AI芯片及功率器件热管理大会暨展览会 2026年6月10-12日 上海新国际博览中心 01 大会信息 人工智能大模型、新能源汽车、储能系统及具身智能等新兴产业加速落地，算力密度与功率密度的同步跃 升，正将热管理推向前所未有的工程高度。一方面， AI服务器与专用芯片持续突破单芯片与单机柜功耗 上限； 此外 功率器件在新能源汽车、电力电子与储能系统中的高频、高压、高集成化应用，使系统发热 集中度与热失控风险显著上升。 在此背景下 ，本届 " AI芯片及功率器件热管理大会暨展览会 " 将聚焦高热流密度场景下的热管理系统工 程问题，围绕 高性能 导热材料、封装基板、液冷技术等方向 ， 系统性探讨 材料层面 、模块级、系统级 的关键技术路径与工程实践。 同期 "FINE2026 AI芯片及功率器件热管理 展区 " 将汇聚上下游材料、设备、产业链资源，精准对接市场 需求，全力助推液冷产业的高质量发展。 扫码报名参展参会 主题 ： 中国未来产业崛起引领全球新材料创新 时间 ： 2026年6月10-12日（6月8-9日布展） 地点 ：上海新国际博览中心 N1-N5 规模： 50,000平 ,10W+观众 02 组织机构 主办 ...

Core Viewpoint - The article discusses the rapid growth and investment opportunities in the advanced packaging materials sector, highlighting the potential for domestic companies to replace foreign imports in critical areas of technology [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI and Al-X photoresist are highlighted, with PSPI's market size in China estimated at 7.12 billion yuan in 2023 [8]. Investment Opportunities - The article identifies 14 key advanced packaging materials that are critical for the semiconductor industry, emphasizing the potential for domestic companies to capture market share from established foreign competitors [7][8]. - Companies like 鼎龙股份, 国风新材, and 三月科 are mentioned as potential leaders in the domestic market for advanced packaging materials [8]. Growth Projections - The market for conductive adhesives is expected to reach 3 billion yuan by 2026, while the chip bonding materials market is projected to grow from approximately $4.85 billion in 2023 to $6.84 billion by 2029 [8]. - The epoxy encapsulation materials market is anticipated to grow to $9.9 billion by 2027, indicating strong demand in the sector [8]. Competitive Landscape - The article outlines the competitive landscape, noting that foreign companies such as Fujifilm, Toray, and Dow currently dominate the market, but domestic firms are rapidly advancing [8]. - The need for innovation and investment in R&D is emphasized for domestic companies to successfully compete against established international players [8].

Core Viewpoint - The article discusses the rapid growth and investment opportunities in the advanced packaging materials sector, highlighting the potential for domestic companies to replace foreign imports in critical areas [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI, epoxy resin, and conductive adhesives are identified as key growth areas, with significant market size and growth forecasts [8]. Investment Opportunities - The article emphasizes the importance of domestic companies in the advanced packaging materials sector, listing several key players such as 鼎龙股份, 国风新材, and 三月科 [8]. - It outlines various investment stages in the new materials industry, from seed rounds to pre-IPO, detailing the associated risks and investment strategies at each stage [10]. Key Material Categories - The article categorizes advanced packaging materials into several types, including: - PSPI: Expected to grow from $528 million in 2023 to $2.032 billion by 2028 [8]. - Conductive adhesives: Projected to reach $3 billion by 2026 [8]. - Chip bonding materials: Estimated to grow from approximately $485 million in 2023 to $684 million by 2029 [8]. Domestic vs. Foreign Competition - The article highlights the competitive landscape, noting that foreign companies like Fujifilm, Toray, and Dow currently dominate the market, but domestic firms are rapidly advancing [8]. - It stresses the urgency for domestic companies to innovate and capture market share in light of increasing demand for advanced materials [7][8].

