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中国车载芯片自主化进程提速,从“25%”到“100%”
Xin Lang Cai Jing· 2025-06-24 07:02
Core Viewpoint - Chinese automotive companies are accelerating the localization of automotive chips, aiming for 100% domestic production by 2027, driven by policy guidance and market awareness, significantly impacting the global chip landscape [1]. Group 1: Chip Classification and Current Status - Automotive chips are essential for the "soft and hard integration" architecture of modern vehicles, with a single vehicle typically requiring hundreds of chips across various functions [5]. - Chips can be categorized into five types: main control (e.g., MCU, SoC), communication (e.g., CAN/LIN/Ethernet transceivers), power (e.g., IGBT drivers), sensor (e.g., millimeter-wave radar front-end), and functional safety chips (e.g., TPM) [6]. - Chinese chip manufacturers have made breakthroughs primarily in main control and communication chip products [6][8]. Group 2: Current Developments in Domestic Chip Production - Companies like Neusoft Carrier, Jiefa Technology, and Huada Semiconductor have launched automotive-grade MCU products that meet AEC-Q100 certification, supporting ISO 26262 safety standards [8]. - In the communication chip sector, companies such as Xingyu Technology and Xinyi Information have achieved small-scale production of domestic CAN and Ethernet PHY chips, with some products entering the vehicle development cycle [8]. - High-performance intelligent driving SoC chips are still dominated by a few companies, with examples like Horizon's Journey series and Huawei's Kirin series, which are being deployed in various vehicle models [9]. Group 3: Trends in Chip Research and Development - Chinese automotive companies are transitioning from being "chip purchasers" to "chip architecture participants" and even "definers," with firms like XPeng leading the way in self-developed AI chip strategies [10]. - The evolution of hardware architecture is moving towards SoC integration platforms that emphasize multi-domain collaboration, requiring chip companies to possess both hardware design capabilities and a complete software SDK stack [12]. - Collaborations between automotive and chip companies are increasing, with examples including Geely's partnership with Hezhima for intelligent driving platforms and BYD's full-stack self-research model for core modules [13][15].