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【看新股】晶晨股份赴港IPO:智能终端SoC芯片龙头 客户集中度较高
Xin Hua Cai Jing· 2025-10-15 23:24
Core Viewpoint - 晶晨半导体 plans to list on the Hong Kong Stock Exchange, aiming to raise funds for advanced chip technology development, following a successful listing on the STAR Market in 2019 [2][12]. Group 1: Company Overview - 晶晨股份 is a leading fabless semiconductor company focusing on smart multimedia and display SoC, AIoT SoC, communication and connectivity chips, and automotive SoC [3]. - The company ranks fourth globally among smart terminal SoC manufacturers and is the top player in mainland China for home smart terminal SoC [3]. Group 2: Financial Performance - In the first half of 2025, the company achieved revenue of 3.33 billion yuan, a year-on-year increase of 10.42%, and a net profit of 497 million yuan, up 37.12% [2][3]. - The revenue compound annual growth rate from 2016 to 2024 was 22.7%, driven by the rapid growth in the smart home market and increased penetration of edge intelligence technology [3]. Group 3: Business Segments - The main business segment, smart multimedia and display SoC, accounted for over 70% of revenue in the past three years, while AIoT SoC revenue has been increasing, reaching 26.7% in the first half of 2025 [5]. - The top five customers contributed significantly to revenue, accounting for 57.9% to 66.3% of total revenue from 2022 to the first half of 2025 [5]. Group 4: Recent Developments - On September 15, 2025, the company announced the acquisition of 100% of芯迈微半导体 for 316 million yuan, which will enhance its capabilities in cellular communication and Wi-Fi technology [6][11]. - The IPO proceeds will allocate approximately 70% for advanced chip technology development, 10% for global customer service system construction, 10% for strategic investments and acquisitions, and 10% for working capital [13].
晶晨半导体(上海)股份有限公司(H0070) - 申请版本(第一次呈交)
2025-09-24 16:00
香港聯合交易所有限公司與證券及期貨事務監察委員會對本申請版本的內容概不負責,對其準確性或完整 性亦不發表任何意見,並明確表示概不就因本申請版本全部或任何部分內容而產生或因倚賴該等內容而引 致的任何損失承擔任何責任。 Amlogic (Shanghai) Co., Ltd. 晶晨半導體(上海)股份有限公司 (「本公司」) (於中華人民共和國註冊成立的股份有限公司) 的申請版本 警告 本申請版本乃根據香港聯合交易所有限公司(「聯交所」)及證券及期貨事務監察委員會(「證監 會」)的要求而刊發,僅用作提供資訊予香港公眾人士。 本申請版本為草擬本,其內所載資料並不完整,亦可能會作出重大變動。 閣下閱覽本文件,即 代表 閣下知悉、接納並向本公司、其聯席保薦人、整體協調人、顧問或包銷團成員表示同意: 於本公司招股章程根據香港法例第32章公司(清盤及雜項條文)條例送呈香港公司註冊處處長登 記前,不會向香港公眾人士提出要約或邀請。倘在適當時候向香港公眾人士提出要約或邀請, 有意投資者務請僅依據於香港公司註冊處處長註冊的本公司招股章程作出投資決定。該招股章 程的文本將於發售期內向公眾人士刊發。 香港交易及結算所有限公司、香港聯合 ...