Workflow
欧洲芯片法
icon
Search documents
EUV光刻机,又一重磅宣布
半导体行业观察· 2025-03-23 04:03
Core Viewpoint - The strategic partnership agreement between Imec and Zeiss Semiconductor Manufacturing Technology aims to advance semiconductor technology development, particularly for research and development below 2 nanometers, extending their collaboration until 2029 [3][7]. Group 1: Partnership Details - The new agreement extends the existing partnership established in 2019, emphasizing the importance of collaboration in advancing semiconductor technology [3]. - Imec and Zeiss have been working together since 1997 on various joint projects to further develop Moore's Law, which continues to enhance microchip and memory processor performance [3][5]. - The partnership focuses on key semiconductor manufacturing technologies, including high numerical aperture EUV lithography, which is essential for producing more powerful and energy-efficient microchips [3][5]. Group 2: Technological Advancements - Imec's NanoIC pilot line is being expanded to cover the entire value creation process and various technology chains in semiconductor manufacturing [5]. - The pilot line aims to provide groundbreaking and advanced semiconductor technologies and platforms for industry representatives, enabling them to explore, develop, and test innovations [5]. - Both companies are committed to optimizing existing equipment, processes, and measurement methods to achieve smaller, more powerful, and energy-efficient microchips, driving global digitalization [5][8]. Group 3: European Chip Act Compliance - The collaboration aligns with the goals of the European Chip Act, which aims to strengthen Europe's technological sovereignty, competitiveness, and resilience [7]. - Zeiss's investment in the NanoIC pilot line contributes significantly to maintaining Europe's leadership in the latest generation of semiconductor equipment [7]. - The partnership highlights the strong cohesion among European partners, which is crucial for establishing the NanoIC pilot line, recognized as the world's most advanced R&D infrastructure below 2 nanometers [8].