随着电子技术的快速更迭进步，芯片、器件及电子设备等向微型化、高性能化、集成化及多功能方向发展，功率密度和发热量急剧攀升。消费电子、 5G、 XR、人工智能、 电力电子、高性能计算、 数据中心、物联网、动力电池、储能 /热 、 节能环保、 工业 4.0等领域的技术创新应用， 对 高效的热管理材料技 术和创新的解决方案 提出了高标准要求和起到积极推动作用 ，以保证终端产品的效率、可靠性、安全性、耐用性和持续稳定性。 01 主办单位 中国生产力促进中心协会新材料专业委员会 DT新材料 iTherM洞见热管理 大会顾问 李保文， 欧洲科学院院士、南方科技大学讲席教授, Thermo-X 主编 封 伟，天津大学教授、中国复合材料学会导热复合材料专业委员会主任（拟） 执行主席 林正得，中国科学院宁波材料技术与工程研究所研究员 虞锦洪，中国科学院宁波材料技术与工程研究所研究员 蔡金明，昆明理工大学教授 /广东墨睿科技有限公司董事长 陈 林，中国科学院工程热物理研究所研究员 曾小亮，中国科学院深圳先进技术研究院研究员 邹得球，宁波大学教授 大会信息 大会时间： 2025年12月3-5日 大会地点： 中国 · 深圳国际会展中心 ...

Core Viewpoint - The semiconductor industry is transitioning towards the "beyond Moore" era, driven by the increasing demand for efficient thermal management technologies in emerging fields such as 5G, AI, HPC, and data centers [2] Group 1: Conference Overview - The 2025 Advanced Packaging and Thermal Management Conference will focus on high-performance thermal management challenges, featuring three main forums: Advanced Packaging and Heterogeneous Integration Forum, High-Performance Thermal Management Innovation Forum, and Liquid Cooling Technology and Market Application Forum [3][4] - The conference aims to build a platform for industry-academia-research collaboration, promoting technological integration and providing innovative momentum for the semiconductor supply chain [3] Group 2: Conference Details - The conference is organized by Flink Qiming Chain and supported by the National Third Generation Semiconductor Technology Innovation Center (Suzhou) [4] - Scheduled for September 25-26, 2025, in Suzhou, Jiangsu, the conference expects around 500 participants [3] Group 3: Confirmed Speakers - Notable speakers include Professor Liang Jianbo from the National Third Generation Semiconductor Technology Innovation Center, who will discuss high thermal conductivity interface and packaging technology [7] - Other speakers represent various institutions, including the Chinese Academy of Sciences and universities, covering topics such as photothermal polyimide materials and advanced packaging applications [8][9] Group 4: Forum Topics - The forums will address key topics such as advanced packaging technology routes, cost optimization, and challenges in 2.5D/3D integration [17] - The High-Performance Thermal Management Forum will explore thermal interface materials, high-performance chip thermal management solutions, and the impact of Chiplet technology on thermal management [20][21] Group 5: Liquid Cooling Technology - The Liquid Cooling Technology Forum will discuss innovations and challenges in liquid cooling, including the standardization of cooling fluids and the application of immersion cooling in high-power density scenarios [23][24] - Topics will also cover the lifecycle cost analysis of liquid cooling systems and their integration in data centers and electric vehicles [25]

Core Viewpoint - The rapid advancement of electronic technology is driving the demand for efficient thermal management materials and innovative solutions across various sectors, including consumer electronics, 5G, AI, and more, to ensure product efficiency, reliability, safety, and durability [1]. Group 1: Conference Information - The 6th Thermal Management Industry Conference and Exposition (iTherM 2025) will be held from December 3-5, 2025, at the Shenzhen International Convention and Exhibition Center, focusing on the theme of "Fusion and Innovation" [2]. - The conference aims to provide a one-stop, high-efficiency value service platform for the thermal management industry, leveraging advancements in electronic information, new materials, and green technologies [2][3]. - The event is expected to attract over 2000 participants and 350 exhibitors, covering an exhibition area of 20,000 square meters [2]. Group 2: Focus Areas - iTherM 2025 will emphasize intellectual property, entrepreneurial projects, and innovative technologies that can transition from the lab to the market, promoting collaboration among government, industry, academia, and research institutions [3]. - The conference will feature over 20 activities, including keynote speeches, roundtable discussions, and case studies, aimed at fostering professional communication and collaboration in the thermal management field [2]. Group 3: Agenda Highlights - The conference will address current challenges and future opportunities in the thermal management industry, clarifying market dynamics and technological trends to support high-quality industrial development [5]. - Key topics will include thermal science, functional materials, technology applications, and engineering solutions, with specialized sessions on areas such as liquid cooling technology, power device thermal management, and data center thermal management [5][12].

