1月5日，早盘半导体产业链震荡拉升，设备、材料、晶圆代工方向均表现不俗。截至发稿，东微半导涨 近19%，次新股强一股份涨超17%，矽电股份涨超14%，中微公司、普冉股份、江波龙等跟涨。 | | 代码 | 名称 | 涨幅%V | 现价 | | --- | --- | --- | --- | --- | | 1 | 688261 | 矢微半导 | +18.95% | 97.55 | | 2 | 688809 | C强一 | +17.21% | 301.00 | | 3 | 301629 | 矽电股份 | +14.07% | 248.91 | | ব | 688012 | 中微公司 | +12.20% | 306.00 | | 5 | 688766 | 普冉股份 | +9.34% | 139.09 | | 6 | 301308 | 江波龙 | +9.22% | 267.42 | | 7 | 301611 | 珂玛科技 | +8.12% | 92.69 | | 8 | 688525 | 佰维存储 | +8.20% | 124.20 | | ਰੇ | 688727 | 恒坤新材 | +7.22% | 51.22 | | ...

Core Viewpoint - The company has announced the development of MLCP technology, which integrates traditional packaging heat dissipation structures with liquid cooling channels to enhance cooling efficiency and reduce thermal resistance [1] Group 1: Technology Overview - MLCP is a cold plate technology that features micron-level channels within packaging materials, allowing coolant to be positioned closer to chip heat sources [1] - The integrated design of MLCP eliminates the need for traditional external cold plate models, enabling direct structural coupling with high-power and multi-chip modules [1] Group 2: Company Capabilities - The company possesses strong expertise in high thermal conductivity metal packaging materials, precision etching, and electroplating processes, which align well with the MLCP technology route [1] Group 3: Market Strategy - The company is actively advancing the sample testing and production line preparation for MLCP, with samples already delivered to key customers [1] - Future production capacity planning will be strictly based on market feedback and customer orders, aiming to seize opportunities in high heat flux density areas such as AI servers and power modules [1]