Core Viewpoint - The company has signed a strategic cooperation agreement for a 12-inch high-end analog integrated circuit chip manufacturing project with the Xiamen Municipal Government and the Haicang District Government, aiming to enhance its capabilities in the semiconductor industry [1][3] Investment and Financial Summary - The total planned investment for the project is 20 billion yuan, with a production capacity of 45,000 wafers per month, implemented in two phases [2] - Phase one involves an investment of 10 billion yuan, with 6.01 billion yuan as equity and 3.99 billion yuan as bank loans, aiming for a monthly production capacity of 20,000 wafers [2] - The company and Xiamen Silan Micro will contribute a total of 1.5 billion yuan to the project, while Xiamen Semiconductor and New Wing Technology will contribute 1.5 billion yuan and 2.1 billion yuan, respectively [2] Strategic Importance - The investment will provide financial support for the construction and operation of the 12-inch high-end analog integrated circuit chip manufacturing project, leveraging the company's integrated design and manufacturing model [3] - This initiative aligns with the company's long-term strategic planning and aims to enhance its core competitiveness in the high-end analog integrated circuit chip sector [3] - The project is positioned to capitalize on emerging industries such as new energy vehicles, computing servers, and robotics, promoting sustained growth in the company's main business [3]

智通财经APP讯，士兰微(600460.SH)公告，公司与厦门市人民政府、厦门市海沧区人民政府于2025年 10月18日在厦门市签署了《12英寸高端模拟集成电路芯片制造生产线项目战略合作协议》。同时，公司 拟与厦门半导体投资集团有限公司、厦门新翼科技实业有限公司共同向子公司士兰集华增资51亿元并签 署《12英寸高端模拟集成电路芯片制造生产线项目之投资合作协议》，其中公司和厦门士兰微合计出资 15亿元。 根据协议约定，各方合作在厦门市海沧区合资经营项目公司"厦门士兰集华微电子有限公司"("士兰集 华")，作为"12英寸高端模拟集成电路芯片制造生产线项目"的实施主体，建设一条12英寸集成电路芯片 制造生产线，产品定位为高端模拟集成电路芯片。 项目规划总投资200亿元，规划产能4.5万片/月，分两期实施。一期项目投资100亿元(其中：资本金60.1 亿元、占60.1%，银行贷款39.9亿元、占39.9%)建设主体厂房、配套库房、110KV变电站、动力站、废 水站、大宗气站等公用辅助设施以及部分工艺设备购置，建成后形成月产能2万片;二期项目规划投资 100亿元，在一期基础上通过购置工艺设备及配套实施，建成后新增月产能 ...