格隆汇11月24日｜华金证券研报指出，环旭电子是全球电子设计制造服务领导厂商，在SiP(System-in- Package)模组领域居行业领先地位。2020年底，公司设立微小化研发创新中心（MCC），围绕微小化技 术和SiP 模组的应用推广，服务国内外客户对微小化、模组化的产品需要，提供从设计到制造的"一站 式服务"。光模块、智能眼镜、AI加速卡等多维度开拓，新一轮成长可期。认为公司多条产品线预计有 新增量业务落地，新一轮成长曲线可期。考虑到公司是SiP微小化技术的行业领导者，多业务线预计将 进入新一轮成长周期，首次覆盖，给予"买入"评级。 ...

Core Viewpoint - The company is actively exploring new opportunities in the SiP module market, particularly in mobile applications and AI glasses, while also focusing on expanding its production capacity in response to customer demand [1][4][7]. Group 1: SiP Modules and Mobile Applications - The company has identified potential in SiP modules for mobile applications, with new project developments in the SiPlet area [1]. - There is a shift in customer demand towards new applications, indicating future opportunities for SiP modules in mobile devices [1]. - The high integration SiP modules are expected to significantly reduce the size of main control boards in AI glasses, although cost advantages over COB solutions are not yet realized due to low production volumes [4][5]. Group 2: L10 Server JDM Project - The L10 server JDM project has been successfully delivered, developed in collaboration with long-term OEM customers, focusing on edge server solutions [2]. - The company is closely monitoring market reactions to the L10 product and is committed to ongoing collaboration with customers [2]. Group 3: Optical Modules and R&D - The company is currently developing a 1.6T optical module, with plans to enhance product validation efficiency through new laboratory facilities [3]. - The strategy includes strengthening collaboration across the supply chain to establish comprehensive capabilities from R&D to manufacturing in the optical module sector [3]. Group 4: Capital Expenditure and Production Capacity - The company plans to increase production capacity by 30% in Taiwan and 20% in Mexico to meet rising customer demand [3]. - Current capital expenditure guidance is set at $200 million, with potential increases anticipated for future projects, particularly in high-voltage direct current supply systems [6]. Group 5: Market Demand and Business Outlook - The company expects stable demand in 2025, with significant growth anticipated in the smart glasses segment [7]. - The industrial product inventory turnover is slower than expected, indicating a gradual return to normalcy in the second half of the year [7]. - The company is focusing on key components in consumer electronics, with plans to invest in manufacturing capabilities for AI glasses modules [5]. Group 6: Strategic Focus on Vertical Power Supply and Optical Modules - The company is leveraging its micro-miniaturization capabilities and advanced packaging advantages to develop vertical power supply and optical module technologies [8]. - The vertical power supply project is expected to see market readiness around 2028, with ongoing collaboration and investment planned [6][8]. Group 7: AI Acceleration Cards - The company aims to capture a 30% market share in AI acceleration cards, with plans to expand into motherboard business as well [9]. Group 8: Financial Performance - The company's Q1 2025 report shows a revenue of 13.649 billion yuan, a year-on-year increase of 1.16%, and a net profit of 335 million yuan, reflecting a slight increase [10]. - The debt ratio stands at 53.12%, with investment income reported at 87.4352 million yuan [10]. Group 9: Analyst Ratings and Predictions - Recent analyst ratings indicate a positive outlook, with three institutions issuing buy ratings and a target average price of 17.13 yuan [11]. - Profit forecasts for the next three years show expected growth in net profit, with estimates reaching 27.64 billion yuan by 2027 [11].

Core Viewpoint - The event "I am a Shareholder" organized by Dongfang Securities showcased the operational achievements and future potential of Huanxu Electronics, emphasizing its leadership in the global electronic design and manufacturing industry [1][2]. Company Overview - Huanxu Electronics, established in 1976 in Taiwan, officially listed on the Shanghai A-share main board in 2012 and is a leading global manufacturer in the System in Package (SiP) module sector [1]. - The company provides design, miniaturization, material procurement, manufacturing, logistics, and after-sales services for electronic devices/modules across various sectors, including communications, cloud and storage, consumer electronics, industrial, medical, and automotive electronics [1]. Operational Performance - Since its listing, Huanxu Electronics has seen continuous revenue growth, reaching a historical high of $10.1 billion in 2022, up from approximately $2 billion at the time of its IPO [2]. - The company ranks twelfth among global peers in its industry, attributed to its efforts in technological innovation, customer expansion, and global layout [2]. Industry Trends and Challenges - The global supply chain is undergoing reconstruction due to geopolitical factors, prompting companies to focus on supply chain security and stability [2]. - Huanxu Electronics is optimizing its global production layout and enhancing collaboration with clients to improve competitiveness in response to potential market risks [2]. Technological Advancements - The company showcased its SiP module technology, which integrates multiple functional chips into a compact module, widely used in consumer electronics like smartwatches and Bluetooth headsets, highlighting its strong technical capabilities in miniaturization [3]. Future Strategy - Huanxu Electronics aims to combine localized operations with a global framework to leverage regional resource advantages, reduce operational costs, and enhance customer service quality [2]. - The company is committed to innovation-driven and customer-centric principles to continuously enhance its capabilities and create greater value for shareholders [3].