（文章来源：证券日报） 证券日报网1月23日讯 ，德邦科技在接受调研者提问时表示，热界面材料是整个热管理系统的重要组成 部分，目前国内做热界面材料的中小企业较多，但大部分仍处于相对低端的领域，高端热界面材料市场 主要份额仍被国外厂商占据。目前公司热界面材料已具备多品类、多系列产品及解决方案，公司凭借自 主核心技术研发能力，目前已具备参与全球高端电子封装材料产业分工、参与竞争的综合实力。同时公 司也在积极探索新的产品体系，进一步完善公司在热管理领域的布局。 ...

Group 1: AI-Driven Chemical Industry - The integration of AI in the chemical industry is expected to create investment opportunities across four key areas: research, production, operations, and supply chain management, leading to a data-driven and optimized system [5][6] - The demand for new chemical materials is driven by the energy consumption of AI data centers, with a projected compound annual growth rate of 44.8% in IT energy consumption from 2022 to 2027 [6] - The renewable energy generation in China is currently about 35%, with a future target of nearly 90%, emphasizing the need for green energy materials [7] - The new energy storage plan aims for a scale of 180 million kilowatts by 2027, with significant investments expected in lithium battery storage [8] - The manufacturing sector is poised for growth, particularly in high-end electronic resins and specialty engineering plastics, as domestic companies catch up with international standards [9] - The cooling materials market is projected to exceed $7 billion by 2034, with a compound annual growth rate of over 10% from 2024 to 2034, driven by the demand for AI-related cooling solutions [11] Group 2: Refrigeration Equipment Industry - The refrigeration and air conditioning industry in China is at a critical turning point, transitioning from a growth phase to a stable development phase dominated by replacement demand [12] - Strategic acquisitions in the HVAC sector are becoming common as companies seek to establish local distribution networks and adapt to market differences [13] - The commercial refrigeration sector, particularly in data center cooling, is highlighted as a growth area due to increasing demand for energy-efficient solutions [14] - Investment recommendations include focusing on leading companies in household refrigeration, specialized cooling solutions, and upstream components benefiting from data center demands [14]

Core Viewpoint - The article emphasizes the importance of collaboration and information sharing among professionals in the new materials sector, highlighting the establishment of a platform called "Materials Exchange" to facilitate this process [3][10]. Group 1: Platform Overview - "Materials Exchange" is described as a "frontline intelligence station" for professionals in the new materials field, offering over 1300 documents and a comprehensive knowledge network [4][5]. - The platform aims to serve as a professional search engine, allowing users to input specific challenges and access relevant information, thus reducing the isolation often felt in research [7][8]. Group 2: Research and Insights - The platform provides detailed analyses on various topics, such as solid-state battery industrialization, advanced packaging materials, and the intersection of AI and new materials, offering insights into technical bottlenecks and market dynamics [9]. - Users can benefit from the platform's extensive groundwork, which has already completed 80% of the necessary information gathering, allowing for quicker and more accurate decision-making [9]. Group 3: Target Audience - The platform is designed for a diverse audience, including engineers and scientists addressing material challenges, investors and analysts assessing market viability, and decision-makers seeking competitive advantages in new directions [9].

Core Viewpoint - The article emphasizes the importance of collaboration and information sharing among professionals in the new materials sector, highlighting the establishment of a platform called "Materials Exchange" to facilitate this process [3][10]. Group 1: Platform Overview - "Materials Exchange" is described as a comprehensive intelligence station for professionals in the new materials field, featuring over 1300 documents and a vast knowledge network [4][5]. - The platform aims to serve as a professional search engine, allowing users to input specific challenges and access relevant information quickly [7]. Group 2: Functional Benefits - The platform provides extensive resources, including technical roadmaps and independent analyses of key bottlenecks in various sectors such as solid-state batteries and advanced packaging materials [9]. - It helps users bypass extensive research by offering 80% of the foundational information needed for decision-making, thus saving time and enhancing the accuracy of insights [9]. Group 3: Target Audience - The platform is designed for engineers, scientists, investors, analysts, and decision-makers who are engaged in solving material-related challenges and seeking differentiated advantages in the market [9].

