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【看新股】晶晨股份赴港IPO:智能终端SoC芯片龙头 客户集中度较高
Xin Hua Cai Jing· 2025-10-15 23:24
Core Viewpoint - 晶晨半导体 plans to list on the Hong Kong Stock Exchange, aiming to raise funds for advanced chip technology development, following a successful listing on the STAR Market in 2019 [2][12]. Group 1: Company Overview - 晶晨股份 is a leading fabless semiconductor company focusing on smart multimedia and display SoC, AIoT SoC, communication and connectivity chips, and automotive SoC [3]. - The company ranks fourth globally among smart terminal SoC manufacturers and is the top player in mainland China for home smart terminal SoC [3]. Group 2: Financial Performance - In the first half of 2025, the company achieved revenue of 3.33 billion yuan, a year-on-year increase of 10.42%, and a net profit of 497 million yuan, up 37.12% [2][3]. - The revenue compound annual growth rate from 2016 to 2024 was 22.7%, driven by the rapid growth in the smart home market and increased penetration of edge intelligence technology [3]. Group 3: Business Segments - The main business segment, smart multimedia and display SoC, accounted for over 70% of revenue in the past three years, while AIoT SoC revenue has been increasing, reaching 26.7% in the first half of 2025 [5]. - The top five customers contributed significantly to revenue, accounting for 57.9% to 66.3% of total revenue from 2022 to the first half of 2025 [5]. Group 4: Recent Developments - On September 15, 2025, the company announced the acquisition of 100% of芯迈微半导体 for 316 million yuan, which will enhance its capabilities in cellular communication and Wi-Fi technology [6][11]. - The IPO proceeds will allocate approximately 70% for advanced chip technology development, 10% for global customer service system construction, 10% for strategic investments and acquisitions, and 10% for working capital [13].