通富微电公告显示，2026年1月21日至2026年1月23日，华达集团减持15,000,000股，减持均价56.04 元。经计算，华达集团套现金额为8.41亿元。 中国经济网北京1月27日讯 通富微电(002156.SZ)昨晚发布关于持股5%以上股东股份变动比例触及 1%整数倍暨减持计划提前终止的公告。 公司于2025年10月17日披露了《大股东减持股份预披露公告》（公告编号：2025-043），公司控股 股东南通华达微电子集团股份有限公司（简称"华达集团"）计划在减持计划公告发布之日起15个交易日 后的3个月内（即2025年11月10日至2026年2月7日），以集中竞价方式减持持有的公司股份不超过 15,175,969股（即不超过公司股份总数的1%） 现公司收到华达集团出具的《关于通富微电子股份有限公司持股5%以上股东股份变动比例触及1% 整数倍暨减持计划提前终止的告知函》，截至2026年1月23日，本次减持计划已减持公司股份15,000,000 股，占公司当前总股本的0.99%，持股比例从19.79%下降至18.80%，华达集团决定提前终止本次减持计 划。 2022年11月11日，通富微电发布2021年度 ...

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Core Viewpoint - Tongfu Microelectronics plans to raise up to 4.4 billion yuan through a private placement to enhance its testing capacity in various sectors, including storage chips and automotive applications, marking its first fundraising in four years [1][5]. Fundraising Details - The company aims to use the raised funds for several projects: - 8.88 billion yuan for storage chip testing capacity, adding 849,600 units annually [3]. - Nearly 11 billion yuan for automotive and emerging applications, adding 504 million units annually [3]. - 7.43 billion yuan for wafer-level testing, adding 312,000 units and enhancing automotive product reliability [3]. - 7.24 billion yuan for high-performance computing and communication, adding 480 million units annually [3]. - Additionally, 1.23 billion yuan will be allocated for working capital and repaying bank loans [4]. Historical Fundraising - Since its IPO in 2007, Tongfu Microelectronics has raised a total of 10.757 billion yuan across six fundraising rounds, primarily focused on enhancing its core business [1][5][7]. Client Base and Revenue - The company’s major client is AMD, contributing 50.35% of its revenue, with total sales from the top five clients reaching 16.478 billion yuan, accounting for 69% of total sales in 2024 [1][8]. - Revenue figures from 2022 to the first three quarters of 2025 show consistent growth, with revenues of 21.429 billion yuan, 22.269 billion yuan, 23.882 billion yuan, and 20.12 billion yuan respectively [8]. R&D Investment - Tongfu Microelectronics has significantly invested in R&D, with expenditures of 1.062 billion yuan, 1.162 billion yuan, 1.323 billion yuan, 1.533 billion yuan, and 1.123 billion yuan from 2021 to the first three quarters of 2025, totaling 6.203 billion yuan [10]. - As of June 30, 2025, the company has filed over 1,700 patents, with nearly 70% being invention patents, and has obtained technology licenses from Fujitsu, Casio, and AMD [2][10]. Capacity Expansion - To meet growing market demand, the company is expanding its production capacity, including upgrades to its advanced packaging technology and the construction of a new substation to enhance power supply capabilities [9].

Core Viewpoint - Tongfu Microelectronics plans to raise up to 4.4 billion yuan through a private placement of A-shares to enhance its capabilities in high-end chip packaging and testing, focusing on four key projects to strengthen its competitive advantage in the semiconductor packaging industry [1][3]. Group 1: Fundraising and Investment Projects - The company aims to invest in four core packaging capacity enhancement projects and supplement working capital, targeting high-growth and high-tech sectors for systematic improvement in packaging capabilities [1][3]. - The projects include enhancements in automotive packaging capacity to meet strict automotive electronic standards, as well as improvements in storage chip packaging for FLASH and DRAM products to align with market trends for high-speed data access and large-capacity storage [3]. Group 2: Industry Position and Market Dynamics - Tongfu Microelectronics is a significant player in the global semiconductor packaging industry, ranking fourth globally and second domestically, with a strong customer base including major companies like AMD, Texas Instruments, and BYD [4]. - The company emphasizes the importance of upgrading key packaging capabilities to ensure high yield and reliability, which are crucial for the performance and delivery of downstream chips [4]. - With the semiconductor industry recovering since 2024, driven by emerging technologies such as AI and automotive electronics, the demand for packaging services is expected to grow significantly, highlighting the critical role of packaging in supporting computational power and system integration [4].

