Core Viewpoint - The company, Wogao Optoelectronics (603773), is collaborating with major manufacturers in various fields to develop GCP glass-based circuit board products, with expectations for initial mass production in some products by next year [1] Group 1 - Wogao Optoelectronics is involved in the semiconductor packaging substrate business, communication RF, CPO optoelectronic co-packaging, and advanced Chiplet packaging applications [1] - The collaboration with major manufacturers is at different stages across various fields [1] - Initial mass production applications for some products are anticipated to begin next year [1]

Core Viewpoint - Wogao Optoelectronics (603773.SH) is collaborating with major manufacturers in various fields for the development of GCP glass-based circuit board products, which are applicable in semiconductor packaging, communication RF, CPO optoelectronic integration, and advanced Chiplet packaging [1] Group 1 - The GCP glass-based circuit board products are involved in multiple applications including semiconductor packaging and communication RF [1] - The collaboration with major manufacturers is at different stages depending on the specific field [1] - Further details will be provided in official announcements [1]