Core Viewpoint - The major shareholder of Tongfu Microelectronics, Nantong Huada Microelectronics Group, has terminated its share reduction plan after reducing its holdings by 15 million shares, representing 0.99% of the company's total shares, and decreasing its ownership from 19.79% to 18.80% [1] Group 1 - Nantong Huada Microelectronics Group planned to reduce its holdings by up to 15,175,969 shares from November 10, 2025, to February 7, 2026, but has now completed a reduction of 15 million shares by January 23, 2026 [1] - The average price at which the shares were sold was 56.04 yuan, resulting in a total cash inflow of approximately 841 million yuan [1] - Since November 29, 2019, Huada Group has cumulatively reduced its holdings by 28.7 million shares, realizing approximately 507 million yuan in cash [2] Group 2 - Tongfu Microelectronics plans to raise up to 440 million yuan through a private placement of A-shares, with the funds allocated for various projects including enhancing storage chip testing capacity and supporting new applications in the automotive sector [2] - Over the past six years, Tongfu Microelectronics has raised a total of 5.965 billion yuan [5]

Group 1 - The company Tongfu Microelectronics announced a plan to issue shares to specific investors, approved by its board of directors, with a maximum of 35 eligible investors [1] - The total number of shares to be issued will not exceed approximately 455 million shares, which is 30% of the company's total share capital prior to the issuance [1] - The issuance price will be no less than 80% of the average trading price of the company's shares over the 20 trading days prior to the pricing benchmark [1] Group 2 - The company aims to raise up to 4.4 billion yuan through this issuance, with funds allocated for various projects including enhancing packaging capacity for storage chips, automotive applications, wafer-level packaging, and high-performance computing [1] - Specific project investments include approximately 880 million yuan for storage chip packaging, 1.1 billion yuan for automotive applications, 743 million yuan for wafer-level packaging, and 724 million yuan for high-performance computing [1] - Additionally, 1.23 billion yuan will be used to supplement working capital and repay bank loans [1]