Core Viewpoint - Tongfu Microelectronics (002156) plans to raise up to 4.4 billion yuan through a private placement of shares to enhance its packaging and testing capacity across various sectors, including storage chips and automotive applications, while also supplementing working capital and repaying bank loans [1][2][3][4] Group 1: Investment Projects - The storage chip packaging capacity enhancement project will invest 888 million yuan, with 800 million yuan from the raised funds, adding an annual capacity of 849,600 storage chips. The storage chip market is expected to rebound in 2024, reaching a market size of 170.4 billion USD, a year-on-year increase of 77.64% [1] - The automotive and emerging applications packaging capacity enhancement project plans to invest nearly 1.1 billion yuan, with 1.055 billion yuan from the raised funds, adding an annual capacity of 504 million units. This project aims to meet automotive standards and strengthen high-end testing capabilities in response to the growing demand for automotive electronics [2] - The wafer-level packaging capacity enhancement project plans to invest 743 million yuan, with 695 million yuan from the raised funds, adding an annual capacity of 312,000 wafer-level packages and enhancing the reliability of automotive product packaging [2] - The high-performance computing and communication packaging capacity enhancement project plans to invest 724 million yuan, with 620 million yuan from the raised funds, adding an annual capacity of 480 million units, focusing on advanced packaging technologies [3] Group 2: Financial Utilization - The company intends to use 1.23 billion yuan of the raised funds to supplement working capital and repay bank loans [4]

分组1 - China Merchants Bank plans to distribute a cash dividend of approximately 25.548 billion yuan for the first half of 2025, with a per-share dividend of 1.013 yuan (tax included) [1] - Luzhou Laojiao proposes a cash dividend of 13.58 yuan per 10 shares, totaling around 2 billion yuan (tax included) for the mid-2025 profit distribution [3] - Tongfu Microelectronics intends to raise up to 4.4 billion yuan through a private placement to enhance its packaging capacity for storage chips and other emerging applications [2] 分组2 - Xibu Gold announces that its shareholder, Turpan Jinyuan Mining Co., plans to reduce its stake by up to 1% due to funding needs [4] - Jiaoyun Co. is planning a significant asset restructuring by swapping its automotive sales and service assets with the cultural and tourism-related assets of its controlling shareholder [5] - Guo Sheng Technology expects a negative net profit for the fiscal year 2025, leading to a stock resumption after a period of trading suspension [8] 分组3 - North Rare Earth adjusts its first-quarter rare earth concentrate trading price to 26,834 yuan per ton, reflecting a 2.4% increase from the previous quarter [11] - Baotou Steel plans to set the same trading price for rare earth concentrate at 26,834 yuan per ton for the first quarter of 2026, also indicating a 2.4% increase [12] - Wanbangde's subsidiary has been selected for a national major science and technology project for Alzheimer's drug development, which is expected to positively impact its clinical development and long-term business growth [13]

Core Viewpoint - Tongfu Microelectronics (002156.SZ) plans to raise a total of no more than 440 million yuan through a private placement of shares, with the funds allocated for various capacity enhancement projects and working capital [1] Group 1: Fundraising Details - The total amount to be raised is capped at 440 million yuan, which includes the principal amount [1] - The funds will be used for enhancing storage chip packaging capacity, packaging capacity for emerging applications such as automotive, wafer-level packaging capacity, and high-performance computing and communication packaging capacity [1] Group 2: Financial Management - The raised funds will also be used to supplement working capital and repay bank loans [1]

Core Viewpoint - Tongfu Microelectronics (002156.SZ) plans to issue A-shares to specific investors, aiming to raise up to 4.4 billion yuan for various capacity enhancement projects and to supplement working capital and repay bank loans [1] Group 1: Fundraising Purpose - The company intends to use the raised funds for the enhancement of packaging and testing capacity in storage chips [1] - Funds will also be allocated to improve packaging and testing capacity in emerging applications such as automotive [1] - Additional investments will focus on wafer-level packaging capacity enhancement and high-performance computing and communication sectors [1] Group 2: Financial Strategy - The fundraising will also support the company's working capital needs [1] - Part of the funds will be utilized to repay existing bank loans [1]

Core Viewpoint - Changdian Technology (600584) emphasizes its leading position in the packaging and testing services for various storage chip products, including DRAM and Flash, backed by over 20 years of experience in storage packaging mass production [1] Group 1: Company Overview - The company provides packaging and testing services that cover a wide range of storage chip products [1] - Changdian Technology has over 20 years of experience in mass production of storage packaging [1] - The company is committed to enhancing advanced packaging development in the storage sector [1]

Group 1 - The core focus of Zhongtian Jingzhuang's invested company, Shenzhen Yuanjian Zhichun Technology Co., Ltd., is on high bandwidth memory (HBM) chips, with HBM2/2e products completing final testing and moving towards mass production and upgrades [1][2] - HBM3/3e products are currently in the research and development phase, having completed preliminary research and some design work [1][2] - Another invested company, Kuiruisi Semiconductor Technology (Dongyang) Co., Ltd., specializes in ABF substrate-related businesses, with products used for packaging high-performance chips such as CPUs, GPUs, AI, and automotive applications, and the first phase of the project has been successfully put into production [1][2] Group 2 - Hefei Xinfeng Technology Co., Ltd., another invested company, focuses on the packaging and testing of storage chips, providing integrated packaging and testing services to clients [1][2]