Investment Rating - The report assigns a "Buy" rating for the company [6]. Core Insights - The company is positioned to enter a high growth cycle driven by its dual focus on polymer materials and thermal management systems, particularly in the booming sectors of new energy vehicles and data centers [1][4]. - The company has experienced a compound annual growth rate (CAGR) of 14.05% in revenue from 2017 to 2023, with a significant revenue increase of 72% year-over-year in 2024, primarily due to the rapid expansion in the new energy battery sector [1][29]. - The company is expected to achieve substantial revenue growth, with projections of 1.45 billion, 2.42 billion, and 3.37 billion yuan in revenue for 2025, 2026, and 2027 respectively, reflecting year-over-year growth rates of 51.3%, 67.0%, and 39.2% [4][12]. Summary by Sections 1. Thermal Management System Business - The company has established a dual business model focusing on polymer materials and thermal management, serving major clients such as Huawei and CATL [18][19]. - In 2024, the company plans to invest 90 million yuan in a new project for large-area cooling liquid plates for new energy vehicles to meet the production demands of major clients [3]. 2. AI Liquid Cooling - The demand for AI-driven data centers is expected to surge, with the company aiming to penetrate the supply chain of leading server manufacturers by establishing a subsidiary focused on data center cooling solutions [2][40]. - The company plans to acquire a 51% stake in Dongguan Zhaoke, a thermal interface materials company, to enhance its product offerings and market reach [2][24]. 3. Vehicle Cooling Plates - The company is set to benefit from the increasing production of CATL's Kirin and Shenxing batteries, which will enhance the value of its liquid cooling plates used in electric vehicles [3][75]. - The new energy business is projected to generate significant revenue, with a forecasted increase of 361.36% year-over-year in 2024 [35]. 4. Profit Forecast and Valuation - The company is expected to enter a rapid growth phase driven by its new energy battery and data center thermal management businesses, with a projected net profit of 0.92 billion, 1.57 billion, and 2.19 billion yuan for 2025, 2026, and 2027 respectively [4][12]. - The report anticipates a significant improvement in profitability, with net profit growth rates of 430.5%, 70.8%, and 39.6% for the same years [4].

Core Viewpoint - The article discusses the increasing importance of thermal management in electronic components due to rising power densities and heat generation, emphasizing the role of thermal interface materials (TIMs) in enhancing heat dissipation and reliability of integrated circuits [2][3][6]. Group 1: Thermal Management and Its Importance - The performance stability, safety, and lifespan of electronic components are adversely affected by high temperatures, necessitating effective heat dissipation strategies [2]. - Thermal management has emerged as a critical field of study, focusing on safe heat dissipation methods and materials for various electronic devices [2][3]. Group 2: Thermal Interface Materials (TIMs) - TIMs are essential in reducing thermal contact resistance between electronic components and heat sinks, thereby improving heat transfer efficiency [3][9]. - TIMs can be categorized into TIM1 (primary TIM) and TIM2 (secondary TIM), with TIM1 being in direct contact with heat-generating chips and requiring high thermal conductivity and low thermal resistance [9][10]. Group 3: Types and Characteristics of TIMs - Different types of TIMs include thermal grease, thermal pads, phase change materials, thermal gels, thermal adhesive tapes, and thermal potting compounds, each with unique properties and applications [18][22]. - The selection of TIMs is influenced by factors such as thermal conductivity, adhesion, and the ability to fill microscopic surface irregularities [12][19]. Group 4: Market Dynamics and Key Players - The thermal interface materials market is primarily dominated by major companies like Henkel and Parker-Chomerics, which together hold about half of the market share [16]. - Domestic suppliers in China, such as Yantai Debang Technology and Shenzhen Aochuan Technology, are still in the early stages of development, focusing on lower-end products [17]. Group 5: Future Trends and Challenges - The demand for higher thermal conductivity and stability in TIMs is expected to grow, with future developments likely focusing on nanotechnology and advanced filler materials [51][53]. - The industry faces challenges in standardizing testing methods and performance metrics for TIMs, which is crucial for effective selection and application in integrated circuit designs [52].

Group 1 - Yushu Technology has completed its share reform and is preparing for a potential Pre-IPO round of financing, with a valuation expected to exceed 10 billion but remain below 15 billion RMB [1] - The company has changed its name from Hangzhou Yushu Technology Co., Ltd. to Hangzhou Yushu Technology Co., Ltd., indicating readiness for an IPO, with considerations for listing in mainland China or Hong Kong [1] - Yushu Technology's new humanoid robot features 26 degrees of freedom and is priced below 10,000 USD, while previous models had 23 and 47 degrees of freedom respectively [1] Group 2 - According to Dongwu Securities' grassroots research, Yushu Technology's humanoid robots are expected to achieve shipments in the thousands by 2025, indicating accelerated industrialization [2] - Current robots possess operational capabilities for tasks such as combat and marathons, but their versatility is limited; future commercialization will depend on advancing large model evolution to enhance adaptability across various scenarios [2] Group 3 - Huari Precision has received small batch orders from Yushu Technology following initial sample testing [3] - Debang Technology's subsidiary, Suzhou Taijino, is supplying a thermal interface material to Yushu Technology, primarily for CPU chip cooling applications [3]