Core Viewpoint - The company, Saiwei Electronics, is actively developing MEMS-OCS micro-mirror arrays to enhance optical link performance and stability while reducing system costs and power consumption, with applications in data center networks and supercomputing clusters [1] Group 1: Technology Development - The MEMS-OCS micro-mirror array technology allows precise adjustment of the refraction direction of optical links, enabling signal switching and bidirectional transmission [1] - The company has nearly 10 years of experience in the MEMS-OCS field, from initial contact to staged development, risk trial production, and mass production [1] Group 2: Industry Position - The company aims to continue its role as a specialized MEMS manufacturer, participating in the development of related industries [1] - Ongoing research and development efforts will focus on silicon photonic communication chip manufacturing technology and advancing related technical challenges and foundational application research [1]

Group 1 - The core viewpoint of the article is that the company, Saiwei Electronics, is actively developing silicon photonic communication chip manufacturing technology and is making progress in related technical challenges and foundational application research [1] - The MEMS-OCS at the Beijing FAB has entered the trial production stage, indicating a significant milestone in the company's manufacturing capabilities [1]

Core Viewpoint - Saiwei Electronics is advancing its research and development in silicon photonic communication chip manufacturing technology at its Fab3 facility in Beijing, with the MEMS-OCS now entering the risk trial production phase [2]. Group 1: Company Developments - The company is focused on continuous technological breakthroughs and foundational application research related to silicon photonic communication chips [2]. - The MEMS-OCS, a core component of optical communication networks, is being developed for various applications including optical network protection, real-time optical path monitoring, fiber testing, optical device testing, optical sensing, optical add-drop multiplexing, and optical cross-connect equipment [2].