Core Viewpoint - The company is focusing on the semiconductor industry, particularly in the field of chip packaging and testing equipment, and is committed to increasing R&D investment in this area [1] Group 1: Company Focus - The company's equipment in the semiconductor sector primarily includes advanced packaging and testing devices such as display driver chip COF flip chip machines, semiconductor flip chip machines, soft solder die bonding machines, eutectic die bonding machines, film laminating machines, and lead frame inspection machines [1] - The company is actively expanding its presence in advanced packaging processes and third-generation semiconductor-related equipment, addressing both market and technological aspects [1] Group 2: R&D and Business Development - The company plans to continuously increase its R&D investment in semiconductors to enhance its new business segment's industrial layout [1] - The goal is to promote the development of the company's semiconductor equipment business segment [1]

Group 1 - The core viewpoint of the article highlights that Dike Co., Ltd. (300842) announced on October 16 that Jiangsu Jingkai has a highly experienced technical management team [1] - Under full production capacity, the average gross margin for DRAM chip packaging business is between 20% and 30% [1] - The gross margin for testing services is around 50%, which is slightly higher than that of industry peers [1]