另外，被誉为"中国刻蚀机之父"的中微公司创始人、董事长、总经理尹志尧计划自公告披露之日起15个交易日后的3个月内，通过集中竞价方式减持公司 股份不超过29万股，占公司总股本比例不超过0.046%。 拟减持原因为："因本人已从外籍恢复为中国籍，为依法办理相关税务的需要。" | 股东名称 | 尹志尧 | | --- | --- | | 计划减持数量 | 不超过:290,000 股 | | 计划减持比例 | 不超过:0.046% | | 减持方式及对应减持数 量 | 集中竞价减持,不超过:290,000 股 | | 减持期间 | 2026年１月30日〜2026年４月29日 | | 拟减持股份来源 | IP0 前取得 | | 拟减持原因 | 因本人已从外籍恢复为中国籍,为依法办理相关税务 | | | 的需要 | 截至1月9日收盘，中微公司股价报336.68元/股，总市值为2108亿元。 尹志尧拟减持股票市值约为9764万元。 公开资料显示，尹志尧，1944年生，中国科学技术大学学士，加州大学洛杉矶分校博士。 1984年至1986年，尹志尧就职于英特尔中心技术开发部，担任工艺工程师； 1986年至1991年，就职于泛林 ...

两千亿市值半导体设备龙头再发重要公告。 1月8日晚间，中微公司发布公告称，于近日收到公司董事长、总经理尹志尧出具的《减持意向书》，因其已从外籍恢复为中国籍，为 依法办理相关税务的需要，计划减持不超过29万股股份，占公司总股本比例0.046%。 据披露，在过去12个月内，尹志尧曾于2025年5月27日至8月26日期间，通过集中竞价方式减持公司股份17万股，占总股本比例 0.027%，减持价格区间为170.76元/股至207.36元/股。 | 股东名称 | 減持数量(股) | | 減持比例 | 減持期间 | 減持价格区间（元/股） | 前期减持计划披露日期 | | --- | --- | --- | --- | --- | --- | --- | | 尹志尧 | | 170,000 | 0.027% | 2025/5/27~2025/8/ 26 | 170.76-207.36 | 2025年5月6日 | 公告同时明确，尹志尧并非公司控股股东、实际控制人及一致行动人，亦非直接持股5%以上股东。本次减持计划实施存在不确定性， 其将根据市场情况、公司股价等因素决定是否实施及具体减持数量、价格。此次减持不会导致公司控制权 ...

Summary of Shengmei Shanghai Conference Call Company Overview - **Company**: Shengmei Shanghai - **Industry**: Semiconductor Equipment Key Financial Metrics - **Revenue**: 32.65 billion CNY in H1 2025, up 35.85% YoY [2][3] - **Gross Margin**: 50.73%, an increase of 1.36 percentage points YoY [14] - **Net Profit**: 6.96 billion CNY, up 56.99% YoY [2][14] - **Adjusted Net Profit**: 7.82 billion CNY, up 27.14% YoY after excluding share-based payment expenses [2][3] Product Line Performance - **Cleaning Equipment Revenue**: 21.57 billion CNY, up 21.56% YoY, accounting for 66.06% of total revenue [2][7] - **Plating and Front-End Equipment Revenue**: 8 billion CNY, up 89.35% YoY, accounting for 24.24% of total revenue [2][8] - **Advanced Packaging and Other Equipment Revenue**: 3 billion CNY, up 48% YoY, accounting for 9.19% of total revenue [2][8] Market and Growth Strategy - **Long-term Revenue Target for China**: Increased from 1.5 billion USD to 2.5 billion USD, based on an adjusted semiconductor equipment market size of 40 billion USD [4][9] - **Global Revenue Target**: Increased from 3 billion USD to 4 billion USD [4][9] - **R&D Investment**: 5.44 billion CNY in H1 2025, representing 16.67% of revenue, up 39.47% YoY [4][17] Technological Advancements - **ULTRAC Wet Bench Technology**: Significant upgrades with patented nitrogen bubbling technology, enhancing etching uniformity [6][19] - **New Product Platforms**: Positive progress in new platforms such as Track and PCVD, expected to drive future revenue growth [5][6] Capacity Expansion - **Shanghai Lingang R&D and Manufacturing Center**: Nearing completion, with two production buildings planned, each with an annual capacity of 10 billion CNY [10][11] - **Production Capacity**: The first building is operational, with a total projected annual output of 20 billion CNY once both buildings are fully operational [11] International Market Strategy - **Overseas Revenue Target**: 1.5 billion USD, with a focus on expanding into the U.S. market [18][19] - **Competitive Advantage**: Unique IP and technology positioning in the global market, particularly in cleaning and plating equipment [22][24] Future Outlook - **Market Growth Expectations**: Anticipated stable growth in the Chinese semiconductor market, with a projected size of 40 billion USD by 2030 [28][30] - **Impact of Layer Increases**: New cleaning equipment will be required as memory technology advances beyond 500 layers, presenting significant market opportunities [24][25] Additional Insights - **Contract Liabilities**: 8.62 billion CNY, down 22% YoY, with prepayment policies varying for new and existing customers [16][31] - **Cash Position**: 29.01 billion CNY in cash, an increase of 1.27 billion CNY from the previous year [15]