Core Viewpoint - TSMC is accelerating its expansion in the U.S., with its third Arizona fab (F21 P3) having broken ground in Q2, but it currently meets only 7% of U.S. chip demand [1][2]. Group 1: Expansion and Production Capacity - TSMC's Arizona factory is currently only able to satisfy 7% of the U.S. chip demand, indicating a significant gap in supply [1]. - The company is targeting major clients like NVIDIA, AMD, and Tesla, with AMD's next-generation Venice processor planned for 2nm production at the Fab 21 facility [1]. - TSMC's second Arizona fab, utilizing 3nm technology, has been completed, and the company is working to accelerate its mass production schedule to meet customer demand [2]. Group 2: Advanced Packaging and Technology - TSMC is investing in its first advanced packaging factory in the U.S., expected to begin construction in 2026, which will be connected to its P3 fab [3]. - The new AP1 factory will focus on SoIC (System on Integrated Chip) and CoW (Chip on Wafer) processes, with the final substrate steps likely outsourced to Amkor [3]. - AMD's next-generation EPYC Venice processor is expected to utilize TSMC's 2nm process and SoIC packaging technology [4]. Group 3: Competitive Landscape - Elon Musk confirmed that TSMC will produce Tesla's new AI5 chip, but also noted that Samsung is building a new advanced 2nm fab in Texas specifically for Tesla's next-generation AI6 chip, highlighting strong demand and competition in the U.S. market [2]. - NVIDIA plans to release its Rubin chip next year, which will also incorporate TSMC's SoIC technology, integrating two GPUs on N3P and one I/O Die on N5B [4].