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芯联集成:拟发行不超过40亿元企业债务融资工具
news flash· 2025-07-02 10:03
Group 1 - The company plans to issue corporate debt financing tools not exceeding 4 billion yuan to meet operational funding needs and optimize debt structure [1] - The issuance will include medium-term notes up to 2.5 billion yuan and ultra-short-term financing bonds up to 1.5 billion yuan [1]