Core Viewpoint - The article highlights the upcoming "Collaborative Innovation Forum from Devices to Networks" scheduled for March 18, 2026, at the Shanghai New International Expo Center, focusing on the semiconductor and communication industries, aiming to foster collaboration across the entire semiconductor value chain [2][10]. Group 1: Event Overview - The forum is a key event of the Munich Shanghai Optical Fair, co-hosted by Semiconductor Industry Observation and the fair itself, with a mission centered on "collaborative breakthroughs across the semiconductor value chain" [2]. - The forum will feature 200 core industry professionals from various sectors, including operators, equipment manufacturers, and semiconductor companies, ensuring targeted and professional technical exchanges [3][4]. Group 2: Longsight's Role - Shenzhen Longsight Technology Co., Ltd. will present its advanced electronic measurement solutions at the forum, showcasing its core technologies and full-scenario solutions [2][5]. - Longsight aims to address the "bottleneck" issues in high-end electronic measurement instruments, providing a comprehensive product system across electronic, wireless, and digital fields [6]. Group 3: Product Innovations - Longsight's ExWave TS series high-performance real-time oscilloscopes can capture high-speed signals up to 90GHz, breaking decades of Western technological monopoly and representing the most advanced level in China [6][7]. - The company’s high-frequency signal sources and spectrum analyzers are designed for cutting-edge fields like 6G and satellite communication, achieving international leading standards with capabilities up to 110G frequency and 5-8G bandwidth [8]. Group 4: Forum's Collaborative Value - The forum aims to break down barriers between the semiconductor and communication industries, addressing the challenges of localized production processes by promoting "full value chain collaboration" [10]. - Longsight will share insights on optical communication and high-speed optical testing, focusing on oscilloscope applications and future testing solutions, which are crucial for chip design and optical device manufacturers [10][12]. Group 5: Key Takeaways from Longsight's Presentation - The presentation will emphasize the strength of domestic high-end measurement capabilities, showcasing practical paths for replacing high-end measurement instruments [12]. - It will also share best practices in integrated applications, providing valuable references for industry players facing technological upgrades [12]. - Lastly, it aims to build bridges for collaboration, connecting measurement instrument manufacturers with chip design and optical device sectors to enhance industry responsiveness and competitiveness [12].

Core Viewpoint - The article highlights the upcoming "Collaborative Innovation Forum from Devices to Networks" scheduled for March 18, 2026, at the Shanghai New International Expo Center, focusing on the semiconductor and communication industries, aiming to foster collaboration across the entire semiconductor value chain [2][18]. Group 1: Forum Overview - The forum is co-hosted by Semiconductor Industry Observation and the Munich Shanghai Optical Fair, emphasizing "collaborative breakthroughs across the semiconductor value chain" [2]. - It aims to connect key areas such as compound semiconductors, EDA, and semiconductor chip design, providing a high-end communication platform for technological breakthroughs and ecosystem building in the context of domestic substitution [2][3]. Group 2: Munich Shanghai Optical Fair - The Munich Shanghai Optical Fair serves as a global hub for the optoelectronics, laser, semiconductor, and communication technology sectors, focusing on "technology leadership and ecosystem building" [3]. - The fair covers the entire industry chain, including optical devices, chips, manufacturing equipment, and core materials, aligning with the forum's goal of addressing collaborative pain points in the semiconductor and communication industries [3][4]. Group 3: Guangjian Technology - Guangjian Technology, a leader in multi-dimensional visual perception, will present its innovative technology solutions at the forum, contributing to the intelligent vision sector [2][5]. - The company focuses on developing a full-stack 3D visual perception ecosystem, integrating research, manufacturing, sales, and service [6]. Group 4: Core Technology and Product Advantages - Guangjian Technology has established a comprehensive technology system covering optical sensing, intelligent perception, and perception computing, creating a complete technological closed loop from core technology to hardware [7]. - The company has developed proprietary technologies such as the mass-produced consumer-grade nano-photonics chip and the unique sToF technology, which combines structured light and ToF techniques for enhanced imaging capabilities [7]. Group 5: Product Layout and Custom Solutions - Guangjian Technology offers a range of products tailored to various industry needs, including the Stellar ToF series for high-precision sensing in smart cabins and robots, and the Aurora structured light series for facial recognition applications [8][9]. - The company provides customized solutions for different industries, enhancing capabilities in areas like financial payments and intelligent robotics [9]. Group 6: Industry Layout and Ecosystem Building - Guangjian Technology has built an integrated industry system that includes R&D, production, sales, and service, deeply integrating into the semiconductor and smart hardware ecosystems [11]. - The company has applied for over 1,000 patents, with more than 60% being invention patents, breaking the monopoly of Western companies in core 3D visual technology [11]. Group 7: Forum Collaborative Value - The forum aims to break down barriers between the semiconductor and communication industries, addressing challenges in the domestic substitution process [13]. - Guangjian Technology's participation will provide insights into the latest visual perception technology needs and facilitate connections between visual technology companies and the broader industry [15].

Core Viewpoint - The article highlights the upcoming "Collaborative Innovation Forum from Devices to Networks" scheduled for March 18, 2026, at the Shanghai New International Expo Center, focusing on the semiconductor industry's cross-domain collaboration and innovation [2][10]. Group 1: Event Overview - The forum is organized by Semiconductor Industry Observation and the Munich Shanghai Optical Fair, aiming to address the challenges of the semiconductor supply chain through a comprehensive approach from materials to applications [2]. - The event will feature 200 key industry professionals from various sectors, including operators, equipment manufacturers, and semiconductor companies, ensuring targeted technical exchanges [3][13]. - The forum will utilize a hybrid model of offline and online participation to enhance industry impact and facilitate efficient technology showcase and business matching [3]. Group 2: Shanghai Langxi Technology - Shanghai Langxi Technology, established in March 2023, focuses on silicon-based passive devices and has rapidly developed into a benchmark enterprise in the high-end passive device sector [5][10]. - The company has achieved significant technological breakthroughs, including a three-dimensional capacitor structure that enhances performance metrics such as capacitance density and frequency characteristics [6][8]. - Langxi Technology has applied for 32 core patents, with over 60% being invention patents, establishing a comprehensive technical protection system [9]. Group 3: Technological Innovations - The company employs deep trench etching technology to create high aspect ratio three-dimensional capacitor structures, significantly increasing effective contact area and performance [6]. - It has developed a complete testing and simulation system to ensure the stability and predictability of its silicon-based passive devices, addressing industry pain points in high-frequency applications [7]. - The core products achieve a capacitance density of 2μF/mm² and an impedance of less than 5mΩ at 1GHz, with a lifespan exceeding 100,000 hours, making them suitable for high-end applications [8]. Group 4: Industry Impact and Collaboration - The forum aims to break down barriers between the semiconductor and communication industries, facilitating a collaborative approach to address challenges in the localization process [10][13]. - Langxi Technology's participation will provide insights into the silicon-based passive device sector, offering solutions for power integrity optimization and fostering connections between chip designers and core component manufacturers [10]. - The event is expected to serve as a crucial platform for technology cooperation, market expansion, and ecosystem building, benefiting both large and small enterprises in the semiconductor industry [13].