Core Insights - The article emphasizes the inevitable transition of data centers to Co-Packaged Optics (CPO) switches, driven primarily by the power savings offered by CPO technology [1][2] - It discusses the ongoing debate between CPO and Linear Pluggable Optics (LPO), highlighting the efficiency and complexity concerns associated with CPO [1][2] - The advancements in CPO technology and its reliability improvements over the past two years are noted, suggesting that CPO may become the only viable option for future high-speed data transmission [2] Summary by Sections CPO Technology Overview - CPO technology integrates optical engines within ASIC packages, utilizing both Electronic Integrated Circuits (EIC) and Photonic Integrated Circuits (PIC) [3] - Two main integration methods are discussed: silicon interposer and organic substrate, each with its own advantages and challenges regarding thermal management and packaging complexity [4][6][7] Bandwidth Density - Bandwidth density is defined as the amount of data transmitted per millimeter along the optical interface, crucial for meeting the growing bandwidth demands in data centers [9] Comparison of CPO Solutions: Broadcom vs. NVIDIA - Broadcom's Bailly CPO switch integrates eight optical engines with a total external bandwidth of 51.2 Tbps, while NVIDIA's Quantum-X aims for over 100 Tbps [12][15] - Broadcom's design focuses on a single package integration, whereas NVIDIA's approach allows for detachable optical modules, enhancing maintainability [19][20] Optical Engine and Fiber Coupling - Both companies utilize edge-coupled fiber connections for high bandwidth density, with Broadcom employing a highly automated process for fiber alignment [23] - The article highlights the challenges of fiber coupling and the need for efficient laser integration to maintain low power consumption [27][28] Power Efficiency and Thermal Management - CPO technology significantly reduces power consumption per bit compared to traditional pluggable modules, with Broadcom reporting 5.5W per 800 Gb/s port versus 15W for equivalent modules [32] - Both companies require liquid cooling solutions to manage the heat generated by their high-density ASIC packages [32][40] Future Directions and Challenges - The article discusses the potential of photonic fabrics and advanced coupling methods to further enhance bandwidth density and reduce thermal issues [34][44] - It also addresses the challenges of deploying CPO technology, including ecosystem disruption, operational complexity, and reliability validation [39][40] Conclusion - The successful deployment of CPO switches is seen as a critical step for the industry, paving the way for broader adoption of photonic technologies in various applications [50]