今日涨跌幅居前的概念板块 | 概念 | 今日涨跌幅（%） | 概念 | 今日涨跌幅（%） | | --- | --- | --- | --- | | 兵装重组概念 | 4.83 | 国家大基金持股 | -5.04 | | 2025三季报预增 | 3.44 | 同花顺果指数 | -4.64 | | 天津自贸区 | 2.13 | 中国AI 50 | -4.52 | | 动物疫苗 | 1.93 | MCU芯片 | -4.26 | | 草甘膦 | 1.92 | 汽车芯片 | -4.22 | | 深圳国企改革 | 1.85 | AI手机 | -3.99 | | 水泥概念 | 1.84 | AI PC | -3.94 | | 玉米 | 1.71 | 无线耳机 | -3.64 | | 赛马概念 | 1.62 | 存储芯片 | -3.62 | | 猪肉 | 1.60 | MLOps概念 | -3.56 | 资金面上看，今日汽车芯片概念板块获主力资金净流出124.97亿元，其中，111股获主力资金净流出， 32股主力资金净流出超亿元，净流出资金居首的是长电科技，今日主力资金净流出8.66亿元，净流出资 金居前的还有豪威集团、兆 ...

核心结论 分析师 【有色金属】稀土产业政策点评：稀土出口管控持续强化，二次资源回收正 式进入管控范畴 新公告后稀土供给端已完全管控，除政府作为，供给端难以出现突发的较大 增量；在技术方面，严格限制中国公民、法人、非法人组织未经许可不得为 境外稀土相关活动提供任何实质性帮助和支持，从法律层面切断海外企业通 过中国技术人员快速扩产的可能。 【电子】纳芯微（688052.SH）动态跟踪：盈利能力持续修复，产品矩阵突 破未来可期 晨会纪要 证券研究报告 2025 年 10 月 10 日 我们预测 25-27 年营收为 29.76/38.44/47.62 亿元，预计对应归母净利润为 -0.46/1.73/3.87 亿元，维持"买入"评级。 【其他】总量月报第 3 期：关注政策宽松带来的交易机会 经济增长动能有所放缓，宏观政策可能再次宽松。政治局会议预告四中全会 召开时间，后续政策可期。美国"严格而简单"的出口管制策略逐步落地。 固定收益配置价值凸显，交易关注超跌反弹。权益市场"冰火转换"时刻将 至。金融进入"业绩验证与政策催化"窗口期。房地产政策落地见效，新房 市场温和修复。 【固定收益】10 月转债月报：估值区间震荡 ...

2025 年第二季度业绩快速增长：得益于手机芯片、汽车芯片国产化进程加快、家电等领域国补政策持 续利好，以及大客户AMD 的强劲增长，2025年上半年公司实现营收130.4 亿元，同比增长17.7%（其中 与AMD 合资的苏州和槟城两家封测厂合计贡献收入83 亿元，同比增长15.7%）；实现净利润4.1 亿元， 同比增长27.7%（苏州与槟城厂贡献净利润7.3 亿元，同比增长24%），EPS 为0.27 元。其中，第二季度 单季公司实现营收69.5 亿元，同比增长19.8%；实现净利润3.1 亿元，同比增长38.6%，环比增长206%。 结论与建议： OpenAI 与AMD 宣布合作，将部署总计6GW 的AMD 芯片，计划从明年下半年开始先行部署1GW。预 计未来数年内将为AMD 带来近千亿美元规模的收入。公司作为AMD 的核心封测厂商，有望深度受益 于大客户业务规模的提升。我们将公司2027 年盈利预测上调23%，预计2025–2027 年实现净利润分别为 10.9 亿元、18.5 亿元和27.1 亿元，同比分别增长61%、69%和47%，EPS 分别为0.72 元、1.22 元和1.79 元。当前股价对应 ...

Core Insights - Hyundai Mobis is set to produce new automotive chips in collaboration with domestic companies like Samsung and LX Semicon to reduce reliance on imports [1][2] - The company aims to launch over 10 different types of chips in the next two to three years [1] - The automotive industry faced challenges from 2021 to 2023 due to semiconductor shortages, prompting the need for a fundamental response to prevent future issues [1] Group 1 - Hyundai Mobis has developed 16 types of system semiconductors and currently produces 20 million units annually [2] - The company plans to manufacture power management ICs (PMIC) and aims to produce Si-IGBT by 2026 [2] - Hyundai Mobis is working on an integrated body control unit (IBU) chip, which combines five functions and is expected to launch in 2026 [2] Group 2 - The company collaborates with various partners, including Anatech, DB Hitek, and ASE Korea, for wafer design, manufacturing, and packaging [2] - Hyundai Mobis is developing a smart LED product that integrates LED with driver IC in partnership with Global Technology, SK Key Foundry, and East LED [2] - The company is also working on a network SoC in collaboration with Samsung Foundry, LX Semicon, Cadence, Synopsys, and ADT [2]

