives encouraging the use of recyclable materials [2] Key Segmentation By Thickness - The 0.1 mm - 0.5 mm segment led the market with a 45.78% share in 2025E, offering a balance of mechanical strength, electrical insulation, and cost efficiency [8] - The 0.5 mm - 1 mm segment is the fastest growing with a CAGR of 4.56% due to its application in high-performance sectors [8] By Application - Printed Circuit Boards (PCBs) dominated the market with a 46.21% share in 2025E, essential for nearly all electronic devices [9] - IC Packaging Substrates are the fastest growing segment with a CAGR of 4.13%, driven by high-performance computing and semiconductor devices [9] By Type - Glass-Reinforced Epoxy Laminates led the market with a 51.67% share in 2025E, favored for their flexibility and cost-effectiveness [10] - Glass-Reinforced BT (Bismaleimide Triazine) Resin is the fastest growing segment with a CAGR of 4.50%, used in high-performance applications [10] By End-Use Industry - Consumer Electronics held 48.52% of the market in 2025E, relying on glass-reinforced substrates for durability and performance [12] - The automotive sector is the fastest growing segment with a CAGR of 4.61%, driven by increased electronic integration in vehicles [12] Regional Insights - Asia Pacific dominated the market in 2025E with a 41.82% revenue share, supported by strong PCB and semiconductor manufacturing [13] - North America is expected to witness the fastest growth from 2026-2033, with a projected CAGR of 4.70% due to demand from aerospace, defense, and automotive industries [13] Leading Market Players - Key players in the market include AGC Inc., SKC, Corning Incorporated, Samtec, Nippon Electric Glass Co., Ltd., and others [5][11]

Core Viewpoint - The article discusses the current status, trends, and market dynamics of Through-Glass Via (TGV) substrates, highlighting their potential in semiconductor packaging and microelectronics, particularly in data centers, 5G networks, and IoT devices. The TGV technology is positioned as a promising alternative to traditional silicon-based substrates, with significant growth expected in the coming years [1][7][12]. Group 1: Current Status of TGV Substrate Industry - TGV substrate production is primarily concentrated in the US, Europe, and Japan, with China lagging in high-end TGV technology and lacking independent intellectual property rights [3][12]. - Major international players like Corning and LPKF dominate the mid-to-high-end market, collectively holding over 50% market share [3][12]. - Domestic companies such as Xiamen Yuntian Semiconductor are emerging rapidly in the mid-to-low-end TGV substrate market, leveraging cost advantages for import substitution [3][12]. - Companies can be categorized into three types based on their product strategies: those with established R&D capabilities, those diversifying their product lines, and those focusing on niche markets [4][12]. Group 2: Development Trends of TGV Substrates - The trend towards smaller via sizes is driven by the demand for high-density interconnections, enhancing circuit integration and performance [5]. - The future development trend indicates a shift towards larger 300 mm wafer sizes, expected to capture 73.46% of the global market share by 2031 [5][6]. - The Asia-Pacific region, particularly China and Japan, is projected to experience rapid growth, with market shares of 14.97% and 9.42% respectively by 2031 [5][6]. Group 3: Global Market Scale Analysis - The global TGV substrate market is expected to grow from $12.3 million in 2024 to $47.5 million by 2031, with a compound annual growth rate (CAGR) of 20.24% from 2025 to 2031 [7][10]. - In 2024, the Chinese TGV market is projected to reach $2.54 million, accounting for 20.62% of the global market, and is expected to grow to $13.21 million by 2031 [10]. - The consumer electronics sector is the largest application market for TGV substrates, accounting for 63.91%, followed by the automotive industry at 21.10% [11][12]. Group 4: Market Structure and Competition - The TGV substrate market is highly concentrated, with leading manufacturers like Corning and LPKF holding 50% of the market share, while the second tier, including Samtec and Xiamen Yuntian Semiconductor, holds 33.86% [12]. - The market faces challenges such as high production costs and complex manufacturing processes, which hinder scalability and efficiency [12]. - Companies need to optimize production processes, increase R&D investment, and enhance market awareness to maintain competitiveness in the evolving landscape [12]. Group 5: Policy Analysis - The "5G Application - Sailing Action Plan (2021-2023)" aims to enhance 5G technology capabilities and support the development of key components, which will indirectly benefit the TGV substrate market [13][14]. - The plan emphasizes the importance of advancing 5G infrastructure and related technologies, which aligns with the growth potential of TGV substrates in high-frequency applications [13][14]. Group 6: Report Overview - The article references a comprehensive report by QYResearch that analyzes the global and Chinese TGV substrate market, covering production capacity, sales, pricing, and future trends from 2025 to 2031 [15][16]. - The report includes detailed insights into major manufacturers, product types, applications, and regional analyses, providing a thorough understanding of the market dynamics [15][16].