Core Viewpoint - The article discusses advancements in lithography, mask, and Optical Proximity Correction (OPC) technologies, emphasizing their critical role in improving power-performance-area-cost (PPAC) metrics for advanced logic chips. It highlights the shift from 2-D Manhattan layouts to 1-D designs and the introduction of curvilinear shapes to enhance manufacturing efficiency and reduce costs [1][2][6]. Summary by Sections Lithography and Design Advances - The evolution of lithography techniques, including immersion lithography and extreme ultraviolet (EUV) lithography, has significantly improved resolution, which is essential for meeting the demands of advanced logic chip design [2][4]. - The transition from 2-D to 1-D Manhattan layouts allows for denser representations but introduces challenges such as increased costs and longer current paths due to additional vias [2][10]. Curvilinear Design Concepts - The introduction of curvilinear shapes in mask writing aims to reduce errors during the transfer from design to wafer, addressing the inherent distortions caused by current lithography methods [6][7]. - imec proposes integrating curvilinear geometries at the design stage, which could lower manufacturing costs while enhancing electrical performance, representing a significant innovation in the semiconductor industry [7][10]. Use Cases for Curvilinear Design - **Use Case 1**: Curvilinear design can simplify middle-of-line (MOL) and back-end-of-line (BEOL) layers, potentially reducing wafer costs by 7% and improving performance by approximately 5% by eliminating unnecessary vias [10][12]. - **Use Case 2**: In CMOS devices, curvilinear designs can connect source/drain contacts and gates without additional metal layers, leading to a 20% reduction in area for standard cells [12][13]. - **Use Case 3**: Curvilinear geometries in layout routing are expected to have the most significant impact, requiring substantial industry investment but promising to enhance power-performance-area-cost (PPAC) metrics across future logic technology nodes [13][14]. Challenges and Future Directions - Implementing curvilinear designs poses challenges, including the need for specialized design rules and verification methods to manage increased data volumes in the manufacturing ecosystem [14][17]. - The potential of curvilinear designs to optimize high numerical aperture EUV lithography could benefit various applications, including image sensors and automotive chips, by reducing manufacturing costs [17].