Core Viewpoint - The 2025 World New Energy Vehicle Conference focused on "Industry Transformation and Sustainable Development," aiming to guide the global automotive industry in rationally responding to changes and exploring paths for high-quality development [1][2]. Group 1: Five Key Forces for Sustainable Development - Collaborative Innovation: The automotive technology system is evolving towards the integration of mechanics, electronics, computing, and data, necessitating cross-disciplinary collaboration in areas like solid-state batteries and intelligent driving systems [1]. - Supply Chain Collaboration: There is an urgent need to build a data-driven, interconnected supply chain system to enhance the resilience of the industry against risks [1][2]. - Talent Development: The rapid growth of smart connected new energy vehicles demands a higher caliber of composite talent, requiring a dual-track training system that aligns technical research and skills operation [2]. Group 2: Standards and Global Cooperation - Standard Co-creation: Establishing standards is essential to avoid low-level competition and promote sustainable development within the industry, particularly in cutting-edge fields like solid-state batteries and automotive AI [2]. - Open Cooperation: Sustainable development is a global issue that requires open and inclusive principles, fostering international dialogue to overcome trade barriers and build a fair and transparent global automotive ecosystem [2].

四是标准共建，引领高质量发展。标准是避免低水平竞争、推动产业可持续发展的"通行证"。需加快全 固态电池、车用人工智能等前沿领域标准研制，推进智能驾驶功能分级、数据安全等标准支撑，推动全 球标准互认。 五是开放合作，共迎全球挑战。可持续发展是全球性课题，必须坚持开放包容、平等互惠的原则，通过 国际对话协调破解贸易壁垒，共建公平、透明、非歧视的全球汽车产业新生态。 围绕如何推动产业实现长期可持续发展，侯福深提出应汇聚"五大合力"： 一是协同创新，破解"内卷"迷局。随着汽车技术体系从机电一体化向"机械、电子、算力、数据"融合演 进，跨学科、跨领域的协同创新成为关键。需在全固态电池、智能驾驶、智能底盘等前沿方向，以及汽 车芯片、操作系统、人工智能等基础领域加强联合攻关，为产业注入持续创新动力。 二是供应链融通，提升产业韧性。面对产业链主体拓展与价值体系重构，亟须构建数据驱动、互联互通 的新型供应链体系，实现"研产供销服"全链条数字化贯通，提升产业链的抗风险能力。 三是人才培育，夯实转型根基。智能网联新能源汽车的快速发展对复合型人才提出更高要求。应推动学 科体系重构，深化产教融合，完善汽车人才评价机制，构建"技术研发+ ...

"当前，全球新能源汽车市场稳健增长，汽车产业电动化、智能化、低碳化转型和基础设施建设协调有序推进。要以能源转型、数智变革、低碳发展为契 机，持续扩大对外开放、优化营商环境，鼓励国内外汽车企业深化交流合作、创新合作方式，共同构建开放包容、合作融通、共同发展的汽车产业发展格 局。"在9月27日举办的2025世界新能源汽车大会上，中国科学技术协会主席、世界新能源汽车大会主席万钢呼吁，应积极培育新的产业价值增长极，让创 新科技发展成果更好惠及各国人民。 图片来源：主办方供图 据悉，2025世界新能源汽车大会以"产业变革与可持续发展"为主题，展览面积达1万平方米，集结了50多家全球新能源汽车领域企业，不仅有多款热门新 能源汽车集中亮相，还有动力电池、高级别自动驾驶、汽车芯片等前沿技术成果展示。 实际上，在政策推动下，国内新能源汽车市场成绩亮眼。乘联分会数据显示，今年1~8月，国内新能源乘用车累计批发销量约893.1万辆，同比增长 33.5%。其中，8月，国内新能源汽车厂商批发渗透率为52.2%，较2024年同期提升3.3个百分点。 2030年国内新能源渗透率有望达到70% "新能源汽车发展是一项系统性工程，既要突破电池 ...