Core Viewpoint - The conference emphasizes the importance of thermal management technology in various key sectors, including AI computing, advanced packaging, new energy, and electric vehicles, aiming to drive innovation and collaboration within the industry [2][5][19]. Group 1: Conference Overview - The 6th Thermal Management Industry Conference and Expo, hosted by DT New Materials, took place in Shenzhen, gathering experts from academia and industry to discuss technological innovations and engineering practices in thermal management [2]. - The conference featured multiple forums and discussions on trending applications such as AI data centers, advanced packaging, power devices, and liquid cooling technology, providing a comprehensive communication platform for the industry [4][19]. Group 2: Keynote Highlights - Dr. Zhang Lisheng, CEO of DT New Materials, highlighted Shenzhen's role as a hub for electronic information and advanced manufacturing, aiming to create a robust ecosystem for thermal management, integrated circuits, and new materials [5][7]. - Notable presentations included topics on directional heat transfer mechanisms, thermal management in communication and AI products, and intelligent thermal control mechanisms, showcasing advancements in materials and system-level solutions [9][10][12][14][16]. Group 3: Industry Trends and Innovations - The conference discussions revealed key trends such as high heat flux density, advanced packaging, and the engineering of liquid cooling systems, indicating the main development lines for the industry over the next 3-5 years [52]. - The exhibition area featured numerous new products and solutions, facilitating direct interactions between engineers and procurement leaders, leading to potential collaborations [53]. Group 4: Future Outlook - The conference aims to create tangible value for the industry through connectivity and collaboration, with ongoing discussions between academic experts and industry representatives for future research and project implementations [56][59]. - More forums and significant content updates are expected in the following days, reflecting the growing importance of thermal management in the era of increased computational power [59].

Core Points - The iTherM2025 (Thermal Management Expo) will take place from December 3 to December 5, 2025, at the Shenzhen International Convention and Exhibition Center, Hall 10 [2][3]. - The event will feature various exhibitors and sessions focused on thermal management technologies and materials [21][22]. Event Details - **Exhibition Schedule**: - December 3: 09:00-17:00 - December 4: 09:00-17:00 - December 5: 09:00-16:00 [3] - **Sign-in Information**: - Sign-in will occur on December 2-3, 2025, at the South Lobby of the Shenzhen International Convention and Exhibition Center [4]. - **Transportation Options**: - Metro lines 1 and 4 provide access to the venue, with shuttle buses connecting to nearby stations [8][9]. - The venue is approximately 7 km from Shenzhen Bao'an Airport and 75 km from Hong Kong Airport [10]. Accommodation - A list of hotels near the venue is provided, including details on room types, prices, and distances to the exhibition center [11]. Exhibitor Information - A comprehensive list of exhibitors and their booth numbers is available, showcasing companies involved in thermal management technologies and materials [16][17][19]. Conference Agenda - The conference will include various sessions on topics such as thermal interface materials, chip and electronic device thermal management, and liquid cooling technologies [22][32][35]. - Notable speakers include professors and researchers from prestigious institutions, discussing advancements in thermal management materials and technologies [28][40].

Core Viewpoint - The article emphasizes the importance of collaboration and information sharing among professionals in the new materials sector, highlighting the establishment of a platform called "Materials Exchange" to facilitate this process [3][10]. Group 1: Platform Overview - The "Materials Exchange" serves as a comprehensive intelligence hub, featuring over 1300 documents and a vast knowledge network developed over three years [4][5]. - The platform is designed to assist users in addressing specific challenges in the new materials field by providing a searchable database of information [7][8]. Group 2: User Benefits - Users can bypass extensive research as the platform has already compiled 80% of the foundational information needed for decision-making [9]. - The platform allows for cross-referencing different tags, enabling users to uncover hidden connections and investment opportunities [9]. - It aims to save decision-making time by structuring fragmented information into coherent insights, enhancing the accuracy and speed of judgments [9]. Group 3: Target Audience - The platform is tailored for engineers and scientists tackling critical material issues, investors and analysts needing to assess market viability, academics seeking to bridge research with industry, and corporate decision-makers looking for differentiated advantages [8][9].