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火热预定,2025第六届热管理产业大会暨博览会等你来!
DT新材料· 2025-08-02 16:04
Core Viewpoint - The 6th Thermal Management Industry Conference & Expo (iTherM2025) aims to create a one-stop value matching platform for the thermal management industry, facilitating communication, cooperation, and win-win development among various organizations in the sector [1][5][6]. Group 1: Event Overview - The event will take place from December 3-5, 2025, at the Shenzhen International Convention and Exhibition Center [1][7]. - The expo will cover an exhibition area of 20,000 m² and is expected to attract over 30,000 industry visitors and more than 1,000 exhibitors [8]. Group 2: Industry Trends - The continuous miniaturization, high performance, integration, and multifunctionality of electronic devices, chips, and equipment are leading to a sharp increase in power density and heat generation [3][4]. - The demand for innovative thermal management solutions is driven by applications in consumer electronics, power electronics, artificial intelligence, 5G, data centers, IoT, power batteries, electric vehicles, energy storage, new energy, and green buildings [3][4]. Group 3: Expo Activities - The expo will feature innovative materials, instruments, equipment, design and simulation, solutions, patent technologies, and application scenarios [5][6]. - Various activities such as theme forums, roundtable discussions, workshops, innovation project displays, new product releases, and demand matching will be organized to enhance industry collaboration [5][6]. Group 4: Participation Benefits - Participants will have the opportunity to integrate industry chain resources and establish effective business connections with over 70% of professional visitors [8]. - The event will provide insights into future development trends and create excellent opportunities for business and technology sharing [8]. Group 5: Targeted Promotion - The event will utilize multi-dimensional targeted promotion strategies, including pre-exhibition and on-site reporting, to invite key clients and visitors [18]. - The aim is to amplify the driving effect of the expo and enhance the visibility of participating enterprises [18]. Group 6: Exhibition Layout - The exhibition will include various thematic areas such as consumer electronics thermal management, data center server thermal management, new energy thermal management, and energy storage thermal management [19][27][29][31]. - Each area will showcase relevant materials, technologies, and innovative achievements, providing a comprehensive overview of the thermal management landscape [19][27][29][31].
先进封装:10000字详解热界面材料及其未来发展趋势
材料汇· 2025-06-15 15:41
Core Viewpoint - The article discusses the increasing importance of thermal management in electronic components due to rising power densities and heat generation, emphasizing the role of thermal interface materials (TIMs) in enhancing heat dissipation and reliability of integrated circuits [2][3][6]. Group 1: Thermal Management and Its Importance - The performance stability, safety, and lifespan of electronic components are adversely affected by high temperatures, necessitating effective heat dissipation strategies [2]. - Thermal management has emerged as a critical field of study, focusing on safe heat dissipation methods and materials for various electronic devices [2][3]. Group 2: Thermal Interface Materials (TIMs) - TIMs are essential in reducing thermal contact resistance between electronic components and heat sinks, thereby improving heat transfer efficiency [3][9]. - TIMs can be categorized into TIM1 (primary TIM) and TIM2 (secondary TIM), with TIM1 being in direct contact with heat-generating chips and requiring high thermal conductivity and low thermal resistance [9][10]. Group 3: Types and Characteristics of TIMs - Different types of TIMs include thermal grease, thermal pads, phase change materials, thermal gels, thermal adhesive tapes, and thermal potting compounds, each with unique properties and applications [18][22]. - The selection of TIMs is influenced by factors such as thermal conductivity, adhesion, and the ability to fill microscopic surface irregularities [12][19]. Group 4: Market Dynamics and Key Players - The thermal interface materials market is primarily dominated by major companies like Henkel and Parker-Chomerics, which together hold about half of the market share [16]. - Domestic suppliers in China, such as Yantai Debang Technology and Shenzhen Aochuan Technology, are still in the early stages of development, focusing on lower-end products [17]. Group 5: Future Trends and Challenges - The demand for higher thermal conductivity and stability in TIMs is expected to grow, with future developments likely focusing on nanotechnology and advanced filler materials [51][53]. - The industry faces challenges in standardizing testing methods and performance metrics for TIMs, which is crucial for effective selection and application in integrated circuit designs [52].