Core Viewpoint - The article discusses the increasing importance of thermal management in electronic components due to rising power densities and heat generation, emphasizing the role of thermal interface materials (TIMs) in enhancing heat dissipation and reliability of integrated circuits [2][3][6]. Group 1: Thermal Management and Its Importance - The performance stability, safety, and lifespan of electronic components are adversely affected by high temperatures, necessitating effective heat dissipation strategies [2]. - Thermal management has emerged as a critical field of study, focusing on safe heat dissipation methods and materials for various electronic devices [2][3]. Group 2: Thermal Interface Materials (TIMs) - TIMs are essential in reducing thermal contact resistance between electronic components and heat sinks, thereby improving heat transfer efficiency [3][9]. - TIMs can be categorized into TIM1 (primary TIM) and TIM2 (secondary TIM), with TIM1 being in direct contact with heat-generating chips and requiring high thermal conductivity and low thermal resistance [9][10]. Group 3: Types and Characteristics of TIMs - Different types of TIMs include thermal grease, thermal pads, phase change materials, thermal gels, thermal adhesive tapes, and thermal potting compounds, each with unique properties and applications [18][22]. - The selection of TIMs is influenced by factors such as thermal conductivity, adhesion, and the ability to fill microscopic surface irregularities [12][19]. Group 4: Market Dynamics and Key Players - The thermal interface materials market is primarily dominated by major companies like Henkel and Parker-Chomerics, which together hold about half of the market share [16]. - Domestic suppliers in China, such as Yantai Debang Technology and Shenzhen Aochuan Technology, are still in the early stages of development, focusing on lower-end products [17]. Group 5: Future Trends and Challenges - The demand for higher thermal conductivity and stability in TIMs is expected to grow, with future developments likely focusing on nanotechnology and advanced filler materials [51][53]. - The industry faces challenges in standardizing testing methods and performance metrics for TIMs, which is crucial for effective selection and application in integrated circuit designs [52].