光通信 - Guangxun Technology has achieved the capability for mass delivery of its 1.6T optical module products [1] AR眼镜 - Jiahe Intelligent is collaborating with other clients to develop AR glasses, which are entering the trial production verification stage [1] 机器人 - Haozhi Electromechanical has sent samples for testing to several humanoid robot manufacturers and has achieved initial sales [1] 固态电池 - Funeng Technology has sent samples of its semi-solid batteries to leading global logistics drone clients [1] 液冷 - Jieban Technology is working on product introduction for liquid cooling module business with clients [1] - New Zhoubang indicates that while the market for immersion cooling liquids in liquid-cooled servers is steadily growing, the total volume remains limited [1] 其他 - China Shenhua expects limited impact on coal production from capacity verification [1] - Woge Optoelectronics anticipates that GCP glass-based circuit board products produced by Tongge Micro will enter preliminary mass production applications next year [1] - Zhongqi Co. expects to start production of chlorantraniliprole in the fourth quarter of this year and gradually supply the market [1] - Runjian Co. is involved in the construction and operation of 24 computing power centers in Malaysia and other ASEAN countries [1] - Defang Nano reports a continuous increase in the shipment volume of its fourth-generation high-pressure dense lithium iron phosphate products [1] - Hongli Zhihui has not received significant price increase information in the Mini LED industry [1] - Tongyu Communications has multiple low-altitude economy solutions in the verification stage, with plans to initiate small-scale production upon successful validation [1]

Core Viewpoint - The company, Wogao Optoelectronics (603773), is collaborating with major manufacturers in various fields to develop GCP glass-based circuit board products, with expectations for initial mass production in some products by next year [1] Group 1 - Wogao Optoelectronics is involved in the semiconductor packaging substrate business, communication RF, CPO optoelectronic co-packaging, and advanced Chiplet packaging applications [1] - The collaboration with major manufacturers is at different stages across various fields [1] - Initial mass production applications for some products are anticipated to begin next year [1]

Core Viewpoint - Wogao Optoelectronics (603773.SH) is collaborating with major manufacturers in various fields for the development of GCP glass-based circuit board products, which are applicable in semiconductor packaging, communication RF, CPO optoelectronic integration, and advanced Chiplet packaging [1] Group 1 - The GCP glass-based circuit board products are involved in multiple applications including semiconductor packaging and communication RF [1] - The collaboration with major manufacturers is at different stages depending on the specific field [1] - Further details will be provided in official announcements [1]