Core Insights - Hyundai Mobis is set to produce new automotive chips in collaboration with domestic companies like Samsung and LX Semicon to reduce reliance on imports [1][2] - The company aims to launch over 10 different types of chips in the next two to three years [1] - The automotive industry faced challenges from 2021 to 2023 due to semiconductor shortages, prompting the need for a fundamental response to prevent future issues [1] Group 1 - Hyundai Mobis has developed 16 types of system semiconductors and currently produces 20 million units annually [2] - The company plans to manufacture power management ICs (PMIC) and aims to produce Si-IGBT by 2026 [2] - Hyundai Mobis is working on an integrated body control unit (IBU) chip, which combines five functions and is expected to launch in 2026 [2] Group 2 - The company collaborates with various partners, including Anatech, DB Hitek, and ASE Korea, for wafer design, manufacturing, and packaging [2] - Hyundai Mobis is developing a smart LED product that integrates LED with driver IC in partnership with Global Technology, SK Key Foundry, and East LED [2] - The company is also working on a network SoC in collaboration with Samsung Foundry, LX Semicon, Cadence, Synopsys, and ADT [2]