Core Viewpoint - The company, Wogao Optoelectronics (603773), is collaborating with major manufacturers in various fields to develop GCP glass-based circuit board products, with expectations for initial mass production in some products by next year [1] Group 1 - Wogao Optoelectronics is involved in the semiconductor packaging substrate business, communication RF, CPO optoelectronic co-packaging, and advanced Chiplet packaging applications [1] - The collaboration with major manufacturers is at different stages across various fields [1] - Initial mass production applications for some products are anticipated to begin next year [1]