2025世界新能源汽车大会将举办多场公众活动 多项新能源车前沿技术亮相海南 大会展览面积达1万平方米，汇聚了50多家全球新能源汽车领域企业，包括深蓝汽车、大众、宝马、奔 驰、丰田汽车、上汽集团、广汽集团、神州租车、海南海马、浩思动力、无锡星驱动力、海康智联等，展品 涵盖动力电池、驱动电机、汽车电控、智能底盘、高级别自动驾驶、汽车芯片、综合零部件等多项前沿技术 及产品。 9月28日09：00-17：00 9月29日09：00-12：00 9月27日，2025世界新能源汽车大会在海南省海口市举行。来自全球多个国家和地区的政产学研界代表围 绕探索未来交通出行和绿色可持续发展进行对话和交流。海南日报全媒体记者 陈元才 摄 海南日报海口9月27日讯(海南日报全媒体记者 邵长春)2025世界新能源汽车大会(WNEVC)9月27日至29日 在海口举办，为落实新能源汽车科学普及、推动新能源汽车加速渗透、促进新能源汽车消费等目标，大会除 了20场会议活动外，还同期策划了新能源汽车科普讲堂、新能源汽车技术及科普展等多个公众可参与的活 动。 本次技术展览全程向社会公众免费开放，可零距离了解新能源汽车发展新趋势，感受科技、低碳新生 ...

Core Viewpoint - Automotive chips are essential for the development of electric and intelligent vehicles, facing challenges such as high reliability requirements, large-scale circuit verification, and stringent functional safety standards [2][14]. Group 1: Quality, Safety, and Reliability Challenges - Automotive chips must meet high-quality testing and zero-defect (0 DPPM) requirements, eliminating defects introduced during manufacturing [4]. - The verification cycle for automotive-grade chips is longer than for consumer-grade chips, requiring rigorous testing certifications like AEC-Q100, which increases design cycle and cost challenges [4]. - The complexity of fault types and testing scales has increased with the development of large-scale integrated circuits, leading to higher testing difficulty, time, and costs [4]. Group 2: Testing Solutions - Siemens EDA's Tessent™ solution helps automotive chip designers ensure high quality, enhance safety, and improve reliability, accelerating time-to-market [4]. - Tessent DFT technology provides high-quality testing to ensure zero defects, generating defect-oriented fault models for comprehensive testing coverage [5]. - Tessent™ LogicBIST and MemoryBIST solutions enable in-chip self-testing capabilities and non-destructive memory testing during system operation, respectively [8]. Group 3: Verification Challenges - Accurate functional verification before chip tape-out is crucial, with increasing complexity in automotive chips making this process more challenging [10]. - The new Veloce™ CS hardware-assisted verification system from Siemens EDA significantly enhances hardware acceleration performance, supporting over 40 billion gates [11]. - Veloce proFPGA CS allows for rapid execution of silicon verification, facilitating firmware and application development [12]. Group 4: Functional Safety Requirements - The performance and safety of chips directly impact driving safety, necessitating compliance with functional safety standards like ISO 26262 [14]. - There is a growing demand for higher safety levels in automotive chips, particularly for ASIL-D level designs related to advanced driver-assistance systems (ADAS) [15]. - Siemens EDA's Austemper platform enhances efficiency in safety analysis and verification, supporting clients in meeting ASIL-B and ASIL-D requirements [15][17]. Group 5: Industry Impact - Automotive chips play an indispensable role in the intelligent and electric transformation of modern vehicles, with Siemens EDA providing advanced solutions to ensure high quality and reliability [17].

Core Viewpoint - Mercedes-Benz has spun off a group of chip experts into a new company, Athos Silicon, focused on developing next-generation computing brains for autonomous vehicles, drones, and other vehicles [1][3]. Group 1: Company Overview - Athos Silicon is headquartered in Santa Clara, California, and its engineering team previously worked at Mercedes-Benz's North American R&D center for five years [1]. - The company will receive intellectual property developed by the group and significant investment from Mercedes-Benz, although the transaction value has not been disclosed [3]. Group 2: Technology and Innovation - Reliability is crucial for automotive chips, leading to the use of multiple independent chips for critical autonomous driving functions to ensure backup in case of failure [3]. - Athos has developed a method using "chiplets" to achieve the same reliability, allowing multiple small chips to be packaged together, which can reduce power consumption by 10 to 20 times compared to independent chips [3]. - This energy efficiency is vital for electric vehicles, as the computing core must compete for limited battery power [3]. Group 3: Strategic Positioning - Athos Silicon plans to raise venture capital from other investors and aims to maintain a neutral stance to engage with other automakers, including competitors of Mercedes-Benz [4]. - Mercedes-Benz will hold a minority stake in Athos Silicon, which will have an independent board [3].