Core Viewpoint - The article highlights the upcoming "Collaborative Innovation Forum from Devices to Networks" scheduled for March 18, 2026, at the Shanghai New International Expo Center, focusing on the semiconductor and communication industries, aiming to foster collaboration across the entire semiconductor value chain [2][10]. Group 1: Event Overview - The forum is a key event of the Munich Shanghai Optical Fair, co-hosted by Semiconductor Industry Observation and the fair itself, with a mission centered on "collaborative breakthroughs across the semiconductor value chain" [2]. - The forum will feature 200 core industry professionals from various sectors, including operators, equipment manufacturers, and semiconductor companies, ensuring targeted and professional technical exchanges [3][4]. Group 2: Longsight's Role - Shenzhen Longsight Technology Co., Ltd. will present its advanced electronic measurement solutions at the forum, showcasing its core technologies and full-scenario solutions [2][5]. - Longsight aims to address the "bottleneck" issues in high-end electronic measurement instruments, providing a comprehensive product system across electronic, wireless, and digital fields [6]. Group 3: Product Innovations - Longsight's ExWave TS series high-performance real-time oscilloscopes can capture high-speed signals up to 90GHz, breaking decades of Western technological monopoly and representing the most advanced level in China [6][7]. - The company’s high-frequency signal sources and spectrum analyzers are designed for cutting-edge fields like 6G and satellite communication, achieving international leading standards with capabilities up to 110G frequency and 5-8G bandwidth [8]. Group 4: Forum's Collaborative Value - The forum aims to break down barriers between the semiconductor and communication industries, addressing the challenges of localized production processes by promoting "full value chain collaboration" [10]. - Longsight will share insights on optical communication and high-speed optical testing, focusing on oscilloscope applications and future testing solutions, which are crucial for chip design and optical device manufacturers [10][12]. Group 5: Key Takeaways from Longsight's Presentation - The presentation will emphasize the strength of domestic high-end measurement capabilities, showcasing practical paths for replacing high-end measurement instruments [12]. - It will also share best practices in integrated applications, providing valuable references for industry players facing technological upgrades [12]. - Lastly, it aims to build bridges for collaboration, connecting measurement instrument manufacturers with chip design and optical device sectors to enhance industry responsiveness and competitiveness [12].

2026年3月18日，上海新国际博览中心将迎来半导体与通信产业的跨领域盛会—— 《从器件 到网络的协同创新论坛》 。作为慕尼黑上海光博会的核心配套活动，本次论坛由半导体行业 观察与慕尼黑上海光博会联合主办，以 "半导体全产业链协同攻坚"为核心使命，遵循"趋势 →半导体基础（材料/EDA）→核心芯片→光器件→组件→应用→协同" 的全链路逻辑，精准 链接化合物半导体、EDA、泛半导体芯片设计等关键领域，为国产化替代进程中的技术突破 与生态共建搭建高端交流平台。 深 圳 市 光 鉴 科 技 有 限 公 司 （ DEPTRUM ） 作 为 多维视觉感知 领 域 的 领 军 企 业 ， 将 于 当 日 14:25-14:50重磅登台，以其深耕多年的多维视觉感知技术方案及产品，为论坛注入智能视觉 领域的创新动能。 慕尼黑上海光博会： 全球科技产业的资源聚合与协同枢纽 慕尼黑上海光博会作为全球光电子、激光、半导体及通信技术领域的顶级展会IP，始终坚守 "技术 引领、生态共建" 的核心定位，历经多年发展，已成为整合全球前沿技术、头部企业资源与产业核 心需求的关键枢纽。 展会全面覆盖光器件、芯片、制造设备、核心材料等全产业链环 ...

Core Viewpoint - The article highlights the upcoming "Collaborative Innovation Forum from Devices to Networks" scheduled for March 18, 2026, at the Shanghai New International Expo Center, focusing on the semiconductor industry's cross-domain collaboration and innovation [2][10]. Group 1: Event Overview - The forum is organized by Semiconductor Industry Observation and the Munich Shanghai Optical Fair, aiming to address the challenges of the semiconductor supply chain through a comprehensive approach from materials to applications [2]. - The event will feature 200 key industry professionals from various sectors, including operators, equipment manufacturers, and semiconductor companies, ensuring targeted technical exchanges [3][13]. - The forum will utilize a hybrid model of offline and online participation to enhance industry impact and facilitate efficient technology showcase and business matching [3]. Group 2: Shanghai Langxi Technology - Shanghai Langxi Technology, established in March 2023, focuses on silicon-based passive devices and has rapidly developed into a benchmark enterprise in the high-end passive device sector [5][10]. - The company has achieved significant technological breakthroughs, including a three-dimensional capacitor structure that enhances performance metrics such as capacitance density and frequency characteristics [6][8]. - Langxi Technology has applied for 32 core patents, with over 60% being invention patents, establishing a comprehensive technical protection system [9]. Group 3: Technological Innovations - The company employs deep trench etching technology to create high aspect ratio three-dimensional capacitor structures, significantly increasing effective contact area and performance [6]. - It has developed a complete testing and simulation system to ensure the stability and predictability of its silicon-based passive devices, addressing industry pain points in high-frequency applications [7]. - The core products achieve a capacitance density of 2μF/mm² and an impedance of less than 5mΩ at 1GHz, with a lifespan exceeding 100,000 hours, making them suitable for high-end applications [8]. Group 4: Industry Impact and Collaboration - The forum aims to break down barriers between the semiconductor and communication industries, facilitating a collaborative approach to address challenges in the localization process [10][13]. - Langxi Technology's participation will provide insights into the silicon-based passive device sector, offering solutions for power integrity optimization and fostering connections between chip designers and core component manufacturers [10]. - The event is expected to serve as a crucial platform for technology cooperation, market expansion, and ecosystem building, benefiting both large and small enterprises in the semiconductor industry [13].